• Journal of the Korean Magnetics Society
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• v.12 no.6
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• pp.231-234
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• 2002

Magnetic properties are investigated for top- and bottom-type spin valves of Si/SiO$_2$/NiO(60nm)/Co(2.5nm)/Cu(1.95nm)/Co(4.5nm)/NOL(t nm; Nano Oxide layer). The MR ratios of the bottom-type spin valves with NOL are larger than those of the top-type spin valves. However, the enhancement of the former is lower than the latter. Both of spin-valves also showed almost constant Ap and smaller p. Enhanced MR ratios of spin valves with NOL result mainly from small values of with constant Ap which due to specular diffusive electron scattering at NOL(NiO)/metal interfaces.

• Korean Journal of Materials Research
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• v.22 no.4
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• pp.202-206
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• 2012

$CoSi_2$ was formed through annealing of atomic layer deposition Co thin films. Co ALD was carried out using bis(N,N'-diisopropylacetamidinato) cobalt ($Co(iPr-AMD)_2$) as a precursor and $NH_3$ as a reactant; this reaction produced a highly conformal Co film with low resistivity ($50\;{\mu}{\Omega}cm$). To prevent oxygen contamination, $ex-situ$ sputtered Ti and $in-situ$ ALD Ru were used as capping layers, and the silicide formation prepared by rapid thermal annealing (RTA) was used for comparison. Ru ALD was carried out with (Dimethylcyclopendienyl)(Ethylcyclopentadienyl) Ruthenium ((DMPD)(EtCp)Ru) and $O_2$ as a precursor and reactant, respectively; the resulting material has good conformality of as much as 90% in structure of high aspect ratio. X-ray diffraction showed that $CoSi_2$ was in a poly-crystalline state and formed at over $800^{\circ}C$ of annealing temperature for both cases. To investigate the as-deposited and annealed sample with each capping layer, high resolution scanning transmission electron microscopy (STEM) was employed with electron energy loss spectroscopy (EELS). After annealing, in the case of the Ti capping layer, $CoSi_2$ about 40 nm thick was formed while the $SiO_x$ interlayer, which is the native oxide, became thinner due to oxygen scavenging property of Ti. Although Si diffusion toward the outside occurred in the Ru capping layer case, and the Ru layer was not as good as the sputtered Ti layer, in terms of the lack of scavenging oxygen, the Ru layer prepared by the ALD process, with high conformality, acted as a capping layer, resulting in the prevention of oxidation and the formation of $CoSi_2$.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.08a
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• pp.227-227
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• 2012

본 연구에서는 RF스퍼터링법에 의하여 glass substrate에 In-Zn-Sn-O (IZTO)를 Zn 성분에 변화를 주면서 $350{\AA}$ 만큼 증착시키고, 1시간 동안 $350^{\circ}C$로 열처리 하였다. In:Zn:Sn의 성분 비율은 20:48:32 (IZTO1), 13:60:27 (IZTO2)이다. 박막의 전자적, 광학적 특성은 XPS (X-ray Photoelectron Spectroscopy), REELS(Reflection Electron Energy Loss Spectroscopy), UV-Spectrometer를 이용하여 연구하였고, 박막의 전기적 특성은 van der Pauw 법을 이용하여 측정하였다. XPS측정결과, IZTO박막은 In-O, Sn-O and Zn-O의 결합을 가진다. REELS를 이용해 Ep=1,500 eV에서의 밴드갭을 얻어보면, $350^{\circ}C$로 열처리 한 박막은 열처리를 하지 않은 것에 비해 밴드갭이 IZTO1는 3.36 eV에서 3.54 eV로, IZTO2는 3.15 eV에서 3.31 eV로 증가하였다. 반면에 Zn 함량이 증가할수록 밴드갭이 감소하는 것을 확인할 수 있었다. 이 값은 UV-Spectrometer를 이용한 광학적 밴드갭과 일치하였다. 또한 van der Pauw method를 이용한 전기적 특성 분석 결과, 열처리를 하기 전에 비하여 carrier concentration이 IZTO1는 $-4.4822{\times}10^{18}cm^{-3}$에서 $-2.714{\times}10^{19}cm^{-3}$로, IZTO2는 $-3.6931{\times}10^{17}cm^{-3}$에서 $-1.7679{\times}10^{19}cm^{-3}$로 증가하였다. 반면에 Resistivity는 IZTO1의 경우 $1.7122{\times}10^{-1}{\Omega}{\cdot}cm$에서 $5.5496{\times}10^{-3}{\Omega}{\cdot}cm$로, IZTO2는 $1.3290 {\Omega}{\cdot}cm$에서 $1.3395{\times}10^{-2}{\Omega}{\cdot}cm$로 감소하였다. 그리고 UV-Spectrometer를 이용한 광학적 특성을 측정해본 결과, 가시광선영역인 380~780 nm에서의 투과율이 83%이상으로 투명전자소자로의 응용이 가능하다는 것을 보여주었다.

• Journal of the Korean Institute of Telematics and Electronics T
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• v.36T no.1
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• pp.19-24
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• 1999

$In_2O_3$-based thick films for the ozone detection of ppb range have been investigated. The $In_2O_3$ sensing layer is quite sensitive to ozone, but the saturated stable sensitivity cannot be obtained at the ozone exposure of 100 ppb for 5 min. The addition of $Fe_2O_3$ into $In_2O_3$ indicates some improvement in response time and sensitivity, but it seems the improvement is not good enough for real applications. Firing of $In_2O_3$:$Fe_2O_3$ powder induces remarkable improvement in response and recovery, although the sensitivity decrease. The sensing layer fired at $1300^{\circ}C$ and operated $550^{\circ}C$ shows excellent properties of fast response time, saturated stable sensitivity and rapid recovery characteristics to 100 ppb ozone exposure for 5 min. Especially, it shows the reproducibility of the sensor signal for repeated measurements and the linearity between the ozone concentration and the sensor resistance. The preliminary results clearly demonstrated that the sensor can be successfully applied for the ozone detection of ppb range.

• JSTS:Journal of Semiconductor Technology and Science
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• v.16 no.2
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• pp.198-203
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• 2016

We investigate the effects of magnesium (Mg) suppressor layer on the electrical performances and stabilities of amorphous indium-zinc-tin-oxide (a-ITZO) thin-film transistors (TFTs). Compared to the ITZO TFT without a Mg suppressor layer, the ITZO:Mg TFT exhibits slightly smaller field-effect mobility and much reduced subthreshold slope. The ITZO:Mg TFT shows improved electrical stabilities compared to the ITZO TFT under both positive-bias and negative-bias-illumination stresses. From the X-ray photoelectron spectroscopy O1s spectra with fitted curves for ITZO and ITZO:Mg films, we observe that Mg doping contributes to an enhancement of the oxygen bond without oxygen vacancy and a reduction of the oxygen bonds with oxygen vacancies. This result shows that the Mg can be an effective suppressor in a-ITZO TFTs.

• Journal of the Microelectronics and Packaging Society
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• v.24 no.4
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• pp.47-52
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• 2017

Recently, a great attention has been paid to the mechanical behavior of ITO (Indium Tin Oxide) film, which is widely used in current smart devices due to its excellent electrical properties and transparency. In this study, the reliability of ITO thin films on flexible substrates was investigated using bending test and bending fatigue test. According to the relative position of ITO and substrate, the experiment was conducted on both outer and inner bending conditions. Inner bending condition exhibited superior electrical stability compared to outer bending test. The electrical resistance during outer bending fatigue test significantly increased compared to that in the inner bending fatigue. The crack nucleation and propagation differs according to the stress state and they have a great influence on the electrical resistance. The crack morphologies were observed by scanning electron microscopy.

• Proceedings of the Korean Vacuum Society Conference
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• 2015.08a
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• pp.160-160
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• 2015

InGaZnO (IGZO) thin-film transistors (TFTs) are very promising due to their potential use in high performance display backplane [1]. However, the stability of IGZO TFTs under the various stresses has been issued for the practical IGZO applications [2]. Up to now, many researchers have studied to understand the sub-gap density of states (DOS) as the root cause of instability [3]. Nomura et al. reported that these deep defects are located in the surface layer of the IGZO channel [4]. Also, Kim et al. reported that the interfacial traps can be affected by different RF-power during RF magnetron sputtering process [5]. It is well known that these trap states can influence on the performances and stabilities of IGZO TFTs. Nevertheless, it has not been reported how these defect states are created during conventional RF magnetron sputtering. In general, during conventional RF magnetron sputtering process, negative oxygen ions (NOI) can be generated by electron attachment in oxygen atom near target surface and accelerated up to few hundreds eV by self-bias of RF magnetron sputter; the high energy bombardment of NOIs generates bulk defects in oxide thin films [6-10] and can change the defect states of IGZO thin film. In this study, we have confirmed that the NOIs accelerated by the self-bias were one of the dominant causes of instability in IGZO TFTs when the channel layer was deposited by conventional RF magnetron sputtering system. Finally, we will introduce our novel technology named as Magnetic Field Shielded Sputtering (MFSS) process [9-10] to eliminate the NOI bombardment effects and present how much to be improved the instability of IGZO TFTs by this new deposition method.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.135-136
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• 2009

The etching characteristics of Zinc Oxide (ZnO) and etch selectivity of ZnO to $SiO_2$ in $BCl_3/Ar/Cl_2$ plasma were investigated. It was found that ZnO etch rate shows a non-monotonic behavior with increasing both Ar fraction in $BCl_3$ plasma, RF power, and gas pressure. The maximum ZnO etch rate of 53 nm/min was obtained for $BCl_3$(16 sccm)/Ar(4 sccm)/$Cl_2$(3 sccm) gas mixture. The chemical state of etched surfaces was investigated with X-ray photoelectron spectroscopy (XPS). From these data, the suggestions on the ZnO etch mechanism were made.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.104-104
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• 2009

Critical dimensions has rapidly shrunk to increase the degree of integration and to reduce the power consumption. However, it is accompanied with several problems like direct tunneling through the gate insulator layer and the low conductivity characteristic of poly-silicon. To cover these faults, the study of new materials is urgently needed. Recently, high dielectric materials like $Al_2O_3$, $ZrO_2$ and $HfO_2$ are being studied for equivalent oxide thickness (EOT). However, poly-silicon gate is not compatible with high-k materials for gate-insulator. To integrate high-k gate dielectric materials in nano-scale devices, metal gate electrodes are expected to be used in the future. Currently, metal gate electrode materials like TiN, TaN, and WN are being widely studied for next-generation nano-scale devices. The TaN gate electrode for metal/high-k gate stack is compatible with high-k materials. According to this trend, the study about dry etching technology of the TaN film is needed. In this study, we investigated the etch mechanism of the TaN thin film in an inductively coupled plasma (ICP) system with $O_2/BCl_3/Ar$ gas chemistry. The etch rates and selectivities of TaN thin films were investigated in terms of the gas mixing ratio, the RF power, the DC-bias voltage, and the process pressure. The characteristics of the plasma were estimated using optical emission spectroscopy (OES). The surface reactions after etching were investigated using X-ray photoelectron spectroscopy (XPS) and auger electron spectroscopy (AES).

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2009.06a
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• pp.487-487
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• 2009

One of the critical consumables in chemical mechanical polishing (CMP) is a specialized solution or slurry, which typically contains both abrasives and chemicals acting together to planarize films. In single abrasive slurry (SAS), the solid phase consists of only one type of abrasive particle. On the other hand, mixed abrasive slurry (MAS) consists of a mixture of at least two types of abrasive particles. In this paper, we have studied the CMP characteristics of mixed abrasive slurry (MAS) retreated by adding of $CeO_2$ abrasives within 1:10 diluted silica slurry (DSS). The slurry designed for optimal performance should produce reasonable removal rates, acceptable polishing selectivity with respect to the underlying layer, low surface defects after polishing, and good slurry stability. The modified abrasives in MAS are evaluated with respect to their particle size distribution, surface morphology, and CMP performances such as removal rate and non-uniformity. As an experimental result, we obtained the comparable slurry characteristics compared with original silica slurry in the viewpoint of high removal rate and low non-uniformity.