• Tribology and Lubricants
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• 제35권5호
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• pp.274-285
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• 2019

Chemical mechanical polishing (CMP), which is a material removal process involving chemical surface reactions and mechanical abrasive action, is an essential manufacturing process for obtaining high-quality semiconductor surfaces with ultrahigh precision features. Recent rapid growth in the industries of digital devices and semiconductors has accelerated the demands for processing of various substrate and film materials. In addition, to solve many issues and challenges related to high integration such as micro-defects, non-uniformity, and post-process cleaning, it has become increasingly necessary to approach and understand the processing mechanisms for various substrate materials and abrasive particle behaviors from a tribological point of view. Based on these backgrounds, we review recent CMP R&D trends in this study. We examine experimental and analytical studies with a focus on substrate materials and abrasive particles. For the reduction of micro-scratch generation, understanding the correlation between friction and the generation mechanism by abrasive particle behaviors is critical. Furthermore, the contact stiffness at the wafer-particle (slurry)-pad interface should be carefully considered. Regarding substrate materials, recent research trends and technologies have been introduced that focus on sapphire (${\alpha}$-alumina, $Al_2O_3$), silicon carbide (SiC), and gallium nitride (GaN), which are used for organic light emitting devices. High-speed processing technology that does not generate surface defects should be developed for low-cost production of various substrates. For this purpose, effective methods for reducing and removing surface residues and deformed layers should be explored through tribological approaches. Finally, we present future challenges and issues related to the CMP process from a tribological perspective.

• 센서학회지
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• 제30권4호
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• pp.191-195
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• 2021

Pure ZnFe₂O₄ and Fe₂O₃-ZnFe₂O₄ hetero-composite spheres were prepared by ultrasonic spray pyrolysis of a solution containing Zn- and Fe-nitrates. Additionally, the sensing characteristics of these spheres in the presence of 5 ppm ethanol, benzene, p-xylene, toluene, and CO (within the temperature range of 275-350 ℃) were investigated. The Fe₂O₃-ZnFe₂O₄ hetero-composite sensor with a cation ratio of [Zn]:[Fe]=1:3 exhibited a high response (resistance ratio = 140.2) and selectivity (response to p-xylene/response to ethanol = 3.4) to 5 ppm p-xylene at 300 ℃, whereas the pure ZnFe₂O₄ sensor showed a comparatively lower gas response and selectivity. The reasons for the superior response and selectivity to p-xylene in Fe₂O₃-ZnFe₂O₄ hetero-composite sensor were discussed in relation to the electronic sensitization due to charge transfer at Fe₂O₃-ZnFe₂O₄ interface and Fe₂O₃-induced catalytic promotion of gas sensing reaction. The sensor can be used to monitor harmful volatile organic compounds and indoor air pollutants.

• 유기물자원화
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• 제31권1호
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• pp.5-14
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• 2023

연구에서는 실리카/티타니아 코어/쉘(STCS) 물질을 기반으로 환원 및 에칭을 통해 근적외선 반사율을 향상시킬 수 있는 라이다 반사형 중공구조 검은색(B-HST) 물질을 제조하였다. 또한, 에칭 폐액을 수거 및 재활용하여 합성한 실리카(e-SiO₂) 물질을 반도체 에폭시 몰딩 컴파운드용(EMC) 필러 소재로서 응용하였다. 상세히는, 연속적인 졸-겔법, 환원법 및 초음파법을 통해 제조한 B-HST 물질은 높은 NIR 반사율(31.1%)과 실제 검은색 페인트와 유사한 명도(L^*=13.2)를 나타내었으며, 이를 통해 성공적으로 라이다에 인식될 수 있는 소재가 제조되었음을 확인하였다. 추가적으로, B-HST 물질의 합성 과정에서 코어 실리카를 에칭하여 추출한 실라놀 전구체를 포함하는 에칭 폐액을 수거한 뒤, 졸-겔법을 통해 균일한 필러용 실리카로 합성하였으며, 에폭시 고분자 및 카본블랙과의 혼합을 통해 반도체 패키지용 소재인 EMC로 제조하였다. 실험으로 제조된 EMC는 상용화된 EMC 제품과 유사한 물리적-화학적 특성을 나타냄을 확인할 수 있었다. 본 연구 결과를 통해 물질의 합성과 효과적인 재활용법의 설계를 통하여 4차 산업시대에 부합하는 고부가 가치 소재들인 자율주행차 차량용 검은색 물질과 반도체용 EMC 물질들을 성공적으로 제조하고 미래 산업에서의 응용 가능성에 대해 제시하였다.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.31-37
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• 2017

최근, 유연하며 몸에 부착 가능한 소자들에 대한 관심이 늘어나고 있다. 이런 관심을 뒷받침 하여 이와 관련된 다양한 연구들이 진행되고 있는데, 기존 딱딱한 성질을 가진 소자에 사용되던 무기물 기반의 재료의 경우 유연 소자로 만들기에 여러 가지 제약이 있어 유연하게 제작할 수 있는 유기물 반도체나 탄소 나노튜브 필름 등을 이용한 소자들이 주로 연구되고 개발되어 왔다. 하지만 이런 재료들을 이용한 소자의 경우 유기물 분자와 분자 사이 또는 탄소 나노튜브와 나노튜브 사이에서 전하들이 산란되는 등 재료 자체의 한계로 인해 기존의 재료를 사용한 소자들보다 전기적 성능이 떨어지는 단점을 가지고 있다. 이런 단점들을 해결하기 위하여 이 연구에서는 수직 정렬된 반도체 결정 어레이를 투명 유연한 폴리머와 결합하는 방법을 이용, 고품질 나노/마이크로 반도체 결정을 유연한 기판으로 전사 시킬 수 있는 방법을 제시한다. 위와 같은 구조는 재료에 가해지는 힘을 완화 시켜줄 수 있으며, 이로 인해 큰 변형에도 재료의 손상이 없는 소자 제작이 가능하다. 이런 구조를 구현하기 위해 위치 및 크기가 정교하게 제어된 ZnO 나노막대 단결정을 저온에서 용액공정을 통하여 합성시킨다. 이후 성장시킨 ZnO 단결정 어레이와 polydimethylsiloxane (PDMS) 폴리머를 결합시킨 후 단단한 기판에서 기계적으로 박리시켜 ZnO/폴리머 복합체를 분리해 낸다. 추가적으로 전사된 ZnO의 결정성을 확인하기 위하여 photoluminescent 분석을 진행하였으며, ZnO/폴리머 복합체를 이용한 외부 힘에 반응하는 압력 센서를 제작하였다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2009년도 하계학술대회 논문집
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• pp.151-151
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• 2009

Recently, there has been increasing interest in amorphous oxide semiconductors to find alternative materials for an amorphous silicon or organic semiconductor layer as a channel in thin film transistors(TFTs) for transparent electronic devices owing to their high mobility and low photo-sensitivity. The fabriction of amorphous oxide-based TFTs at room temperature on plastic substrates is a key technology to realize transparent flexible electronics. Amorphous oxides allows for controllable conductivity, which permits it to be used both as a transparent semiconductor or conductor, and so to be used both as active and source/drain layers in TFTs. One of the materials that is being responsible for this revolution in the electronics is indium-zinc-tin oxide(IZTO). Since this is relatively new material, it is important to study the properties of room-temperature deposited IZTO thin films and exploration in a possible integration of the material in flexible TFT devices. In this research, we deposited IZTO thin films on polyethylene naphthalate substrate at room temperature by using magnetron sputtering system and investigated their properties. Furthermore, we revealed the fabrication and characteristics of top-gate-type transparent TFTs with IZTO layers, seen in Fig. 1. The experimental results show that by varying the oxygen flow rate during deposition, it can be prepared the IZTO thin films of two-types; One a conductive film that exhibits a resistivity of $2\times10^{-4}$ ohm${\cdot}$cm; the other, semiconductor film with a resistivity of 9 ohm${\cdot}$cm. The TFT devices with IZTO layers are optically transparent in visible region and operate in enhancement mode. The threshold voltage, field effect mobility, on-off current ratio, and sub-threshold slope of the TFT are -0.5 V, $7.2\;cm^2/Vs$, $\sim10^7$ and 0.2 V/decade, respectively. These results will contribute to applications of select TFT to transparent flexible electronics.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.293-293
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• 2014

Over last decade InGaN alloy structures have become the one of the most promising materials among the numerous compound semiconductors for high efficiency light sources because of their direct band-gap and a wide spectral region (ultraviolet to infrared). The primary cause for the high quantum efficiency of the InGaN alloy in spite of high threading dislocation density caused by lattice misfit between GaN and sapphire substrate and severe built-in electric field of a few MV/cm due to the spontaneous and piezoelectric polarizations is generally known as the strong exciton localization trapped by lattice-parameter-scale In-N clusters in the random InGaN alloy. Nonetheless, violet-emitting (390 nm) conventional low-In-content InGaN/GaN multi-quantum wells (MQWs) show the degradation in internal quantum efficiency compared to blue-emitting (450 nm) MQWs owing higher In-content due to the less localization of carrier and the smaller band offset. We expected that an improvement of internal quantum efficiency in the violet region can be achieved by replacing the conventional low-In-content InGaN/GaN MQWs with ultra-thin, high-In-content (UTHI) InGaN/GaN MQWs because of better localization of carriers and smaller quantum-confined Stark effect (QCSE). We successfully obtain the UTHI InGaN/GaN MQWs grown via employing the GI technique by using the metal-organic chemical vapor deposition. In this work, 1 the optical and structural properties of the violet-light-emitting UTHI InGaN/GaN MQWs grown by employing the GI technique in comparison with conventional low-In-content InGaN/GaN MQWs were investigated. Stronger localization of carriers and smaller QCSE were observed in UTHI MQWs as a result of enlarged potential fluctuation and thinner QW thickness compared to those in conventional low-In-content MQWs. We hope that these strong carrier localization and reduced QCSE can turn the UTHI InGaN/GaN MQWs into an attractive candidate for high efficient violet emitter. Detailed structural and optical characteristics of UTHI InGaN/GaN MQWs compared to the conventional InGaN/GaN MQWs will be given.

• 한국산업보건학회지
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• 제25권2호
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• pp.202-210
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• 2015

Objectives: The purpose of this study was to examine clean room(C/R) structure, air conditioning and contamination control systems and to provide basic information for identifying a correlation between the semiconductor work environment and workers' disease. Methods: This study was conducted at 200 mm and 300 mm semiconductor wafer fabrication facilities. The C/R structure and air conditioning method were investigated using basic engineering data from documentation for C/R construction. Furthermore, contamination parameters such as airborne particles, temperature, humidity, acids, ammonia, organic compounds, and vibration in the C/R were based on the International Technology Roadmap for Semiconductors(ITRS). The properties of contamination control systems and the current status of monitoring of various contaminants in the C/R were investigated. Results: 200 mm and 300 mm wafer fabrication facilities were divided into fab(C/R) and sub fab(Plenum), and fab, clean sub fab and facility sub fab, respectively. Fresh air(FA) is supplied in the plenum or clean sub fab by the outdoor air handling unit system which purifies outdoor air. FA supply or contaminated indoor air ventilation rates in the 200 mm and 300 mm wafer fabrication facilities are approximately 10-25%. Furthermore, semiconductor clean rooms strictly controlled airborne particles(${\leq}1,000{\sharp}/ft^3$), temperature($23{\pm}0.5^{\circ}C$), humidity($45{\pm}5%$), air velocity(0.4 m/s), air change(60-80 cycles/hr), vibration(${\leq}1cm/s^2$), and differential pressure(atmospheric pressure$+1.0-2.5mmH_2O$) through air handling and contamination control systems. In addition, acids, alkali and ozone are managed at less than internal criteria by chemical filters. Conclusions: Semiconductor clean rooms can be a pleasant environment for workers as well as semiconductor devices. However, based on the precautionary principle, it may be necessary to continuously improve semiconductor processes and the work environment.

• 한국재료학회:학술대회논문집
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• 한국재료학회 2012년도 춘계학술발표대회
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• pp.65-65
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• 2012

Copper zinc tin sulfide ($Cu_2ZnSnS_4$, CZTS) is a very promising material as a low cost absorber alternative to other chalcopyrite-type semiconductors based on Ga or In because of the abundant and economical elements. In addition, CZTS has a band-gap energy of 1.4~1.5eV and large absorption coefficient over ${\sim}10^4cm^{-1}$, which is similar to those of $Cu(In,Ga)Se_2$(CIGS) regarded as one of the most successful absorber materials for high efficient solar cell. Most previous works on the fabrication of CZTS thin films were based on the vacuum deposition such as thermal evaporation and RF magnetron sputtering. Although the vacuum deposition has been widely adopted, it is quite expensive and complicated. In this regard, the solution processes such as sol-gel method, nanocrystal dispersion and hybrid slurry method have been developed for easy and cost-effective fabrication of CZTS film. Among these methods, the hybrid slurry method is favorable to make high crystalline and dense absorber layer. However, this method has the demerit using the toxic and explosive hydrazine solvent, which has severe limitation for common use. With these considerations, it is highly desirable to develop a robust, easily scalable and relatively safe solution-based process for the fabrication of a high quality CZTS absorber layer. Here, we demonstrate the fabrication of a high quality CZTS absorber layer with a thickness of 1.5~2.0 ${\mu}m$ and micrometer-scaled grains using two different non-vacuum approaches. The first solution-processing approach includes air-stable non-toxic solvent-based inks in which the commercially available precursor nanoparticles are dispersed in ethanol. Our readily achievable air-stable precursor ink, without the involvement of complex particle synthesis, high toxic solvents, or organic additives, facilitates a convenient method to fabricate a high quality CZTS absorber layer with uniform surface composition and across the film depth when annealed at $530^{\circ}C$. The conversion efficiency and fill factor for the non-toxic ink based solar cells are 5.14% and 52.8%, respectively. The other method is based on the nanocrystal dispersions that are a key ingredient in the deposition of thermally annealed absorber layers. We report a facile synthetic method to produce phase-pure CZTS nanocrystals capped with less toxic and more easily removable ligands. The resulting CZTS nanoparticle dispersion enables us to fabricate uniform, crack-free absorber layer onto Mo-coated soda-lime glass at $500^{\circ}C$, which exhibits a robust and reproducible photovoltaic response. Our simple and less-toxic approach for the fabrication of CZTS layer, reported here, will be the first step in realizing the low-cost solution-processed CZTS solar cell with high efficiency.

• 멤브레인
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• 제25권6호
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• pp.530-537
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• 2015

태양광 발전시스템은 태양복사에너지를 반도체의 광전효과를 이용하여 전기에너지로 직접 전환시키는 에너지변환 시스템이다. 태양전지의 내구성과 에너지변환율에 영향을 미치는 핵심소재로는 다층형 필름구조를 갖는 백시트를 들 수 있다. 대표적인 상용 백시트는 고내구성 poly(vinyl fluoride) (PVF) 필름이 중심축에 위치하고 가격저감을 위해 도입된 poly(ethylene terephthalate) (PET) 필름이 그 양쪽에 접합된 삼층구조로 구성된다. 하지만, PVF 필름의 높은 가격은 저렴한 고내구성 백시트를 요구하는 시장상황을 반영하기 어렵게 한다. 이를 위한 해결책으로는 PVF 필름을 결정성 PET 필름으로 대체한 탄화수소계 백시트가 될 수 있다. 하지만, PET 필름의 본질적인 가수분해에 대한 취약성으로 인해, 추가적인 수분에 대한 배리어성 부여는 필수적이다. 이를 위해 본 연구에서는 소수성 실리카 나노입자 분산기술을 활용한 수분차단성 폴리우레탄 접착제를 개발코자 하였다. 개발된 접착제는 내부에 위치한 PET 필름으로의 수분침투를 약화시켜, 가수분해속도를 지연시킬 것이라 기대되었다. 본 개념의 효용성을 확인하기 위해, 표준화된 온습도조건에 노출된 이후의 일반접착제와 수분차단성 접착제가 도입된 백시트의 기계적 강도 및 시간당 태양전지성능 변화가 비교평가되었다.

• 청정기술
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• 제11권3호
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• pp.123-128
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• 2005

$TiO_2$는 금속 산화물의 일종으로서 자체가 가지고 있는 물리화학적 안정성, 무독성, 탁월한 유기물의 산화분해력 등으로 인해 저농도의 환경 유해물질 정화 분야로 응용이 활발히 연구되고 있는 반도체 물질이다. 그러나 $TiO_2$는 자외선 영역대(${\lambda}$ < 387 nm, 태양광의 2.7%가 UV)의 빛을 통해서 활성을 나타내고, 여기된 전자의 빠른 전자-정공 재결합속도로 인해 광 효율이 저하되는 단점을 갖는다. 따라서 광 감응 파장대를 넓히고 재결합속도를 길게 함으로써 광효율을 높이고, 광촉매 활성을 증대하는 방향으로 연구의 초점이 모아지고 있는 실정이다. 본 연구에서는 $TiO_2$ 광촉매의 광 감응 파장대를 가시광선 영역으로 확대함과 동시에 여기된 전자와 정공의 재결합시간을 연장하기 위하여 백금(Pt)이 광침적(photodeposition)된 탄소(C) 도핑 $TiO_2$를 제조하였다. 제조한 $Pt-C-TiO_2$의 특성은 전자투과현미경(Transmission Electron Microscopic; TEM), 질소흡탈착법(Brunauer-Emmett-Teller method; BET), X-ray 회절 분석법(X-ray Diffractometer; XRD), 분광 산란 광도계(UV-visible diffuse reflectance spectroscopy; UV-Vis DRS), X-ray 광전자 광도계(X-ray Photoelectron Spectroscopy; XPS)를 통하여 살펴보았다. $Pt-C-TiO_2$의 광촉매 활성을 검증하기 위하여 아조 계열의 붉은색 염료인 Acid Red 44 ($C_{10}H_7N=NC_{10}H_3(SO_3Na)_2OH$)의 광분해 실험을 수행하였다. 광원은 Xe arc 램프(300 W, Oriel)를 사용하였으며 420 nm 이하 제거 필터를 사용하여 가시광 영역대의 빛만을 조사되도록 하였다. 그 결과, 제조한 $Pt-C-TiO_2$는 가시광선 하에서 사용제품과 비교하여 월등히 뛰어난 분해력을 보이며 $C-TiO_2$의 활성을 한 층 더 향상시킴을 확인하였다. 이는 무한 에너지 자원인 태양광을 이용한 염료 폐수 정화 시스템 응용으로의 유용한 결과라 할 수 있겠다.