• Proceedings of the Materials Research Society of Korea Conference
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• 2010.05a
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• pp.48.1-48.1
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• 2010

Cu has been used for metallic interconnects in ULSI applications because of its lower resistivity according to the scaling down of semiconductor devices. The resistivity of Cu lines will affect the RC delay and will limit signal propagation in integrated circuits. In this study, we investigated the characteristics of electroplated Cu films according to the variation of concentration of organic additives. The plating electrolyte composed of $CuSO_4{\cdot}5H_2O$, $H_2SO_4$ and HCl, was fixed. The sheet resistance was measured with a four-point probe and the material properties were investigated with XRD (X-ray Diffraction), AFM (Atomic Force Microscope), FE-SEM (Field Emission Scanning Electron Microscope) and XPS (X-ray Photoelectron Spectroscopy). From these experimental results, we found that the organic additives play an important role in formation of Cu film with lower resistivity by EPD.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2001.05c
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• pp.88-91
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• 2001

The mechanical properties and surface luminous intensities of copper foil have been studied with variation of the amount of additives into the electrolyte. Especially, organic compound of HEC was added from 0.1 to 10ppm for the propose of increasing the mechanical property and the surface state. The total thickness of electrodeposited copper foil was decreased with increasing the amount of organic compounds. There was not so much significant effect of the current density. It has been observed that mechanical property and surface luminous intensity increase with increasing concentration of organic compounds.

• Macromolecular Research
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• v.17 no.1
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• pp.14-18
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• 2009

The acceleration effect of various organic acids, such as methanesulfonic acid (MSA), ethanesulfonic acid (ESA), 4,4'-sulfonyldibenzoic acid (SDA), diphenylacetic acid (DPAA), and $\rho$-toluenesulfonic acid (TSA), on the rate of styrene bulk polymerization with 2,2,6,6-tetramethylpiperidinyloxy (TEMPO) and benzoyl peroxide (BPO) was investigated. The addition of organic acids significantly accelerated the rate. Among these organic acids, DPAA showed an efficient rate-accelerating effect with living nature of polymerization. When DPAA was used as a rate-accelerating additive for TEMPO-mediated living free radical polymerization (LFRP), the rate of polymerization was dramatically enhanced, the linearity of reaction kinetics was successfully maintained, and the polydispersity was effectively controlled.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.545-545
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• 2008

Poly-Si is an essential material for floating gate in NAND Flash memory. To fabricate this material within region of floating gate, chemical mechanical polishing (CMP) is commonly used process for manufacturing NAND flash memory. We use colloidal silica abrasive with alkaline agent, polymeric additive and organic surfactant to obtain high Poly-Si to SiO2 film selectivity and reduce surface defect in Poly-Si CMP. We already studied about the effects of alkaline agent and polymeric additive. But the effect of organic surfactant in Poly-Si CMP is not clearly defined. So we will examine the function of organic surfactant in Poly-Si CMP with concentration separation test. We expect that surface roughness will be improved with the addition of organic surfactant as the case of wafering CMP. Poly-Si wafer are deposited by low pressure chemical vapor deposition (LPCVD) and oxide film are prepared by the method of plasma-enhanced tetra ethyl ortho silicate (PETEOS). The polishing test will be performed by a Strasbaugh 6EC polisher with an IC1000/Suba IV stacked pad and the pad will be conditioned by ex situ diamond disk. And the thickness difference of wafer between before and after polishing test will be measured by Ellipsometer and Nanospec. The roughness of Poly-Si film will be analyzed by atomic force microscope.

• Proceedings of the Korean Magnestics Society Conference
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• 2007.05a
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• pp.140.2-140.2
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• 2007

• Journal of the Korean Ceramic Society
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• v.35 no.7
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• pp.726-732
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• 1998

• Korean Chemical Engineering Research
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• v.57 no.6
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• pp.847-852
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• 2019

In this study, the effect of additives on the performance of aqueous organic redox flow battery (AORFB) using quinoxaline and ferrocyanide as active materials in alkaline supporting electrolyte is investigated. Quinoxaline shows the lowest redox potential (-0.97 V) in KOH supporting electrolyte, while when quinoxaline and ferrocyanide are used as the target active materials, the cell voltage of this redox combination is 1.3 V. When the single cell tests of AORFBs using 0.1 M active materials in 1 M KCl supporting electrolyte and Nafion 117 membrane are implemented, it does not work properly because of the side reaction of quinoxaline. To reduce or prevent the side reaction of quinoxaline, the two types of additives are considered. They are the potassium sulfate as electrophile additive and potassium iodide as nucleophilie additive. Of them, when the single cell tests of AORFBs using potassium iodide as additive dissolved in quinoxaline solution are performed, the capacity loss rate is reduced to $0.21Ah{\cdot}L^{-1}per\;cycle$ and it is better than that of the single cell test of AORFB operated without additive ($0.29Ah{\cdot}L^{-1}per\;cycle$).

• Journal of the Korean Ceramic Society
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• v.52 no.6
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• pp.479-482
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• 2015

The flue gas desulfurization (FGD) process is one of the most effective methods to reduce the amount of $SO_2$ gas (up to 90%) generated by the use of fossil fuel. Limestone is usually used as a desulfurizing agent in the wet-type FGD process; however, the limestone reserves of domestic mines have become exhausted. In this study, limestone sludge produced from the steel works process is used as a desulfurizing agent. Seven different types of additives are also used to improve the efficiency of the desulfurization process. As a result, alkaline additive is identified as the least effective additive, while certain types of organic acids show higher efficiency. It is also observed that the amount of FGD gypsum, which is a by-product of the FGD process, increases with the used of some of those additives.

• Corrosion Science and Technology
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• v.10 no.4
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• pp.143-150
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• 2011

Copper electroplating has been applied to various fields such as decorative plating and through-hole plating. Technical realization of high strength copper preplating for wear-resistant tools and molds in addition to these applications is the aim of this work. Brighters and levelers, such as MPSA, Gelatin, Thiourea, PEG and JGB, were added in copper sulfate electrolyte, and the effects of these organic additives on the hardness were evaluated. All additives in this work were effective in increasing the hardness of copper electrodeposits. Thiourea increased the hardness up to 350 VHN, and was the most effective accelarator in sulfate electrolyte. It was shown from the X-ray diffraction analysis that preferred orientation changed from (200) to (111) with increasing concentration of organic additives. Crystallite size decreased with increasing concentration of additive. Hardness was increased with decreasing crystallite size, and this result is consistent with Hall-Petch relationship, and it was apparent that the hardening of copper electrodeposits results from the grain refining effect.

• Journal of the Korean institute of surface engineering
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• v.39 no.1
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• pp.13-17
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• 2006

The effects of an organic additive, naphthalene trisulfonic acid (NTSA), contained in the nickel sulfamate bath on the surface properties of the electrodeposited nickel layer were investigated through electrochemical technique, x-ray diffraction analysis, and microscopic observation. The addition of NTSA facilitated the oxidation process of electrodeposited nickel layer during anodic scan and also increased the hardness and internal stress of the nickel film as the applied current density became higher. It seems that NTSA modulated the deposit structure during electrodeposition and so induced higher distribution of (110) orientation with respect to (200). With the increase of the NTSA in the bath, nickel layer was formed in small grain size, which resulted in enhanced surface evenness and brightness.