Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference (한국전기전자재료학회:학술대회논문집)
- 2001.05c
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- Pages.88-91
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- 2001
Properties of electrodeposited copper foil by organic compounds
유기물 첨가에 의한 전해동박의 특성
- Lee, K.W. (Wonkwang University) ;
- No, S.S. (Wonkwang University) ;
- Choi, C.H. (LG Cable Co.) ;
- Kim, S.K. (LG Cable Co.) ;
- Son, S.H. (LG Cable Co.) ;
- Moon, H.K. (LG Cable Co.) ;
- Park, D.H. (Wonkwang University)
- 이관우 (원광대학교) ;
- 노승수 (원광대학교) ;
- 최창희 (LG전선(주)) ;
- 김상겸 (LG전선(주)) ;
- 손성호 (LG전선(주)) ;
- 문홍기 (LG전선(주)) ;
- 박대희 (원광대학교)
- Published : 2001.05.11
Abstract
The mechanical properties and surface luminous intensities of copper foil have been studied with variation of the amount of additives into the electrolyte. Especially, organic compound of HEC was added from 0.1 to 10ppm for the propose of increasing the mechanical property and the surface state. The total thickness of electrodeposited copper foil was decreased with increasing the amount of organic compounds. There was not so much significant effect of the current density. It has been observed that mechanical property and surface luminous intensity increase with increasing concentration of organic compounds.