• Tribology and Lubricants
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• 제32권2호
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• pp.61-66
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• 2016

Total thickness variation (TTV), BOW, and surface roughness are essential characteristics for high quality sapphire substrates. Many researchers have attempted to increase removal rate by controlling the key process parameters like pressure and velocity owing to the high cost of consumables in sapphire chemical mechanical polishing (CMP). In case of the pressure approach, increased pressure owing to higher deviation of pressure over the wafer leads to significant degradation of the TTV. In this study, the authors focused on reducing TTV under the high-pressure conditions. When the production equipment polishes multiple wafers attached on a carrier, higher loads seem to be concentrated around the leading edge of the head; this occurs because of frictional force generated by the combination of table rotation and the height of the gimbal of the polishing head. We believe the skewed pressure distribution during polishing to be the main reason of within-wafer non-uniformity (WIWNU). The insertion of a hub ring between the polishing head and substrate carrier helped reduce the pressure deviation. Adjusting the location of the hub ring enables tuning of the pressure distribution. The results indicated that the position of the hub ring strongly affected the removal profile, which confirmed that the position of the hub ring changes the pressure distribution. Furthermore, we analyzed the deformation of the head via finite element method (FEM) to verify the pressure non-uniformity over the contact area Based on experiment and FEM results, we determined the optimal position of hub ring for achieving uniform polishing of the substrate.

• 한국결정성장학회지
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• 제26권4호
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• pp.131-134
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• 2016

Czochralski 법으로 성장한 RE : YAG ($RE=Nd^{3+}\;,Er^{3+}\;,Yb^{3+}$) 단결정의 표면 결함을 측정하는 chemical polishing 및 etching 조건에 대하여 조사하였다. 최적의 chemical polishing 조건은 시편을 수직 방향으로 고정하고 85 % $H_3PO_4$ 용액에서 $330^{\circ}C$, 30분 동안 진행한 것이었다. 또한 최적의 chemical etching 조건은 85 % $H_3PO_4$ 용액에서 $260^{\circ}C$, 1시간 동안 진행한 것이었고, (111) 면에 $70~80{\mu}m$ 크기의 삼각형 etch pit들이 관찰되었다. 결함 밀도 분석 결과, Nd(1 %) : YAG는 $1.9{\times}10^3$개/$cm^2$, Er(7.3 %) : YAG는 $4.3{\times}10^2$개/$cm^2$, Yb(15 %) : YAG는 $5.1{\times}10^2$개/$cm^2$로 측정되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.25-28
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• 2001

Recently, STI(Shallow Trench Isolation) process has attracted attention for high density of semiconductor device as a essential isolation technology. Without applying the conventional complex reverse moat process, CMP(Chemical Mechanical Polishing) has established the Process simplification. However, STI-CMP process have various defects such as nitride residue, torn oxide defect, damage of silicon active region, etc. To solve this problem, in this paper, we discussed to determine the control limit of process, which can entirely remove oxide on nitride from the moat area of high density as reducing the damage of moat area and minimizing dishing effect in the large field area. We, also, evaluated the reliability and reproducibility of STI-CMP process through the optimal process conditions.

• Journal of Electrochemical Science and Technology
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• 제11권4호
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• pp.346-351
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• 2020

The removal characteristics of copper (Cu) from electrochemical surface by voltage-activated reaction were reviewed to assess the applicability of electrochemical-mechanical polishing (ECMP) process in three types of electrolytes, such as HNO₃, KNO₃ and NaNO₃. Electrochemical surface conditions such as active, passive, transient and trans-passive states were monitored from its current-voltage (I-V) characteristic curves obtained by linear sweep voltammetry (LSV) method. In addition, the oxidation and reduction process of the Cu surface by repetitive input of positive and negative voltages were evaluated from the I-V curve obtained using the cyclic voltammetry (CV) method. Finally, the X-ray diffraction (XRD) patterns and energy dispersive spectroscopy (EDS) analyses were used to observe the structural surface states of a Cu electrode. The electrochemical analyses proposed in this study will help to accurately control the material removal rate (MRR) from the actual ECMP process because they are a good methodology for predicting optimal electrochemical process parameters such as current density, operating voltage, and operating time before performing the ECMP process.

• Corrosion Science and Technology
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• 제22권6호
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• pp.457-465
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• 2023

Irradiation-assisted stress corrosion cracking (IASCC) is one of the main degradation mechanisms of austenitic stainless steels, which are used as reactor internal materials. Slow strain rate testing (SSRT) has been widely applied to evaluate the IASCC initiation characteristics of proton-irradiated tensile specimens. Tensile specimens require low surface roughness for micro-crack observation, and electropolishing is the most important specimen pre-treatment process used for this. In this study, optimal electropolishing conditions were examined through analyzing results of polarization experiments and surface roughness measurements after electropolishing. Corrosion cell and electropolishing equipment were fabricated for polarization tests and electropolishing experiments using SSRT specimens. The experimental parameters were electropolishing time, current density, electrolyte temperature, and stirring speed. The optimal electropolishing conditions for SSRT tensile specimens made of type 316 stainless steel were evaluated as a polishing time of 180 seconds, a current density of 0.15 A/cm², an electrolyte temperature of 60 ℃, and a stirring speed of 200 RPM.

• 대한기계학회논문집A
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• 제36권3호
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• pp.259-264
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• 2012

비자성체의 자유곡면 자기연마 공정에서 자기력 세기의 향상은 매우 중요하다. 비자성체 자유곡면의 표면에 발생하는 자기력의 세기에 따라 자기연마 입자가 가지는 수직 절삭력이 변화하기 때문이다. 이러한 자기력 향상을 위하여 전자석 배열 테이블이 적용된 제 2세대 자기연마공정이 비자성체의 자유곡면 자기연마에 적용된다. 본 연구에서는 이러한 제 2세대 자기연마공정에서 전자석 배열 테이블에 발생하는 자기력 세기 향상을 위한 극성배열 방법을 제시하고 이를 알루미늄합금의 곡률 자기연마에 적용하였다. 그 결과 볼록 및 오목 형상에서 각각 S-N-S와 S-N-N-N-S 극성 배열에서 가장 높은 표면거칠기의 향상을 확인하였다. 또한 상승 가공경로에서 상대적으로 높은 표면거칠기 향상을 나타내었다.

• 한국CDE학회논문집
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• 제20권3호
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• pp.312-319
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• 2015

The grinding and furbishing process as the finishing process for molds include the works such as the grinding, buffing, lapping and polishing among others. A finishing tool unit is applied to this finishing process for the burr, lapping, polishing and others of molds. A finishing tool unit can carry out the flexible machining, depending on the machining allowance for objects to be cut on the basis of the instrumental driving mechanism which enables the up, down, left and right floating, which is applied in link with the dedicated cutters and robot machining systems. This study selected the shape to increase the rotatory force of an impeller when air is discharged during the driving of a finishing tool unit, and reflected it to the impeller designing. In addition, the study analyzed each flow velocity and pressure distribution per air pressurization value and finally analyzed the rotating torque to suggest the optimal conditions in designing impellers.

• 한국태양에너지학회 논문집
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• 제33권3호
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• pp.27-35
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• 2013

One of the most important factors that have a large influence on performance of the solar water heater system is performance of the solar collector, more detailedly, coating technology on the surface of the solar collector, which can provide high solar absorptance and low emittance. The core of the coating technology is to coat solar selective surfaces. In this study, various performance experiments are carried out using $Cr_2(SO_4)_3{\cdot}15H_2O$ coating technology. Here, IGBT(Insulated Gate Bipolar Transistor) of 5000A-15V was used as the surface processing rectifier which can stably output power and also can control voltage and current. The plating solution mainly contains black chrome$^{+3}$ concentration, H-y Conductivity, N-u Complex, NF Additive and NC-2 Wetter. Before applying the black chrome coating on the copper plate, optimal conditions are provided by using various preprocessing methods such as removal of fat, activation, electrolytic polishing, nickel strike, copper sulfate plating and bright neckel plating, and then the automatic continuous coating experiment are performed according to plating time and cathode current density. In the experiment, after the removal of fat, chemical polishing, nickel strike and activation processes as the preprocessing methods, the black chrome coating was performed in a plate solution temperature of $28^{\circ}C$ and a cathode current density of $18A/cm^2$ for 90 seconds. The thickness of chrome and nickel on the coated plate is $0.389{\mu}m$, $159{\mu}m$ respectively. As a result of the coating experiment, it showed the most excellent performance having a high solar absorptance of 98% and a low emittance of $5{\pm}1%$ when the black chrome surface had a thickness of $0.398{\mu}m$.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 춘계학술대회 논문집
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• pp.414-417
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• 2005

Single point diamond turning technique for optical crystals is studied in this paper. The main factors which are influential the machined surface quality are discovered and regularities of machining process are drawn. Optical crystals have found more and more important applications in the field of modern optics. Optical crystals are mostly brittle materials of poor machinability. The traditional machining method is polishing which has many shortcomings such as low production efficiency, poor ability to be automatically controlled and edge effect of the workpiece. The purpose of our research is to find the optimal machining conditions for ductile cutting of optical crystals and to apply the SPDT technique to the manufacturing of ultra precision optical components of brittle material(Ge). Many technical challenges are being tried for the large space infrared telescope, which is one of the major objectives of the National Strategic Technology Road Map (NSTRM).