• Korean Journal of Optics and Photonics
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• v.26 no.5
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• pp.261-264
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• 2015

In this paper we show that the photoresist-protective film of a printed circuit board (PCB) can be delaminated from the underlying photoresist layer by a single pulse of a nanosecond laser at 532 nm. After locally peeling the edge of the PCB with a laser beam of 9 mm size, Scotch tape was attached to the irradiated region to peel off the whole protective film. For a certain range of pulse energies the peeling probability was 100%, without leaving any damage. Since the use of a laser in initial delamination is noncontact and nondamaging, it may be more efficiently utilized in the PCB industry than the conventional knurling method based on mechanical pressing.

• 제어로봇시스템학회:학술대회논문집
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• 1997.10a
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• pp.1742-1745
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• 1997

We have developed a highly responsible probing system for inspection of electrical properties of assemble PCB$_{s}$ (printed circuit boards). However, as the duration of the impact occurring between a probe and a solder joint on PCB is very short, it is very difficult to control the harmful peak impact force and the slip motion of the probe to sufficient level only by its vorce feedback control with high gains. To overcome these disadvantages of the prototype, it needs ot obtain some information of the solder joint in advance before the contact. In addition, to guarantee the reliability of the probing task, the probing system is required to measure several points around the probale target point at high speed. There fore, to meet such requirements, we propose a new noncontaet sensor capable of detecting simultaneously position and normal vectors of the multiple points around the probable target point in real time. By using this information, we can prepare a control strategy for stable contact motion on impact. In this paper, we described measuring priniciple, design, and development of the sensor. The effectiveness of the proposed sensor is verified through a series of experiments.s.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.2
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• pp.106-113
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• 2002

Stencil is used normally as a mask for seeder pasting on pad of PCB. The objective of this study is to develop stencil cutting system and determine optimal conditions which make good-quality stencil by using a Nd:YAG laser. The effects of process parameters such as laser power, type of mask, gas pressure, cutting speed and pulse width old the cut edge quality were investigated. In order to analyse fille cut surface characteristics(roughness, kerf width, dross) optical microscopy, SEM photography and roughness test were used. As a result, the optimal conditions of process parameters were determined, and the practical feasibility of the proposed system is also examined by using a commercial Gerber file for PCB stencil manufacturing.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.1
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• pp.57-63
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• 2015

Recently, LED is widely used in the kinds of display devices or lighting. In this paper, we fabricated LED chamber light for naval vessels to replace to conventional chamber light using incandescent lamp. The LED package of chamber light was designed with luminous intensity of 5.5 cd, color temperature of $6,000{\pm}500K$, forward voltage of 3~3.2 V and input current of 60 mA. A LED module was composed of 36 LED packages and metal PCB. The VF and luminous intensity of LED package were getting down when temperature increased. The temperature of LED chamber light was measured by changing the number of LED package and applied current for one hour when an electric current flow. The heat transfer capability have been improved by using metal PCB. The power consumption of LED chamber light reduced by 86% compared to the conventional chamber light using incandescent lamp.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.27 no.1
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• pp.25-31
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• 2003

Airborne contaminant particles are intruded into optical disk drives(ODD) due to the flow caused by disk rotation and can be adhered to lens or disk surfaces, which causes decrease of laser power and increase of read/write errors. Such a phenomenon can be more serious as the space between the disk and the lens is reduced fur high-density storage devices. The purpose of this paper is to understand design parameters to reduce the particle intrusion into an ODD. Suggestions are made to prevent the particle intrusion that can decrease the stability of an ODD and also prevent the potential heat build-up problem. The sealing effect of drive and the forced injection of clean air (using HEPA filter) into the drive minimizes intrusion of the outside air and dusts in an ODD remarkably. Moreover it is proved by experiments that the installation of a heatproof pad to isolate heat generation part (PCB) from information read/write sections and the forced injection of dust-free air reduce the gas temperature inside the drive as well as the amount of particles intruded.

• Journal of the Microelectronics and Packaging Society
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• v.15 no.4
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• pp.77-86
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• 2008

The reliability of leaded and lead-free solders of BGA type packages on a printed circuit board was investigated by employing the standard drop test and 4-point bending test. Tested solder joints were examined by optical microscopy to identify associated failure mode. Three-dimensional finite element analysis(FEM) with ANSYS Workbench v.11 was carried out to understand the mechanical behavior of solder joints under the influence of bending or drop impact. The results of numerical analysis are in good agreement with those obtained by experiments. Packages in the center of the PCB experienced higher stress than those in the perimeter of the PCB. The solder joints located in the outermost comer of the package suffered from higher stress than those located in center region. In both drop and bending impact tests, the lead-free solder showed better performances than the leaded solders. The numerical analysis results indicated that stress and strain behavior of solder joint were dependent on various effective parameters.

• Korean Journal of Optics and Photonics
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• v.20 no.4
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• pp.223-229
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• 2009

This paper describes the development of a simulator which can numerically calculate an image to be acquired in a machine vision system for automated optical inspection. The simulator is based on a ray tracing technique and composed of three modules which are an illuminating system, a specimen and an imaging system. Kinds of model parameters for modules and their values are carefully chosen from the direct measurement and the observation of related phenomena. Finally, the validity of the simulator is evaluated by logical analysis and by comparison with measured images.

• Proceedings of the Korean Society for Noise and Vibration Engineering Conference
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• 2008.04a
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• pp.856-860
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• 2008

Wire-suspensions in the conventional actuators mechanically support the moving part and guarantee the accuracy of the actuator without tangential tilt actuation. However, such a suspension configuration has considerable stiffness in the tangential tilt direction with two additional wire beams for the tangential tilt. Thus, we performed a design sensitivity analysis for the wire-suspension stiffness of 4-axis actuator and controlled the main parameters such as distance among wire-suspensions and wire-suspension length to allow tangential tilt flexibility. The elasticity of frame PCB that supports the moving part by wire-suspensions was also exploited to improve the flexibility of wire-suspension in the tangential tilt direction. A novel suspension structure was devised by establishing eight wire-suspensions at both sides of the moving part for electrical connection to coils. The magnetic circuit according to the proposed 4-axis actuator using multi-polar magnet and coils was also suggested for the generation of electromagnetic forces in the focusing, tracking, radial and tangential tilt directions.

• Proceedings of the KIEE Conference
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• 2006.10a
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• pp.222-223
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• 2006

In this paper, we manufactured high flux LED module with Through Hole type. and we measured electrical, optical and thermal properties by driving type. LED module was composed with 8*8 arrangement form by using the glass epoxy PCB. Also, we measured the most suitable driving type with static voltage driving type and static current driving type. As a result, the LED Module of static voltage driving type showed high luminance characteristic than the static current driving type by suppling enough bias. However, the static current driving type showed more stable driving properties because of fast decreasing properties about brightness by increasing the surrounding temperature in the static voltage driving type. Also, due to Quantum confined Stark effect from piezoelectric field, the wavelength of bule peak shifted to long wavelength direction by increasing the surrounding temperature in the static voltage driving type.

• The Transactions of the Korean Institute of Electrical Engineers C
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• v.52 no.2
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• pp.98-104
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• 2003

This paper proposes the design of a multi-color lamp using high brightness RGB LEDs for color variation. Appropriate number of RGB LEDs is so chosen according to the color mixing theory that the overall LEDs represent a color temperature of 6500K. Also, the chosen RGB LEDs are suitably arranged by using an optical design program. The lamp has an internal controller circuit, so it can be directly connected to the existing incandescent lamp socket. It's main body is comprised of two PCB layers. The upper layer contains 44 LEDs and the lower one has a simple microcontroller-based PWM control circuit. The lamp has functions of both ON/OFF control and PWM control, and enables color variation of over 100,000 colors and of more than 10 patterns.