• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.1
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• pp.166-173
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• 2013

As the number of IPs and the communication volume among them have constantly increased, on-chip crossbar network is now the most widely-used on-chip communication backbone of contemporary SoCs. The on-chip crossbar network consists of multiple crossbars and the connections among the IPs and the crossbars. As the complexity of SoCs increases, it has also become more and more complex to determine the topology of the crossbar network. To tackle this problem, this paper proposes an on-chip crossbar network topology method for application-specific systems. The proposed method uses mixed integer linear programming to solve the topology synthesis problem, thus the global optimality is guaranteed. Unlike the previous MILP-based methods which represent the topology with adjacency matrixes of IPs and crossbar switches, the proposed method uses the communication edges among IPs as the basic element of the representation. The experimental results show that the proposed MILP formulation outperforms the previous one by improving the synthesis speed by 77.1 times on average, for 4 realistic benchmarks.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.37-41
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• 2014

One of the important developments in next generation electronic devices is the technology for power delivery and heat dissipation. In this study, the Cu-to-Cu flip chip bonding process was evaluated using the square ABL power bumps and circular I/O bumps. The difference in bump height after Cu electroplating followed by CMP process was about $0.3{\sim}0.5{\mu}m$ and the bump height after Cu electroplating only was about $1.1{\sim}1.4{\mu}m$. Also, the height of ABL bumps was higher than I/O bumps. The degree of Cu bump planarization and Cu bump height uniformity within a die affected significantly on the misalignment and bonding quality of Cu-to-Cu flip chip bonding process. To utilize Cu-to-Cu flip chip bonding with ABL bumps, both bump planarization and within-die bump height control are required.

• Journal of the Institute of Electronics Engineers of Korea TC
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• v.41 no.5
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• pp.19-25
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• 2004

In this paper, we propose optimal and suboptimal serial code acquisition schemes for chip-asynchronous direct-sequence spread-spectrum systems. The conventional serial code acquisition scheme is to compare each value of correlator outputs with a threshold individually. However, such a scheme is optimum only under the chip-synchronous assumption which is actually very difficult to be held prior to acquisition at the receiver because the signal-to-noise ratios before despreading are very low. In this paper, an optimal serial code acquisition scheme is derived based on the maximum-likelihood criterion under the more realistic and general chip-asynchronous environments. A suboptimal scheme, which is simpler but yields comparable performance to the optimal one, is also derived based on the criterion of local detection power Numerical results show that, under the chip-asynchronous environments, both the optimal and suboptimal serial code acquisition schemes outperform the conventional serial code acquisition scheme.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.13 no.1
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• pp.329-332
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• 2012

LEDs are using widely in a field of illumination, LCD LED backlight, mobile signals because they have several merits, such as low power consumption, long lifetime, high brightness, fast response, environment friendly. To achieve high performance LEDs, one needs to enhance output power, reduce operation voltage, and improve device reliability. In this paper, we have proposed that the optimum design and specialized process could improve the performance of LED chip. It was showed an output power of 7cd and input supplied voltage of 3.2V by the insertion technique of current blocking layer. In this paper, GaN-based LED chip which is built on the sapphire epi-wafer by selective MOCVD were designed and developed. After that, their performances were measured. It showed the output power of 7cd more than conventional GaN-based chip. It will be used the lighting source of a medical equipment and LCD LED TV with GaN-based LED chip.

• Proceedings of the KIEE Conference
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• 2002.11d
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• pp.197-199
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• 2002

The invention of VHDL(Very High Speed Integrated Circuit Hardware Description Language), Technical language of Hardware, is a kind of turning point in digital circuit designing, which is being more and more complicated and integrated. Because of its excellency in expression ability of hardware, VHDL is not only used in designing Hardware but also in simulation for verification, and in exchange and conservation, composition of the data of designs, and in many other ways. Especially, It is very important that VHDL is a Technical language of Hardware standardized by IEEE, intenational body with an authority. The biggest problem in modern circuit designing can be pointed out in two way. One is a problem how to process the rapidly being complicated circuit complexity. The other is minimizing the period of designing and manufacturing to survive in a cutthroat competition. To promote the use of VHDL, more than a simple use of simulation by VHDL, it is requested to use VHDL in composing logical circuit with chip manufacturing. And, by developing the quality of designing technique, it can contribute for development in domestic industry related to ASIC designing. In this paper in designing SMPS(Switching mode power supply), programming PWM by VHDL, it can print static voltage by the variable load, connect computer to chip with byteblaster, and download in Max(EPM7064SLCS4 - 5)chip of ALTER. To achieve this, it is supposed to use VHDL in modeling, simulating, compositing logic and product of the FPGA chip. Despite its limit in size and operating speed caused by the specific property of FPGA chip, it can be said that this method should be introduced more aggressively because of its prompt realization after designing.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2022.10a
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• pp.459-461
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• 2022

One of the big differences between Network-on-Chip (NoC) and the existing parallel processing system based on an off-chip network is that data packet routing is performed using a centralized control scheme. In such an environment, the best-effort packet routing problem becomes a real-time assignment problem in which data packet arriving time and processing time is the cost. In this paper, the Hungarian algorithm, a representative computational complexity reduction algorithm for the linear algebraic equation of the allocation problem, is implemented in the form of a hardware accelerator. As a result of logic synthesis using the TSMC 0.18um standard cell library, the area of the circuit designed through case analysis for the cost distribution is reduced by about 16% and the propagation delay of it is reduced by about 52%, compared to the circuit implementing the original operation sequence of the Hungarian algorithm.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2005.06a
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• pp.1206-1209
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• 2005

In recent, injection molding process for features in sub-micron scale is under active development as patterning nano-scale features, which can provide the master or stamp for molding, and becomes available around the world. Injection molding has been one of the most efficient processes for mass production of the plastic product, and this process is already applied to nano-technology products successfully such as optical storage media like DVD or BD which is a large area plastic thin substrate with nano-scale features on its surface. Bio chip for like DNA sequencing may be another application of this plastic substrate. The DNA can be sequenced using order of 100 nm pore structure when making the DNA flow through the pore structure. Agarose gel and silicon based chip have been used to sequence the DNA, but injection molded plastic chip may have benefit in terms of cost. This plastic DNA sequencing chip has plenty of pillars in order of 100 nm in diameter on the substrate. When the usual features in case of DVD or BD have very low aspect ratio, even less than 0.5, but the DNA chip will have relatively high aspect ratio of about 2. It is not easy to injection mold the large area thin substrate with sub-micron features on its surface due to the characteristics of the molding process and it becomes much more difficult when the aspect ratio of the features becomes high. We investigated the effect of the molding parameters for injection molding with high aspect ratio nano-scale features and injection molded some plastic DNA sequencing chips. We also fabricated PR masters and Ni stamps of the DNA chip to be used for molding

• Korean Chemical Engineering Research
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• v.44 no.5
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• pp.513-519
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• 2006

We developed two kinds of the microchip for application to electrophoresis based on both glass and quartz employing the MEMS fabrications. The poly-Si layer deposited onto the bonding interface apart from channel regions can play a role as the optical slit cutting off the stray light in order to concentrate the UV ray, from which it is possible to improve the signal-to-noise (S/N) ratio of the detection on a chip. In the glass chip, the deposited poly-Si layer had an important function of the etch mask and provided the bonding surface properly enabling the anodic bonding. The glass wafer including more impurities than quartz one results in the higher surface roughness of the channel wall, which affects subsequently on the microflow behavior of the sample solutions. In order to solve this problem, we prepared here the mixed etchant consisting HF and $NH_4F$ solutions, by which the surface roughness was reduced. Both the shape and the dimension of each channel were observed, and the electroosmotic flow velocities were measured as 0.5 mm/s for quartz and 0.36 mm/s for glass channel by implementing the microchip electrophoresis. Applying the optical slit with poly-Si layer provides that the S/N ratio of the peak is increased as ca. 2 times for quartz chip and ca. 3 times for glass chip. The maximum UV absorbance is also enhanced with ca. 1.6 and 1.7 times, respectively.

• 제어로봇시스템학회:학술대회논문집
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• 2003.10a
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• pp.1016-1021
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• 2003

The overall size of electronic product is becoming small according to development of technology. Accordingly it is difficult to inspect these small components by human eyes. So, an automation system for inspecting them has been used. The existing system put microprocessor or Programmable Logic Controller (PLC) use. The structure of microprocessor-based controller and PLC use basically composed of memory devices such as ROM, RAM and I/O ports. Accordingly, the system is not only becomes complicated and enlarged but also higher price. In this paper, we implement FPGA-based One-chip Programmable Timing Controller for Inspecting Small components to resolve above problems and design the high performance controller by using VHDL. With fast development, the FPGA of high capacity that can have memory and PLL have been introduced. By using the high-capacity FPGA, the peripherals of the existent controller, such as memory, I/O ports can be implemented in one FPGA. By doing this, because the complicated system can be simplified, the noise and power dissipation problems can be minimized and it can have the advantage in price. Since the proposed controller is organized to have internal register, counter, and software routines for generating timing signals, users do not have to problem the details about timing signals and need to only send some values about an inspection system through an RS232C port. By selecting theses values appropriate for a given inspection system, desired timing signals can be generated.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2000.04a
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• pp.74-79
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• 2000

In an attempt to estimate the wetting properties of wettable metal layers by wetting balance method, an analysis of wetting curves of the coating layer was performed. Based on the analysis, wetting properties of UBM-coated Si-plate were estimated by the new wettability indices. The wetting curves of the one and both sides-coated UBM layers have the similar shape and show the similar tendency to the temperature. So the wetting property estimation of one side coating is possible with wetting balance method. For UBM of Si-chip, Cr/Cu/Au UBM is better than Ti/Ni/Au in the point of wetting time. At general reflow temperature, the wettability of high melting point solders(Sn-Sb, Sn-Ag) is better than that of few melting point ones(Sn-Bi, Sn-In).The contact angle of the one side coated plate to the solder can be calculated from the farce balance equation by measuring the static state force and the tilt angle.