• JSTS:Journal of Semiconductor Technology and Science
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• 제4권3호
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• pp.149-167
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• 2004

Passive components are indispensable in the design and development of microchips for high-frequency applications. Inductors in particular are used frequently in radio frequency (RF) IC's such as low-noise amplifiers and oscillators. This paper gives a broad overview on the on-chip spiral inductors. The design concept and modeling approach of the typical square-shaped spiral inductor are first addressed. This is followed by the discussions of advanced structures for the enhancement of inductor performance. Research works reported in the literature are summarized to aid the understanding of the recent development of such devices.

• 반도체디스플레이기술학회지
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• 제2권1호
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• pp.11-14
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• 2003

The high Q(quality factor) suspended spiral inductors were fabricated on the silicon substrate by 3D surface micromachined process. The integration of 2.4GHz VCO has been performed by fabricating suspended spiral inductor of the top of CMOS VCO circuit. The phase noise of VCO integrated MEMS inductor is 93.5 dBc/Hz at 100kHz of offset frequency.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1997년도 춘계연구발표회 논문개요집
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• pp.76-77
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• 1997

• Journal of electromagnetic engineering and science
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• 제18권1호
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• pp.46-51
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• 2018

In this paper, a planar printed hybrid short/open-ended slot antenna with capacitive coupling feed strips is proposed for hepta-band mobile applications. The proposed antenna is comprised of a slotted ground plane on the top plane and two capacitive coupling feed strips with a chip inductor on the bottom plane. At the low frequency band, the short-ended long slot fed by strip 1 generates its half-wavelength resonance mode, whereas the T-shaped open ended slot fed by strip 2 generates its quarter-wavelength resonance mode for the high frequency band. The antenna provides a wide bandwidth covering GSM850/GSM900/DCS/PCS/UMTS/LTE2300/LTE2500 operation bands. Moreover, the antenna occupies a small volume of $15mm{\times}50mm{\times}1mm$. The operating principle of the proposed antenna and the simulation/measurement results are presented and discussed.

• 한국자기학회:학술대회 개요집
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• 한국자기학회 1997년도 춘계연구발표회 논문개요집
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• pp.98-99
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• 1997

• 한국세라믹학회:학술대회논문집
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• 한국세라믹학회 2000년도 추계총회,초청강연,특별강연,연구발표회
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• pp.132.1-132
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• 2000

• 산업기술연구
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• 제29권B호
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• pp.101-105
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• 2009

A 1.571GHz LC VCO with optimized spiral inductor for GPS receiver is designed in 130nm CMOS process. The phase noise of the VCO has been reduced the use of high Q inductor and on chip filter. It has phase noise of -91dBc/Hz, -111dBc/Hz, and -131dBc/Hz at 10kHz, 100kHz, and 1MHz offset frequencies from the carrier, respectively. This VCO consumes 2mA from a 0.6V supply.

• 한국정보통신학회:학술대회논문집
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• 한국해양정보통신학회 2003년도 추계종합학술대회
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• pp.389-393
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• 2003

This paper presents circuit modeling and characterization of silicon-based on-chip integrated inductors in Giga Hertz range for wireless communication products. We compare several different designs of on-chip inductors for self-resonant frequency and quality factor. The measurement data could be used as a design guide for manufacturing practical spiral inductors for wireless applications. We provide the equivalent inductor circuit parameters from the actual measurement data.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 1999년도 추계종합학술대회 논문집
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• pp.283-286
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• 1999

A 2㎓, low noise, low power CMOS voltage-controlled oscillator (VCO) with an integrated LC resonator is presented. The design of VCO relies heavily on the on-chip spiral inductor. An optimized spiral inductor with Q-factor of nearly 8 is achieved and used for the VCO. The simulated result of phase noise is as low as -l14 ㏈c/Hz at an offset frequency of a 600KHz from a 2㎓ carrier frequency. The VCO is tuned with standard available junction capacitors, resulting in an about 400MHz tuning range (20%). Implemented in a five-metal 0.25${\mu}{\textrm}{m}$ standard CMOS process, the VCO consumes only 2㎽ from a single 2.5V supply. It occupies an active area of 620${\mu}{\textrm}{m}$$\times$720${\mu}{\textrm}{m}$.

• 마이크로전자및패키징학회지
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• 제24권3호
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• pp.1-6
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• 2017

As the performance and density of IC devices increase, especially the clock frequency increases, power grid network integrity problems become more challenging. To resolve these power integrity problems, the use of passive devices such as resistor, inductor, and capacitor is very important. To manage the power integrity with little noise or ripple, decoupling capacitors are essential in electronic packaging. The decoupling capacitors are classified into voltage regulator capacitor, board capacitor, package capacitor, and on-chip capacitor. For next generation packaging technologies such as 3D packaging or wafer level packaging on-chip MIM decoupling capacitor is the key element for power distribution and delivery management. This paper reviews the use and necessity of on-chip decoupling capacitor.