• 마이크로전자및패키징학회지
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• 제20권4호
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• pp.17-23
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• 2013

신축성 전자패키징 기술개발을 위한 기초연구로서 Cu/Sn 범프에 CNT-Ag 복합패드를 형성한 칩을 이방성 전도접착제를 사용하여 플립칩 본딩한 후, CNT-Ag 복합패드의 유무 및 본딩압력에 따른 플립칩 접속부의 접속저항을 측정하였다. CNT-Ag 복합패드가 형성된 Cu/Sn 칩 범프를 25MPa과 50MPa의 본딩압력으로 플립칩 본딩한 시편들은 접속저항이 너무 높아 측정이 안되었으며, 100MPa의 본딩압력으로 플립칩 본딩한 시편은 $213m{\Omega}$의 평균 접속저항을 나타내었다. 이에 비해 CNT-Ag 복합패드가 없는 Cu/Sn 칩 범프를 사용하여 25MPa, 50 MPa 및 100 MPa의 본딩압력으로 플립칩 본딩한 시편은 각기 $1370m{\Omega}$, $372m{\Omega}$ 및 $112m{\Omega}$의 평균 접속저항을 나타내었다.

• 대한기계학회논문집
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• 제15권1호
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• pp.139-144
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• 1991

본 연구에서는 절삭가공시 생성되는 칩의 형상해석의 일환으로 2차원 절삭시 칩은 절삭날에 수직한 방향으로 공구경사면을 흘러간다는 기본적인 전제조건과 Kluft 등의 칩흐름각 예측에 대한 제안중 노으즈반경(nose radius) 및 기울임각의 영향을 중 첩시키고, 또한 절삭날에 연하여 미변형 칩두께(undeformed chip thickness)가 달라지 는 경우 칩흐름의 세기는 이에 비례한다는 Baart등의 가정을 도입하여 칩흐름각에 대 한 새로운 해석을 시도하였다.

• 한국정밀공학회지
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• 제20권11호
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• pp.64-70
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• 2003

This paper suggests a systematic methodology to predict chip forms using the experimental design technique and the neural network. Significant factors determined with ANOVA analysis are used as input variables of the neural network back-propagation algorithm. It has been shown that cutting conditions and cutting tool shapes have distinct effects on the chip forms, so chip breaking. Cutting tools are represented using the Z-map method, which differs from existing methods using some chip breaker parameters. After training the neural network with selected input variables, chip forms are predicted and compared with original chip forms obtained from experiments under same input conditions, showing that chip forms are same at all conditions. To verify the suggested model, one tool not used in training the model is chosen and input to the model. Under various cutting conditions, predicted chip forms agree well with those obtained from cutting experiments. The suggested method could reduce the cost and time significantly in designing cutting tools as well as replacing the“trial-and-error”design method.

• 아시안잔디학회지
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• 제16권1호
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• pp.19-30
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• 2002

경직된 지반의 물리성 개선재로서 rubber chip의 토양 내 혼합 또는 배토는 잔디의 생육과 지반의 이·화학성 및 중금속 추출 실험을 통하여 다음과 같은 결론을 얻었다. Rubber chip의 토양 내 혼합은 지면의 온도 상승효과를 가져왔으며 이는 겨울철의 동해방지 및 맹아출현기를 앞당길 수 있을 것이라 추정된다. 그러나 복사열이 높은 여름에는 rubber chip에 의한 표면, 지중 온도의 상승으로 잔디의 피해가 우려된다. 또한 토양 내에 rubber chip의 혼합함량(rubber chip 20%, 40%)이 많을수록 잔디의 발아와 생육 및 피복에 부정적인 영향을 끼쳤다. Rubberchip의 토양혼합은 지반의 이·화학성 변화에 크게 작용하지 않았으며 중금속 추출실험에서도 차이를 나타내지 않아 토양환경 오염이 없을 것으로 판단된다. Rubber chip을 배토용 재료로서 사용했을 경우, 경직된 토양구조를 개선시켜 주었다. 특히 통기작업 후 rubber chip의 배토는 지반의 표면탄성을 현저히 완화시켰다. 따라서 현재 우리나라에서 보수중이 거나 건설중인 연습구장, 보조구장에 재활용이 가능한 폐타이어 rubber chip을 지반 답압 개선용, 배토용 재료로서 사용이 가능할 것으로 판단된다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2001년도 하계학술대회 논문집
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• pp.757-760
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• 2001

We have used the random fluidic self-assembly (RFSA) technique based on the chip pattern of hydrophobic self-assembly layers to assemble microfabricated particles onto the chip pattern. Immobilization of DNA, fabrication of the particles and the chip pattern, arrangement of the particles on the chip pattern, and recognition of each using DNA fluorescence measurement were carried out. Establishing the walls, the arrangement stability of the particles was improved. Each DNA is able to distinguish by using the lithography process on the particles. Advantages of this method are process simplicity, wide applicability and stability. It is thought that this method can be applicable as a new fabrication technology to develop a minute integration type biosensor microarray.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.1663-1667
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• 2003

This thesis is on tile development of LD(Laser Diode) chip tester and the control system based on graphical programming language(LabVIEW) to control the equipment. The LD chip tester is used to test the optic power and the optic spectrum of the LD Chip. The emitter size of LD chip and the diameter of the receiver(optic fiber) are very small. Therefore, in order to test each chip precisely, this tester needs high accuracy. However each motion part of the tester could not accomplish hish accuracy due to the limit of the mechanical performance. Hence. an image processing with machine vision was carried out in order to compensate for the error. and also a load test was carried out so as to reduce tile impact of load on chip while the probing motion device is working. The obtained results were within ${\pm}$5$\mu\textrm{m}$ error.

• Journal of Welding and Joining
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• 제20권4호
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• pp.498-504
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• 2002

Fluxless flip chip bonding process using plasma treatment instead of flux was investigated. The effect of plasma process parameters on tin-oxide etching characteristics were estimated with Auger depth profile analysis. The die shear test was performed to evaluate the adhesion strength of the flip chip bonded after plasma treatment. The thickness of oxide layer on tin surface was reduced after Ar+H2 plasma treatment. The addition of H2 improved the oxide etching characteristics by plasma. The die shear strength of the plasma-treated Sn-Pb solder flip chip was higher than that of non-treated one but lower than that of fluxed one. The difference of the strength between plasma-treated specimen and non-treated one increased with increase in bonding temperature. The plasma-treated flip chip fractured at solder/TSM interface at low bonding temperature while the fracture occurred at solder/UBM interface at higher bonding temperature.

• 한국정밀공학회지
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• 제31권6호
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• pp.521-525
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• 2014

Circulating tumor cells (CTCs) in the bloodstream of cancer patients provide an accessible source for detection, characterization, and monitoring of nonhematological cancers. The effectiveness of the CTC-Chip for the isolation of ovarian cancer cells was demonstrated by adapting the herringbone-chip (HB-Chip). The motions of the particles on the HB chip were simulated by a unique combination of buoyant, gravitational forces, and helical flows with a computational modeling. The motions of cells are demonstrated by applying polystylene bead and ovarian cancer cells into the microfabricated HB-Chip. The experimental results from beads and cells are well accordance with the simulated ones, as previously reported by Toner group. Thus, I expect that these modeling and experimental skills will play key roles in the clinical applications on CTC isolation as well as the basic research on characterization of CTCs under flow.

• Genomics & Informatics
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• 제9권2호
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• pp.89-91
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• 2011

DNA chips are becoming increasingly popular as a convenient way to perform vast amounts of experiments related to genes on a single chip. And the importance of analyzing the data that is provided by such DNA chips is becoming significant. A very important analysis on DNA chip data would be clustering genes to identify gene groups which have similar properties such as cancer. Clustering data for DNA chips usually deal with a large search space and has a very fuzzy characteristic. The Particle Swarm Optimization algorithm which was recently proposed is a very good candidate to solve such problems. In this paper, we propose a clustering mechanism that is based on the Particle Swarm Optimization algorithm. Our experiments show that the PSO-based clustering algorithm developed is efficient in terms of execution time for clustering DNA chip data, and thus be used to extract valuable information such as cancer related genes from DNA chip data with high cluster accuracy and in a timely manner.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2006년도 제37회 하계학술대회 논문집 C
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• pp.1315-1316
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• 2006

Microarray-based DNA chips provide an architecture for multi-analyte sensing. In this paper, we report a new approach for DNA chip microarray fabrication. Multifunctional DNA chip microarray was made by immobilizing many kinds of biomaterials on transducers (particles). DNA chip microarray was prepared by randomly distributing a mixture of the particles on a chip pattern containing thousands of m-scale sites. The particles occupied a different sites from site to site. The particles were arranged on the chip pattern by the random fluidic self-assembly (RFSA) method, using a hydrophobic interaction for assembly.