• 제목/요약/키워드: On-chip

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The Relationship between Papanicolaou Smear Test and Human Papilloma Virus DNA Chip Test in the Uterine Cervix

  • Lee, Young-Ju;Jung, Ji-Hun;Jung, Da-Young
    • Korean Journal of Clinical Laboratory Science
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    • v.43 no.1
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    • pp.26-31
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    • 2011
  • The genotypes of Human Papilloma Virus (HPV) are important in the carcinogenesis of uterine cervical cancer. Diagnosis of uterine cervical cancer screening has been executed using Papanicolau method (Pap) and HPV DNA Chip method. We researched the interrelation of HPV DNA genotypes in single and multiple infections and analyzed the results of Pap and HPV DNA Chip tests at Gunsan Medical Center (GMC). The correlation analysis was surveyed on collected results from 599 patients who have been tested with both Pap and HPV DNA chip tests from November 2004 to May 2010 at GMC. The inconsistency between Pap and HPV DNA Chip tests was 41.1%. The HPV DNA Chip genotype related with high risk cases were type 16 (13.5%), type 52 (10.5%), type 58 (10.1%), and type 18 (3.4%). Those related with low risk cases were type 70 (8.9%), type 6 (1.7%), type 40 (1.2%), type 11 (1.3%), and other types (14.3%). Among the 195 cases of HPV positive status, 161 cases were associated with single infection; 108 (67.1%) cases were related with high risk genotype; 19 (11.8%) cases were low risk genotype; 31 (21.1%) cases were related with other types. 29 cases were associated with double infections; 23 (79.3%) cases were high risks; 5 (17.2%) cases were mixed high and low risks; 1 (3.5%) case was low risk.

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Effect of CNT-Ag Composite Pad on the Contact Resistance of Flip-Chip Joints Processed with Cu/Au Bumps (CNT-Ag 복합패드가 Cu/Au 범프의 플립칩 접속저항에 미치는 영향)

  • Choi, Jung-Yeol;Oh, Tae Sung
    • Journal of the Microelectronics and Packaging Society
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    • v.22 no.3
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    • pp.39-44
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    • 2015
  • We investigated the effect of CNT-Ag composite pad on the contact resistance of flip-chip joints, which were formed by flip-chip bonding of Cu/Au chip bumps to Cu substrate metallization using anisotropic conductive adhesive. Lower contact resistances were obtained for the flip-chip joints which contained the CNT-Ag composite pad than the joints without the CNT-Ag composite pad. While the flip-chip joints with the CNT-Ag composite pad exhibited average contact resistances of $164m{\Omega}$, $141m{\Omega}$, and $132m{\Omega}$ at bonding pressures of 25 MPa, 50 MPa, and 100 MPa, the flip-chip joints without the CNT-Ag composite pad had an average contact resistance of $200m{\Omega}$, $150m{\Omega}$, and $140m{\Omega}$ at each bonding pressure.

Multi-Band Chip Slot Antenna for Mobile Devices (무선 통신 기기에 적합한 다중 대역 칩 슬롯 안테나)

  • Nam, Sung-Soo;Lee, Hong-Min
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.20 no.12
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    • pp.1264-1271
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    • 2009
  • In this paper, the chip slot antenna which is used for mobile devices and designed for multi-band is proposed. The proposed antenna is comprised of a chip antenna(10 mm$\times$20 mm$\times$1.27 mm) and a system circuit board(30 mm$\times$60 mm$\times$0.8 mm). The chip slot antenna is mounted on the system circuit board and the end of F-type strip line which is patterned on the chip antenna is connected by a via with a ground plane of the system circuit board. So, a chip antenna radiates effectively the energy by transition between a microstrip line of the system circuit board and a open slot structure of the chip antenna. In the results of proposed antenna, impedance bandwidth of 3:1 VSWR(-6 dB return loss) is 1.98 GHz(1.61~3.59 GHz) and 0.8 GHz(5.2~6 GHz). So, it can cover multi-band of DCS, PCS, UMTS, WLAN. The proposed antenna can be applied to mobile devices.

Application of a Flashlight system for White LEDs Manufactured using a Reproduction Phosphor (재생 형광체로 제조한 백색 LED의 손전등 시스템에의 적용)

  • Ryu, Jang-Ryeol
    • Journal of the Korea Academia-Industrial cooperation Society
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    • v.15 no.8
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    • pp.5195-5200
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    • 2014
  • White LEDs are expected to be applied widely as a lighting system. To make white LED chips, one requires a mixture with silicon and a phosphor coating on a LED blue chip. The process of preparing a mixture with silicon using phosphor involves the use of discarded phosphor in the chip process. Reducing the costs of chip production depends on many factors, such as the mixture errors, exposure over time of silicon, and changes in the characteristics of blue chip. This paper reports the characteristics of a white LED chip manufactured through a reproduction process of derelict phosphor. This method was applicable to a real LED flashlight. A derelict phosphor chip showed similar results to a normal white chip for the degradation of cd 3.2[Cd] and 3.6[Cd], color temperature, 57[K] and 58[K], and maximum white wavelength 444.3[nm] and 449.8[nm]. These results are expected to make ea great contribution to cost reduction.

Fabrication of All-fiber 7x1 Pump Combiner Based on a Fiber Chip for High Power Fiber Lasers (고출력 광섬유 레이저를 위한 광섬유 칩 기반 All-fiber 7x1 펌프 광 결합기 제작)

  • Choi, In Seok;Jeon, Min Yong;Seo, Hong-Seok
    • Korean Journal of Optics and Photonics
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    • v.28 no.4
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    • pp.135-140
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    • 2017
  • In this paper, we report measured results for an all-fiber $7{\times}1$ pump combiner based on an optical fiber chip for high-power fiber lasers. An optical-fiber chip was fabricated by etching a fiber, having core and cladding diameters of 20 and $400{\mu}m$, in the longitudinal direction. To both ends of the etched chip, we spliced input and output fibers. First, we tied together seven optical fibers, having core and cladding diameters of 105 and $125{\mu}m$ respectively, in a cylindrical bundle and spliced them to the $375-{\mu}m$ end of the optical-fiber chip. Then, we attached an output DCF with core and cladding diameters of 25 and $250{\mu}m$ to the $250-{\mu}m$ end of the optical-fiber chip. Finally, the fabricated $7{\times}1$ pump combiner showed an average optical coupling efficiency of about 90.2% per port. This chip-based pump combiner may replace conventional pump combiners by massive production of fiber chips.

Exploring On-Chip Bus Architectures for Multitask Applications

  • Kim, Sung-Chan;Ha, Soon-Hoi
    • JSTS:Journal of Semiconductor Technology and Science
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    • v.4 no.4
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    • pp.286-292
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    • 2004
  • In this paper we present a static performance estimation technique of on-chip bus architectures. The proposed technique requires the static scheduling of function blocks of a task to analyze bus conflicts caused by simultaneous accesses from processing elements to which function blocks are mapped. To apply it to multitask applications, the concurrent execution of the function blocks of different tasks also should be considered. Since tasks are scheduled independently, considering all cases of concurrency in each processing element is impractical. Therefore we make an average estimate on the effects of other tasks with respect to bus request rate and bus access time. The proposed technique was incorporated with our exploration framework for on-chip bus architectures, Its viability and efficiency are validated by a preliminary example.

Highly Miniaturized On-Chip $180^{\circ}$ Hybrid Employing Periodic Ground Strip Structure for Application to Silicon RFIC

  • Yun, Young
    • ETRI Journal
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    • v.33 no.1
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    • pp.13-17
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    • 2011
  • A highly miniaturized on-chip $180^{\circ}$ hybrid employing periodic ground strip structure (PGSS) was realized on a silicon radio frequency integrated circuit. The PGSS was placed at the interface between $SiO_2$ film and silicon substrate, and it was electrically connected to top-side ground planes through the contacts. Owing to the short wavelength characteristic of the transmission line employing the PGSS, the on-chip $180^{\circ}$ hybrid was highly miniaturized. Concretely, the on-chip $180^{\circ}$ hybrid exhibited good radio frequency performances from 37 GHz to 55 GHz, and it was 0.325 $mm^2$, which is 19.3% of a conventional $180^{\circ}$ hybrid. The miniaturization technique proposed in this work can be also used in other fields including compound semiconducting devices, such as high electron mobility transistors, diamond field effect transistors, and light emitting diodes.

System-on-chip single event effect hardening design and validation using proton irradiation

  • Weitao Yang;Yang Li;Gang Guo;Chaohui He;Longsheng Wu
    • Nuclear Engineering and Technology
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    • v.55 no.3
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    • pp.1015-1020
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    • 2023
  • A multi-layer design is applied to mitigate single event effect (SEE) in a 28 nm System-on-Chip (SoC). It depends on asymmetric multiprocessing (AMP), redundancy and system watchdog. Irradiation tests utilized 70 and 90 MeV proton beams to examine its performance through comparative analysis. Via examining SEEs in on-chip memory (OCM), compared with the trial without applying the multi-layer design, the test results demonstrate that the adopted multi-layer design can effectively mitigate SEEs in the SoC.

Lab-on-a-Chip for Monitoring the Quality of Raw Milk

  • Choi Jeong-Woo;Kim Young-Kee;Kim Hee-Joo;Lee Woo-Chang;Seong Gi-Hun
    • Journal of Microbiology and Biotechnology
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    • v.16 no.8
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    • pp.1229-1235
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    • 2006
  • A lab-on-a-chip (LoC) was designed for simultaneous monitoring of microorganisms, antibiotic residues, somatic cells, and pH in raw milk. The LoC was fabricated from polydimethylsiloxane (PDMS) using microelectromechanical system (MEMS) technology, which consisted of two parts; a protein array and microchannel. The protein array was fabricated by immobilizing five types of antibodies corresponding to two microorganisms, two antibiotic residues, and somatic cells. A sol-gel film was deposited on a glass substrate to immobilize the antibodies. The target analytes in raw milk could be bound with the corresponding antibody by an immunoreaction, and the antigen-antibody complex was detected using fluorescence microscopy. SNARF-dextran was used as a pH indicator, and the SNARF-entrapped hydrogel was attached to the microchannel in the chip. After injecting the milk sample into the channel, the pH was measured by monitoring the change in fluorescence intensity by fluorescence microscopy. The on-chip simultaneous assay of two microorganisms (E. coli O157:H7 and Streptococcus agalactiae), two antibiotic residues (penicillin G and dihydrostreptomycin), and neutrophils was successfully accomplished using the proposed LoC system.

Study on the Machinability of Pinus densiflora at Chunyang District for Wood Patterns - Effect of Chip-Tool Contact Stress Distribution in Workpiece During of Wood Machining - (목형용(木型用) 춘양목(春陽木)의 절삭가공(切削加工) 특성(特性)에 관(關)한 연구(硏究)(제1보(第1報)) - 절삭중(切削中) 공구면(工具面)의 응력분포에 미치는 접촉(接觸)칩의 영향(影響) -)

  • Kim, Jeong-Du
    • Journal of the Korean Wood Science and Technology
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    • v.16 no.4
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    • pp.54-60
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    • 1988
  • Machinabilities means inherent properties of pinus densiflora at Chunyang district to be CNC machined easily or not, and processing abilities of the tool and machine together. This explanation signifies that machinabilities have two phases of signification, depended on considering and stress either materials or tools preferentially. This paper discuss machinabilities, the following items are usually employed as the indices of stress distribution at the cutting tool rake face. The stress distributions on the chip - tool contact surface at the early stage of the chip forming and under the stage of fringe pattern in wood cutting were analyzed the photoelastic method. The tool used in the present experiment was the special cutting tool H.S.S. one made in laboratory. And isochromatic fringe pattern and isolinic line of work piece by chip-behavior during the cutting operation were photographed with the feed camera continuously. The effects on the stress, distribution on the rake face of the epoxy tool and the strain distribution in the work piece of wood plate by chip behavior are cleared in pre cent experiment.

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