• Proceedings of the KIEE Conference
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• 2009.07a
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• pp.1256_1257
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• 2009

We have grown, for the first time to our knowledge, N-doped ZnO thin films on sapphire substrate by employing novel dielectric barrier discharge in pulsed laser deposition (DBD-PLD). DBD guarantees an effective way for massive in-situ generation of N-plasma under the conventional PLD process condition. Low-temperature photoluminescence spectra of the N-doped ZnO film provided near band-edge emission after thermal annealing process. The emission peak was resolved by Gaussian fitting to find a dominant acceptor-bound exciton peak ($A^0X$) that indicates the successful p-type doping of ZnO with N.

• Journal of the Korean Society for Heat Treatment
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• v.23 no.2
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• pp.69-74
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• 2010

AlN thin films were deposited by using a two-facing-targets type sputtering system (TFTS), and their deposition characteristics, microstructure and texture were investigated. Total gas pressure was kept constant at 0.4 Pa and the partial pressures of nitrogen, $PN_2$ (($N_2$ pressure)/($Ar+N_2$ pressure)) varied from 0 to 0.4 Pa. The texture of the film cross-sections and surface morphology were observed by field emission scanning electron microscope (FE-SEM). The crystallographic orientation of the films were analyzed by X-ray diffraction (XRD). Deposition of AlN film depends on $N_2$ partial pressure. The best preferred oriented AlN thin films can be deposited at a nitrogen partial pressure of $PN_2$ = 0.52. As-deposited AlN films show preferred orientation and columnar structure, and the grAlN size of AlN films increases with increasing sputtering current.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.32A no.12
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• pp.115-121
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• 1995

A mask for x-ray lithography is fabricated with SiN membrane and WTi absorber. SiN membrane is deposited by plasma enhanced chemical vapor deposition, and the stress of SiN membrane is controlled to be less than 100 MPa by rapid thermal annealing. WTi absorber is reactively deposited by DC-magnetron type sputter, and the working gases are argon and nitrogen. Added nitrogen is contributed to the stress of WTi absorber. The stress of WTi absorber is controlled to be less than $\pm$ 100 MPa by controlling the deposition pressure. 10$\mu$m WTi pattern is delineated on SiN membrane by dry etching technique.

• Journal of the Korean institute of surface engineering
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• v.29 no.5
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• pp.498-504
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• 1996

The synthesis of carbon nitride thin films with high nitrgen concentration was accomplished by reactive supttering at relatively high working pressure. In conventional reactive sputter-deposition of carbon nitride films, working pressure was 0.3-5Pa and the ratio of nitrogen to carbon(N/C ratio) in the films was less than 0.5. In this study, amorphous carbon nitride films with the N/C ratio $\tickapprox$ 1.0 were prepared on Si(100). substrates at higher pressure, 20-60 Pa. Structural analyses with Fourier transform infrared spectroscopy and X-ray photoelectron spectroscopy revealed that the films prepared consisted of triazine-like plain network.

• Journal of Magnetics
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• v.5 no.4
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• pp.124-129
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• 2000

$Sm_2Fe_{17}N_x$ film magnets were prepared using a $Sm_2Fe_{17}$ target in a $N_2$ gas atmosphere using a Nd-YAG pulsed laser ablation technique. The effect of nitrogen pressure, deposition temperature, pulse time and film thickness on the structure and magnetic properties of $Sm_2Fe_{17}N_x$ film were studied. Increasing the nitrogen pressure up to 5 atm led to the formation of complete $Sm_2Fe_{17}N_x$ compound. Optimized magnetic properties with the nitrogenation temperature in the range 500-53$0^{\circ}C$ could be obtained by extending the nitrogenation time up to 4 hours. Relatively low coercivities of 400~600 Oe were found in $Sm_2Fe_{17}N_x$films 50~100 m thick, while a $4\piM_s$ of 10$\sim$12 kG could be achieved. In-plane anisotropy, which was the basic goal in this study, was achieved by controlling the nitrogenation parameters.

• Transactions on Electrical and Electronic Materials
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• v.14 no.4
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• pp.165-171
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• 2013

Nanostructured pure a-C and nitrogen doped a-C: N thin films with small particle size of, ~50 nm were obtained by Aerosol-assisted CVD method from the natural precursor camphor oil. Five samples were prepared for the a-C and a-C: N respectively, with the deposition temperatures ranging from $400^{\circ}C$ to $600^{\circ}C$. At high temperature, the AFM clarifies an even smoother image, due to the increase of the energetic carbon ion bombardment at the surface of the thin film. An ohmic contact was acquired from the current-voltage solar simulator characterization. The higher conductivity of a-C: N, of ${\sim}{\times}10^{-2}Scm^{-1}$ is due to the decrease in defects since the spin density gap decrease with the nitrogen addition. Pure a-C exhibit absorption coefficient, ${\alpha}$ of $10^4cm^{-1}$, whereas for a-C:N, ${\alpha}$ is of $10^5cm^{-1}$. The high ${\sigma}$ value of a-C:N is due to the presence of more graphitic component ($sp^2$ carbon bonding) in the carbon films.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.26.1-26.1
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• 2011

We investigated the atomic layer deposition (ALD) process for nitrogen doped ZnO and the application for n-ZnO : N/p-Si (NW) coaxial hetero-junction photodetectors. ALD ZnO:N was deposited using diethylzinc (DEZ) and diluted $NH_4OH$ at $150^{\circ}C$ of substrate temperature. About 100~300 nm diameter and 5 um length of Si nanowires array were prepared using electroless etching technique in 0.108 g of $AgNO_3$ melted 20 ml HF liquid at $75^{\circ}C$. TEM images showed ZnO were deposited on densely packed SiNW structure achieving extraordinary conformality. When UV (360 nm) light was illuminated on n-ZnO:N/p-SiNW, I-V curve showed about three times larger photocurrent generation than film structure at 10 V reverse bias. Especially, at 660 nm wave length, the coaxial structure has 90.8% of external quantum efficiency (EQE) and 0.573 A/W of responsivity.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.12 no.2
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• pp.34-40
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• 2013

Various depositional conditions, such as substrate, pressure, deposition time, temperature of substrate, power and gas composition, have mainly been studied to attain DLC films using RF sputtering system up to the current. In this study, the $N_2/Ar/CH_4$ gas mixture factored on characteristics of DLC deposited film such as structure, hardness, electrical property were investigated. The concentration of the $N_2$ gas in the sputtering gas may be a significant effect on the growth rate of the doped films, because nitrogen ions react not only with the carbon atoms on the target but also with $C_xH_y$ ions in the plasma on the substrate surface. It was seen from this experimental that the resistance of deposited film is decreased, and the relative intensity ratio of D to G peak is increased as nitrogen content of film deposition is increased.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2001.06a
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• pp.73-73
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• 2001

Boron-containing materials have several excellent properties, such as superlnardness, insulation and non-Rinear optical property. Recently, oxynitride compounds, such as Si(ON), Ti(ON), became the promising materials applied in diffusion barrier layer and solar cell. With the expectation of obtaining the hybrid property, we have firstly grown the BON thin film by radio frequency (R.F.) plasma enhanced metalorganic chemical vapm deposition (PEMOCVD) with 100 kHz frequency and trimethyl borate precursor. The plasma source gases used in this study were Ar and $H_2$, and two kinds of nhmgen source gases, $N_2$ and <$NH_3$, were also employed. The as-grown films were characterized by XPS, IR, SEM and Knoop microlhardness tester. The relationship between the films hardness and the growth rate indicated that the hardness of the film was dependent on several factors such as nitrogen source gas, substrate temperature and film thickness due to the variation of the composition and the structure of the film. Both nitrogen and carbon content could raise the film hardness, on which nitrogen content did stronger effect than carbon. The smooth morphology and continuous structure was benefit of obtaining high hardness. The maximum hardness of BON film was about 10 GPa.

• Journal of the Korean Society for Precision Engineering
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• v.25 no.7
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• pp.124-130
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• 2008

The effect of nitrogen gas pressure in arc ion plating on surface properties of the TiN-coated high speed steel(SKH51) is presented in this paper. The surface roughness, micro-particle, micro-hardness, coated thickness, atomic distribution of TiN, and adhesion strength are measured fur various nitrogen gas pressures. It has been shown that the nitrogen gas pressure has a considerable effect on the surface roughness, adhesion strength, atomic distribution of TiN, and surface deposition of TiN of the high speed steels but that it has little influence on the micro-hardness and coated thickness.