• 한국분말재료학회지
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• 제7권3호
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• pp.143-148
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• 2000

NiAl alloy powders were prepared by mechanical alloying method and bulk specimens were produced using hot isostatic pressing techniques. This study focused on the transformation behavior and properties of Ni-Al mechanically alloyed powders and bulk alloys. Transformation behavior was investigated by differential scanning calorimeter (DSC), XRD and TEM. Particle size distribution and microstructures of mechanically alloyed powders were studied by particle size analyzer and scanning electron microscope (SEM). After 10 hours milling, XRB peak broadening appeared at the alloyed powders with compositions of Ni-36at%Al to 40at%Al. The NiAl and $Ni_3Al$ intermetallic compounds were formed after water quenching of solution treated powders and bulk samples at $1200^{\circ}C$, but the martensite phase was observed after liquid nitrogen quenching of solution treated powders. However, the formation of $Ni_3Al$ intermetallic compounds were not restricted by fast quenching into liquid nitrogen. It is considered to be caused by fast diffusion of atoms for the formation of stable $\beta$(NiAl) phase and $Ni_3Al$ due to nano sized grains during quenching. Amounts of martensite phase increased as the composition of aluminium component decreased in the Ni-Al alloy, which resulted in the increasing damping properties.

• 열처리공학회지
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• 제15권2호
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• pp.65-69
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• 2002

$Llo{\rightarrow}Ni_5Al_3$ reordering and related properties in Ni-Al alloys consisting of 64-65at%Ni are characterized by X-ray diffraction, shape memory effect and damping capacity. Formation of $Ni_5Al_3$ takes place by simple ordering of atoms with a continuous increase in c/a ratio. As a result, degradation of shape memory effect and damping capacity is observed after short time annealing at $200-300^{\circ}C$.

• 대한기계학회논문집A
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• 제33권2호
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• pp.99-107
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• 2009

This study produced a design curve and fatigue limit for a variation in volume ratio and reduction ratio of TiNi/Al composites. In many cases, stress-life curve does not indicate fatigue limit, so it was presented by probabilistic-stress-life curve. Goodman diagram was used to analyze the fatigue strength of materials with a finite life determined by repeated load and the fatigue strength of endurance limit with an infinite life. The fatigue experiment was conducted using the scenk-type plane bending specimen in same shape. The result of the fatigue test, which had been conducted under consistent stress amplitude, was examined. (i) The optimal condition for TiNi/Al in accordance with hot pressing (ii) Impacts of fatigue limit caused by a variation in reduction ratio and volume ratio of TiNi/Al composites (iii) Probability distribution for fatigue limit of TiNi/Al2024 and TiNi/Al6061.

• 한국분말재료학회지
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• 제4권3호
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• pp.205-213
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• 1997

Mechanical alloying of $Ni_3Al$ and $Y_2O_3$ added ODS $Ni_3Al$ from elemental powders was investigated by the X-ray diffraction, differential scanning calorimeter, transmission electron microscopy and optical microscopy. The steady states of $Ni_3Al$ and ODS $Ni_3Al$ powders were reached after mechanical alloying with the condition of the ball-to-powder input ratio of 20:1 for 20 hours and 10 hours, respectively. The addition of nano-sized $Y_2O_3$ particles enhanced cold working and fracture, and subsequently accelerated MA of $Ni_3Al$ powders. DSC results of MAed $Ni_3Al$ powders showed four exothermic peaks at 14$0^{\circ}C$, 234$^{\circ}C$, 337$^{\circ}C$ and 385$^{\circ}C$. From the high temperature X-ray diffraction analysis, it was concluded that the peaks were resulted from the recovery solution of unalloyed Al in Ni, the formation of intermediate phase NiAl, and $LI_2$ ordering of MAed $Ni_3Al$ powders.

• 한국재료학회지
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• 제26권4호
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• pp.167-172
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• 2016

The high temperature deformation behavior of $Ni_3Al$ and $Ni_3(Al,Mo)$ single crystals that were oriented near <112> was investigated at low strain rates in the temperature range above the flow stress peak temperature. Three types of behavior were found under the present experimental conditions. In the relatively high strain rate region, the strain rate dependence of the flow stress is small, and the deformation may be controlled by the dislocation glide mainly on the {001} slip plane in both crystals. At low strain rates, the octahedral glide is still active in $Ni_3Al$ above the peak temperature, but the active slip system in $Ni_3(Al,Mo)$ changes from octahedral glide to cube glide at the peak temperature. These results suggest that the deformation rate controlling mechanism of $Ni_3Al$ is viscous glide of dislocations by the <110>{111} slip, whereas that of $Ni_3(Al,Mo)$ is a recovery process of dislocation climb in the substructures formed by the <110>{001} slip. The results of TEM observation show that the characteristics of dislocation structures are uniform distribution in $Ni_3Al$ and subboundary formation in $Ni_3(Al,Mo)$. Activation energies for deformation in $Ni_3Al$ and $Ni_3(Al,Mo)$ were obtained in the low strain rate region. The values of the activation energy are 360 kJ/mol for $Ni_3Al$ and 300 kJ/mol for $Ni_3(Al,Mo)$.

• 한국재료학회지
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• 제16권2호
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• pp.137-143
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• 2006

The effects of Cu and Fe additions on the thermal stability, microstructure and mechanical properties of $Al_{85}-Ni_{8.5}-Mm_{6.5},\;Al_{84}-Ni_{8.5}-Mm_{6.5}Cu_1,\;Al_{84}-Ni_{8.5}-M_{m6.5}Fe_1$ alloys, manufactured by gas atomization, degassing and hot-extrusion were investigated. Gas atomization, with a wide super-cooled liquid region, allowed the alloy powders to exhibit varying microstructure depending primarily on the powder size and composition. Al hotextruded alloys consisted of homogeneously-distributed fine-grained fcc-Al matrix and intermetallic compounds. A substitution of 1 at.% Al by Cu increased the thermal stability of the amorphous phase and produced alloy microstructure with smaller fcc-Al grains. On the other hand, the same substitution of 1 at.% Al by Fe decreased the stability of the amorphous phase and produced larger fcc-Al grains. The formation of intermetallic compounds such as $Al_3Ni,\;Al_{11}Ce_3\;and\;Al_{11}La_3$ was suppressed by the addition of Cu or Fe. Among the three alloys examined, the highest Vickers hardness and compressive strength were obtained for $Al_{84}-Ni_{8.5}-M_{m6.5}Cu_1$ alloy, and related to the finest fcc-Al grain size attained from increased thermal stability with Cu addition.

• 한국전기전자재료학회논문지
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• 제22권9호
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• pp.717-723
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• 2009

Ni/Al ('/' denotes deposition sequence) contacts were deposited on Al-implanted 4H-SiC for ohmic contact formation, and the conduction properties were characterized and compared with those of Ni-only contacts. The thicknesses of the Ni and Al thin film were 30 nm and 300 nm, respectively, and the films were sequentially deposited bye-beam evaporation without vacuum breaking. Rapid thermal anneal (RTA) temperature was varied as follows : $840^{\circ}C$, $890^{\circ}C$, and $940^{\circ}C$. The specific contact resistivity of the Ni contact was about $^{\sim}2\;{\pm}\;10^{-2}\;{\Omega}{\cdot}cm^2$, However, with the addition of Al overlayer, the specific contact resistivity decreased to about $^{\sim}2\;{\pm}\;10^{-4}\;{\Omega}{\cdot}cm^2$, almost irrespective of RTA temperature. X-ray diffraction (XRD) analysis of the Ni contact confirmed the existence of various Ni silicide phases, while the results of Ni/Al contact samples revealed that Al-contaning phases such as $Al_3Ni$, $Al_3Ni_2$, $Al_4Ni_3$, and $Ab_{3.21}Si_{0.47}$ were additionally formed as well as the Ni silicide phases. Energy dispersive spectroscopy (EDS) spectrum showed interfacial reaction zone mainly consisting of Al and Si at the contact interface, and it was also shown that considerable amounts of Si and C have diffused toward the surface. This indicates that contact resistance lowering of the Ni/Al contacts is related with the formation of the formation of interfacial reaction zone containing Al and Si. From these results, possible mechanisms of contact resistance lowering by the addition of Al were discussed.

• 한국전기화학회:학술대회논문집
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• 한국전기화학회 2004년도 수소연료전지공동심포지움 2004논문집
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• pp.245-250
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• 2004

• 한국세라믹학회지
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• 제33권5호
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• pp.536-546
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• 1996

The TiC-Ni/Al reaction-bonding composites were prepared by the infiltration of Ni/Al melt into the TiC preforms. The microstructure the reaction composition crystalline phase and the mechanical properties of the composites were investigated. During the reaction-bonding Ni/Al mixture had a good wettability and per-meability with TiC preform and pore-free and fully dense sintered bodies were produced. In the case of the Ni/Al atomic ratio of 0.3 and 0.5 TiC raw particle shape was changed to irregular particles because of the decomposition in the liquid matrix and its phenomena was more distinguished in the Al-rich liquid matrix. With increasing more than 1 of the Ni/Al atomic ratio the sample of TiC grain shape was changed from spherical to palatelet particles. Also with increasing the atomic ratio of Ni/Al bending strength and fracture spherical to palatelet particles. Also with increasing the atomic ratio of Ni/Al bending strength and fracture toughness were increased and its maximum value was 1073 MPa and 11 MPa.m1/2 respectively.

• 한국분말재료학회지
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• 제9권1호
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• pp.19-24
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• 2002

This paper reports the results of an investigation into the effect of Cu additions upon the nano-crystallization behaviour of an Al-Y-Ni alloy. 1 at.% Cu was added to a base alloy of Al/sub 88/Y₄Ni/sub 8/ either by substitution for Al to form Al/sub 87/Y₄Ni/sub 8/Cu₁, or by substitution for Ni to form Al/sub 88/Y₄Ni/sub 7/Cu₁. Consistent with previous findings in the literature, the substitution of Cu for Al was found to increase the thermal stability of the amorphous phase whereas the substitution of Cu for Ni was found to decrease its thermal stability. Comparing the microstructures of these alloys after heat treatment to produce equivalent volume fractions of Al nanocrystals showed average grain sizes of 14 nm, 12 nm and 9 nm for the alloys Al/sub 88/Y₄Ni/sub 8/, Al/sub 87/Y₄Ni/sub 8/Cu₁respectively. The effect of Cu in refining the size of the nanocrystals was attributed to enhanced nucleation increasing the number density of the nanocrystals, rather than diffusion limited or interface limited growth.