• 대한치과보철학회지
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• 제41권3호
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• pp.342-350
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• 2003

Statement of problem. Titanium-Nickel alloy might be used in various prosthetic restorations since it has a unique property such as super-elasticity and high fatigue resistance. However, little is known about the casting ability of this alloy. Purpose. This in vitro study compared the casting accuracy and the porosity made with different investments and various sprue designs to ascertain what casting condition would be better for the fabrication of Ti-Ni cast restorations. Material and methods. A total of 70 Ti-Ni alloy crowns were made and divided into 7 groups of 10 copings on a metal master die. For measuring the effect of the sprue numbers, two groups with one and two 8-gauge sprues were compared. Moreover, the results of the conventional sprue and the double thickness sprues were compared. Three investments were used; carbon free phosphate bonded investment, titanium investment and gypsum bonded investment. The cast restorations were evaluated at 48 points on the entire circumferential margin with a stereomicroscope measuring in micrometers. Each crown was radiographically examined for casting defects and porosity. Data on casting accuracy were analyzed using two-way and Post hoc Scheffe's comparison to determine whether significant differences existed at the 95% confidence level. Student-Newman-Keuls test were performed to identify significant differences in the number of voids. Results. The double sprueing group and double thickness group had significantly less marginal discrepancy than the single sprueing group (P<.05 and P<.01, respectively). The castings with phosphate bonded investment showed the least marginal discrepancy and the smoothest surface. The castings invested in the gypsum bonded investment had the greatest gaps in margin and the largest failure rate. The double sprueing group and phosphate bonded investment group had significantly smaller void numbers and smaller void size than the other groups. Conclusion. Within the limitations of this in vitro study, the casting accuracy of the groups using thicker, double sprue design and the phosphate bonded investment was significantly superior. Moreover, void number and size were less than other groups.

• 한국분말재료학회지
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• 제18권5호
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• pp.430-436
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• 2011

Joining of NiO-YSZ to 316 stainless steel was carried out with B-Ni2 brazing alloy (3 wt% Fe, 4.5 wt% Si, 3.2 wt% B, 7 wt% Cr, Ni-balance, m.p. 971-$999^{\circ}C$) to seal the NiO-YSZ anode/316 stainless steel interconnect structure in a SOFC. In the present research, interfacial (chemical) reactions during brazing at the NiO-YSZ/316 stainless steel interconnect were enhanced by the two processing methods, a) addition of an electroless nickel plate to NiO-YSZ as a coating or b) deposition of titanium layer onto NiO-YSZ by magnetron plasma sputtering method, with process variables and procedures optimized during the pre-processing. Brazing was performed in a cold-wall vacuum furnace at $1080^{\circ}C$. Post-brazing interfacial morphologies between NiO-YSZ and 316 stainless steel were examined by SEM and EDS methods. The results indicate that B-Ni2 brazing filler alloy was fused fully during brazing and continuous interfacial layer formation depended on the method of pre-coating NiO-YSZ. The inter-diffusion of elements was promoted by titanium-deposition: the diffusion reaction thickness of the interfacial area was reduced to less than 5 ${\mu}m$ compared to 100 ${\mu}m$ for electroless nickel-deposited NiO-YSZ cermet.

• 한국생산제조학회지
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• 제20권2호
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• pp.187-192
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• 2011

UBM(Under Bump Metallurgy) is very important for successful realization of Flip-Chip technology. In this study, it is investigated the interfacial reactions between various Sn-Ag solder alloys and Ni-P/Au UBM and Cu plate finish. It is also evaluated the shear strength by using the micro shear-punch test method for Sn-37Pb alloy, binary and ternary alloys of environment-friendly Pb-free solder alloys which are applied in the electronic packages. In terms of interfacial microstructure, the Pb-free solder joints have thicker IMCs than the Sn-Pb solder joints. The thickness of IMC is related to Reflow time. The IMC has been observed to grow with the increase in Reflow time. As a result of the shear test, in case of Max. shear strength, Pb-free solder showed the highest strength value and Sn-37Pb showed the lowest strength value 10 be generally condition of Reflow time.

• 한국산학기술학회논문지
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• 제7권6호
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• pp.1056-1063
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• 2006

10 nm-Ni/l nm-Ir(poly)Si과 10 nm-$Ni_{50}Co_{50}$/(poly)Si 구조의 박막을 열증착기로 준비하고 쾌속열처리기로 40초간 $300{\sim}1200^{\circ}C$ 온도 범위에서 실리사이드화 시켰다. 이들의 실리사이드 온도에 따른 면저항, 미세구조와 두께, 생성상, 화학조성과 표면조도의 변화를 사점면저항 측정기와 이온빔현미경, X선 회절기, 오제이 분석기, 주사탐침현미경을 써서 확인하였다. Ir과 Co의 혼입에 따라 기존의 $700^{\circ}C$에 한정된 NiSi에 비해 단결정, 다결정 실리콘 기판에서의 저저항 안정 구간이 각각 $1000^{\circ}C$, $850^{\circ}C$로 향상되었다. 이때의 실리사이드층의 두께도 20$\sim$50 nm로 나노급 공정에 적합하였다. Ir과 Co의 첨가는 단결정 기판에서의 니켈실리사이드의 고저항 $NiSi_2$로의 변태를 방지하였고, 다결정 기판에서 고온에서의 고저항은 고저항 상의 출현과 실리콘층과의 혼합과 도치현상이 발생한 것이 이유였다. Ir의 첨가는 특히 최종 실리사이드 표면온도를 3 nm 이내로 유지시키는 장점이 있었다 Ir과 Co를 첨가한 니켈실리사이드는 기존의 니켈실리사이드의 열적 안정성을 향상시켰고 나노급 디바이스에 적합한 물성을 가짐을 확인하였다.

• Current Photovoltaic Research
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• 제8권2호
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• pp.60-65
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• 2020

In perovskite solar cells with planar heterojunction configuration, selection of proper charge-transporting layers is very important to achieve stable and efficient device. Here, we developed solution processible Cu doped NiO_x (Cu:NiO_x) thin film as a hole-transporting layer (HTL) in p-i-n structured methylammonium lead trihalide (MAPbI₃) perovskite solar cell. The transmittance and thickness of NiO_x HTL is optimized by control the spin-coating rate and Cu is additionally doped to improve the surface morphology of undoped NiO_x thin film and hole-extraction properties. Consequently, a perovskite solar cell containing Cu:NiO_x HTL with optimal doping ratio of Cu exhibits a power conversion efficiency of 14.6%.

• 한국주조공학회지
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• 제22권1호
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• pp.42-48
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• 2002

Effects of coating treatment of metallic Cu, Ni-P film on $SiC_p$, for $SiC_p$/iron aluminide composites were studied. Porous hybrid preforms were fabricated by reactive sintering after mixing the coated $SiC_p$, Fe and Al powders. Then the final composites were manufactured by squeeze casting after pouring AC4C Al alloy melts in preforms. The change of reactive temperature, density, microstructure of the preforms and microstructure of the composites were investigated. The exprimental results were summarized as follows. The thickness of Cu and Ni-P metallic layer formed on $SiC_p$ by electroless plating method were about $0.5{\mu}m$ and coated uniformly. There was no remakable change in the ignition temperature with variation of the mixing ratio of Fe and Al powder while in the case of coated $SiC_p$ it was lower about $20^{\circ}C$ than in the non-coated $SiC_p$. The maximum reaction temperature increased with increasing Al contents, but decreased with increasing $SiC_p$ contents. Expansion ratio of preform after reactive sintering increased with amount of Cu coated $SiC_p$. In the case of Fe-70at.%Al, the expansion ratio was about 7% up to 8wt.% of $SiC_p$, addition but further addition of $SiC_p$, increased the ratio significantly. And in the case of Fe-50 and 60at.%Al, it was about 20% up to 16wt.% of $SiC_p$ addition and about 28% in 24wt.% of $SiC_p$, addition. The microstructures of compounds showed that the grains became finer as amount of $SiC_p$, and mixing ratio of iron powder increased and the shape of compounds was changed gradually from irregular to spheroidal.

• 한국자기학회지
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• 제23권1호
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• pp.12-17
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• 2013

금속 분말 니켈(Ni)을 HCl용액에 용해시킨 후 $H_3BO_3$, KOH을 첨가하여 Chloride 도금용액을 제조 후 Ni plate 기판에 도금하였다. 도금두께는 $3{\mu}m$로 일정하게 유지하였다. 전류밀도를 $1{\sim}30mA/cm^2$ 변화를 준 결과 전류밀도를 증가시킬수록 Ni 후막표면이 거칠어졌다. $25mA/cm^2$와 $30mA/cm^2$에서는 균열된 표면형상을 관찰하였다. 또한 XRD patterns 변화를 관찰한 결과 전류밀도가 증가할수록 FCC(111)과 FCC(220) 및 FCC(311)상의 강도는 증가한 반면 FCC(200)상의 강도는 감소하는 것을 관찰하였다. 전기도금된 Ni의 수평 및 수직 자화 값을 측정하였는데 기판에 의한 수평자화 값이 크게 나왔고, 코팅층 두께가 증가할수록 수직자화 값이 커지는 것을 확인하였다.

• 한국전기전자재료학회논문지
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• 제26권7호
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• pp.522-527
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• 2013

In this paper, We studied the change of surface and variation of elements on both electrodes of hydrogen generator of alkaline electrolysis in use of FE-SEM and SIMS. We used the stainless steel 316(600 ${\mu}m$) as electrode in condition of 25%KOH, $60^{\circ}C$ Temperature. The results show that the intensity of elements (C, Si, P, S, Ti, Cr, Mn, Fe, Ni, Mo) of Positive Electrode are decreased as much as about $10^1{\sim}10^3 $than the original electrode. Thickness of Positive Electrode is decreased about 40 ${\mu}m$ after chemical reaction. The negative electrode, however, shows a slight variation in the intensity of elements (C, Si, P, Fe, Ni, Mn, Mo) but Change of thickness and surface' shape of electrode show nothing after chemical reaction. The change in thickness and variation of Stainless Steel 316 cause the lifetime of electrode to be shorted. We also observed hydrogen, oxygen, potassium in both electrodes. Especially, The potassium is increased in proportional with depth of positive electrode. this means the concentration of alkali solutions is changed. and so we have to supply alkaline solution to generator in order to produce same quantity of hydrogen gas continuously. we hope that this study gives a foundation to develop the electrode for hydrogen generator of alkaline electrolysis.

• 마이크로전자및패키징학회지
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• 제14권4호
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• pp.15-20
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• 2007

시효처리에 따른 Cu pillar 범프 내 다양한 계면에서의 금속간화합물 성장거동을 각각 120, 150, $165^{\circ}C$의 온도에서 300시간동안 시효처리하면서 연구하였다. 분석 결과 Cu pillar와 SnPb 계면에서는 $Cu_6Sn_5$와 $Cu_3Sn$이 관찰되었고, 시효처리 시간이 경과함에 따라 parabolic 형태로 성장하였다. 또한 시효처리 온도가 높을수록 시간에 따른 $Cu_6Sn_5$와 $Cu_3Sn$의 성장속도는 더욱 빨랐다. kirkendall void는 Cu Pillar와 $Cu_3Sn$ 사이의 계면과 $Cu_3Sn$ 내부에서 형성되었고, 시효처리 시간이 경과함에 따라 성장하였다. 리플로우 후에 SnPb와 Ni(P)사이의 계면에서는 $(Cu,Ni)_6Sn_5$가 형성되었고, 시효처리 시간에 따른 $(Cu,Ni)_6Sn_5$거 두께 변화는 관찰되지 않았다. 시효처리 온도와 시간에 따른 금속간화합물의 두께 변화를 이용하여 전체$(Cu_6Sn_5+Cu_3Sn)$금속간화합물과 $Cu_6Sn_5,\;Cu_3Sn$ 금속간화합물의 성장에 대한 활성화 에너지를 구해본 결과 각각 1.53, 1.84, 0.81 eV의 값을 가지고 있었다.

• Restorative Dentistry and Endodontics
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• 제29권5호
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• pp.446-453
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• 2004

하악 대구치 근심치근의 danger zone에서 수종의 전동 니켈-티타늄 파일의 근관성형력을 근관성형 전후 치질 두께의 변화를 측정하여 평가하고자 하였다. 기구에 따라 총 40개의 하악 대구치를 10개씩 $Profile^{\circledR}$, GT Rotary file, Quantec 및 ProTaper 4개 군으로 나누고 각 치아당 2개의 근관을 straight up-and-down과 anticurvature 군으로 나누어 근단부 근관을 모두 30번 크기로 일정하게 확대하였다. 수정된 Bramante법을 사용하였으며 술전 및 술후의 근관 상아질 두께를 치수저 하방 1, 3 및 5 mm지점에서 측정, 이원변량분석법으로 통계분석하였다. 모든 군의 danger zone과 safe zone에서의 straight up-and-down 동작과 anticurvature 동작 사이에는 치근상아질 두께변화에 현저한 차이를 나타내지 않았다 (p > 0.05). ProTaper는 danger zone과 safe zone 모두에서 다른 기구에 비해 많은 량의 근관상아질 삭제를 보였으며 특히 분지부 3 mm 수준에서 현저하였다(p < 0.05).