• 한국표면공학회지
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• 제43권2호
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• pp.64-72
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• 2010

CuSnZn electroplating was investigated as alternative to Ni plating. Evaluation of electrolyte and plating process was performed to control physical characteristics of the film, and to collect practical data for application. Hull-cell test was conducted for basic comparison of two commercialized products and developed product. Based on hull-cell test results, long term test of three electrolytes was performed. Various analysis on long term tested electrolyte and samples have been done. Reliable and practical data was collected using FE-SEM (FEI, Sirion), EDX (ThermoNoran SIX-200E), ICP Spectrometer (GBC Scientifi c, Integra XL), FIB (FEI, Nova600) for anlysis. Physical analysis and reliability test of the long term tested film were also carried out. Through this investigation plating time, plating speed, electrolyte composition, electrolyte metal consumption, hardness and corrosion resistance has been compared. This set of data is used to predict and control the chemical composition of the film and modify the physical characteristics of the CuSnZn alloy.

• Journal of Magnetics
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• 제5권2호
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• pp.50-54
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• 2000

NiMn-pinned spin valve films consisting of a layered glass/NiFe/Co/Cu/Co/NiFe/NiMn/Ta stack were made by do magnetron sputtering. After deposition, the structure was annealed in a series of cycles each including three hours at $220^\circ C, 2\times10^{-6}$ Torr, in a field of 350 Oe, to create an ordered antiferromagnetic structure in the NiMn layer and produce a strong unidirectional pinning field in the pinned magnetic layer, Optimum spin valve properties were obtained after seven annealing cycles, or 21 hours at $220^\circ C$, and were : MR ratio 1%, exchange coupling field 620 Oe, and coercivity of pinned layer 250 Oe. The exchange coupling field remained constant up to an operating temperature of $175^\circ C$, and the blocking temperature was about $380^\circ C$.

• 한국표면공학회지
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• 제37권4호
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• pp.234-241
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• 2004

Cavitation erosion properties of the Cu-9Al-4.5Ni-4.5Fe alloys (Al-bronze) surface-modified by flame quenching process have been investigated. After flame quenching at above $T_{\beta}$, the surfaces of Al-bronze with $\alpha$ + $\textsc{k}$ structure have been changed into the $\alpha$ + $\beta$' martensite phases by the eutectoid reaction of $\alpha$ + $\textsc{k}$\longrightarrow$\beta$ followed by the martensite transformation of $\beta$\longrightarrow$\beta$'. As a result of cavitation test, the measured incubation time and erosion rate of the $\alpha$ + $\beta$' alloy was 1.2 times higher and 1.5 times lower, respectively, compared to those of the conventional $\alpha$ + $\textsc{k}$ alloys, showing a remarkable increase of cavitation resistance with the formation of $\beta$' martensite. This is attributed to a preferential erosion of the $\textsc{k}$ precipitates that show the lowest resistance among the $\alpha$, $\textsc{k}$, $\beta$' phases under cavitation loading.ases under cavitation loading.

• 소성∙가공
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• 제13권1호
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• pp.9-14
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• 2004

Recently, various bulk metallic glasses (BMG's) having good mechanical and chemical properties were developed. BMG's can easily be deformed in the supercooled liquid region, via viscous flow mechanism. By using the viscous flow, the very low pressure is needed to deform the materials. In this study, we investigated the structural transition and deformation behavior of Vitreloy 1 (Zr/sub 41.2/Ti/sub 13.8/Cu/sub 12.5/Ni/sub 10/Be/sub 22.5/) using TMA and DSC. We applied the results to the micro forming process. The forming condition was chosen based on the viscosity data from TMA, and Si wafer with micro patterns on the surface was used as a forming die. The deformed surface was analyzed by SEM and 3D Surface Profiling System. The alloy showed good replication of the patterns. Quantitative measurement of roughness was useful to evaluate the replication. Surface condition of the deformed surface was determined by the initial surface condition.

• 대한기계학회논문집A
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• 제33권3호
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• pp.201-209
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• 2009

The objective of present research work is to design the heat conductive mould to improve cooling characteristics of the injection mould for a mouse. In order to obtain the high cooling rate of the mould, a heat conductive mould with three different materials was designed. The materials of the base structure, the mid-layer and the molding part of the heat conductive mould were chosen as Cu-Ni alloy (Ampcoloy 940) to improve the heat conductivity of the mould, Ni-Cu alloy (Monel 400) to reduce a thermal stress, injection tool steel (P21), respectively. Through the three-dimensional transient heat transfer analysis and the thermal stress analysis, the effects of the geometrical arrangement of each material on the cooling characteristics and the thermal stress distribution were examined. From the results of the analyses, a proper design of the thermal conductive mould was obtained.

• 한국표면공학회지
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• 제48권6호
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• pp.260-268
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• 2015

The thermal barrier coating (TBC) for inner wall of liquid-fuel rocket combustor consists of NiCrAlY as bonding layer and $ZrO_2$ as a top layer. In most case, the plasma spray coating is used for TBC process and this process has inherent possibility of cracking due to large difference in thermal expansion coefficients among bonding layer, top layer and metal substrate. In this paper, we suggest crack-free TBC process by using a precise electrodeposition technique. Electrodeposited Ni-P/Cr double layer has similar thermal expansion coefficient to the Cu alloy substrate resulting in superior thermal barrier performance and high temperature oxidation resistance. We studied the effects of phosphorous concentrations (2.12 wt%, 6.97 wt%, and 10.53 wt%) on the annealing behavior ($750^{\circ}C$) of Ni-P samples and Cr double layered electrodeposits. Annealing temperature was simulated by combustion test condition. Also, we conducted SEM/EDS and XRD analysis for Ni-P/Cr samples. The results showed that the band layers between Ni-P and Cr are Ni and Cr, and has no formed with heat treatment. These band layers were solid solution of Cr and Ni which is formed by interdiffusion of both alloy elements. In addition, the P was not found in it. The thickness of band layer was increased with increasing annealing time. We expected that the band layer can improve the adhesion between Cr and Ni-P.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2007년도 SMT/PCB 기술세미나
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• pp.37-47
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• 2007

Factor : Structure Metal pad & SMO size Board level TC test : - Large SMO size better Board level Drop test : - Large SMO size better Factor : Structure Substrate thickness Board level TC test : - Thick substrate better Board level Drop test : - Substrate thickness is not a significant factor for drop test Factor : Material Solder alloy Board level TC test : - Not so big differences over Pb-free solder and NiAu, OSP finish Board level Drop test : - Ni/Au+SAC105, CuOSP+LF35 are better Factor : Material Pad finish Board level TC test : - NiAu/NiAu is best Board livel Drop test : - CuOSP is best Factor : Material Underfill Board level TC test - Several underfills (reworkable) are passed TCG x500 cycles Board level Drop test : - Underfill lots have better performance than non-underfill lots Factor : Process Multiple reflow Board level TC test : - Multiple reflow is not a significant actor for TC test Board level Drop test : N/A Factor : Process Peak temp Board level TC test : - Higher peak temperature is worse than STD Board level Drop test : N/A Factor : Process Stack method Board level TC test : - No big difference between pre-stack and SMT stack Board level Drop test : - Flux dipping is better than paste dipping but failure rate is more faster

• 한국자기학회지
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• 제10권2호
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• pp.62-66
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• 2000

비자성사이층 Cu 두께(30 $\AA$, 35 $\AA$, 40 $\AA$)를 달리한 glass(7059)/N $i_{81}$$Fe_{19}$(70 $\AA$)/Co(10 $\AA$)/Cu(t $\AA$)/Co(15 $\AA$)/N $i_{81}$$Fe_{19}$(35 $\AA$)N $i_{25}$M $n_{75}$(250 $\AA$)Ta(50 $\AA$) 스핀밸브박막(spin valve film; SVF) 을 dc 스퍼터링으로 제작하였다 이 시편을 진공 열처리 한 후 자유자성층의 상호결합세기(interlayer coupling field; $H_{inf}$ )와 보자력(coercivity; $H_{sf}$ )에 대한 열처리 순환횟수 및 비자성층 두께 의존성에 관련한 자기저항특성을 조사했다. Cu 두께가 35 $\AA$인 SVF의 경우에 교환결합세기(exchange coupling field; $H_{ex}$)가 620 Oe, 보자력( $H_{c}$)이 280 Oe 및 자기저항(magnetoresistance; MR)비가 2.5%를 보였다. $H_{inf}$ 와 $H_{cf}$ 는 모든 SVF가 열처리 순환 횟수에 따라 증가하는 경향을 보이다가 일정한 값으로 안정화되며 Cu 35 $\AA$인 경우는 열처리 순환 횟수 15회 이후에 각각 120 Oe 및 75 Oe를 유지한다. $H_{inf}$ 및 $H_{cf}$ 가 열처리 순환횟수 증가에 따라 증가하는 것은 열처리 효과에 의해 Cu층과 Co층의 계면섞임 증대에 의한 유효한 Cu층 두께 감소에 기인한다. Cu가 적정둘레 35 $\AA$ 보다 더 얇아지거나 두꺼워지면 계면섞임에 의한 효과는 각각 더 증대하거나 둔화되는 것으로 분석된다.으로 분석된다..

• 마이크로전자및패키징학회지
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• 제16권4호
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• pp.23-28
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• 2009

Si 기판의 캐비티 형성이 불필요한 웨이퍼-레벨 MEMS capping 공정을 연구하였다. 4인치 Si 웨이퍼에 Ni 캡을 전기도금으로 형성하고 Ni 캡 rim을 Si 하부기판의 Cu rim에 에폭시 본딩한 후, SnBi debonding 층을 이용하여 상부기판을 Ni 캡 구조물로부터 debonding 하였다. 진공증착법으로 형성한 SnBi debonding 층은 Bi와 Sn 사이의 심한 증기압 차이에 의해 Bi/Sn의 2층 구조로 이루어져 있었다. SnBi 증착 층을 $150^{\circ}C$에서 15초 이상 유지시에는 Sn과 Bi 사이의 상호 확산에 의해 eutectic 상과 Bi-rich $\beta$상으로 이루어진 SnBi 합금이 형성되었다. $150^{\circ}C$에서 유지시 SnBi의 용융에 의해 Si 기판과 Ni 캡 구조물 사이의 debonding이 가능하였다.

• 한국소성가공학회:학술대회논문집
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• 한국소성가공학회 2008년도 추계학술대회 논문집
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• pp.215-217
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• 2008

Crystallization behavior of the bulk metallic glass (BMG) during compression and tension was studied in the supercooled liquid region (SLR). Rod samples of the BMG alloy were produced by consolidating gas atomized powders of $Cu_{54}Zr_{22}Ti_{18}Ni_6$ using spark plasma sintering. The crystallization behavior in these samples was examined by tackling changes in thermal property during heating the samples in DSC. The present BMG alloy was firstly decomposed and then crystallized during annealing in the SLR. The phase decomposition from the original amorphous phase was retarded by the compressive stress, while it was accelerated by the tensile stress.