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http://dx.doi.org/10.3795/KSME-A.2009.33.3.201

Design of the Thermally Conductive Mould to Improve Cooling Characteristics of Injection Mould for a Mouse  

Ahn, Dong-Gyu (조선대학교 기계공학과)
Kim, Hyun-Woo (조선대학교 일반대학원 기계공학과)
Lee, Ki-Yong (한국생산기술연구원 호남권기술지원본부)
Publication Information
Transactions of the Korean Society of Mechanical Engineers A / v.33, no.3, 2009 , pp. 201-209 More about this Journal
Abstract
The objective of present research work is to design the heat conductive mould to improve cooling characteristics of the injection mould for a mouse. In order to obtain the high cooling rate of the mould, a heat conductive mould with three different materials was designed. The materials of the base structure, the mid-layer and the molding part of the heat conductive mould were chosen as Cu-Ni alloy (Ampcoloy 940) to improve the heat conductivity of the mould, Ni-Cu alloy (Monel 400) to reduce a thermal stress, injection tool steel (P21), respectively. Through the three-dimensional transient heat transfer analysis and the thermal stress analysis, the effects of the geometrical arrangement of each material on the cooling characteristics and the thermal stress distribution were examined. From the results of the analyses, a proper design of the thermal conductive mould was obtained.
Keywords
Thermally Conductive Mould; Cooling Characteristics; Injection Mould; Thickness of Mould Materials;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
Times Cited By SCOPUS : 3
연도 인용수 순위
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