• 센서학회지
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• 제14권1호
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• pp.52-55
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• 2005

Ni oxide thin films with thermal sensitivity superior to Pt and Ni thin films were formed through annealing treatment after Ni thin films were deposited by a r.f. magnetron sputtering method. Resistivity values of Ni oxide thin films were in the range of $10.5{\mu}{\Omega}cm$ to $2.84{\times}10^{4}{\mu}{\Omega}cm$ according to the degree of Ni oxidation. Also temperature coefficient of resistance(TCR) values of Ni oxide thin films depended on the degree of Ni oxidation from 2,188 ppm/$^{\circ}C$ to 5,630 ppm/$^{\circ}C$ in the temperature range of $0{\sim}150^{\circ}C$. Because of the high linear TCR and resistivity characteristics, Ni oxide thin films exhibit much higher sensitivity to flow and temperature changes than pure Ni thin films and Pt thin films.

• 한국전기전자재료학회논문지
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• 제18권2호
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• pp.169-173
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• 2005

Ni oxide thin films were formed through annealing treatment in the atmosphere after Ni thin films deposited by a r.f. magnetron sputtering method and then electric and material properties were analyzed for application to thermal sensors. Resistivity of Ni thin films decreased after annealing treatment at 30$0^{\circ}C$ and 40$0^{\circ}C$ for five hours due to crystallization of Ni thin films but the value increased over 45$0^{\circ}C$ because of Ni thin film's oxidation. Resistivity values of Ni thin films were in the range of 10.5 $\mu$Ωcm/$^{\circ}C$ to 2.84${\times}$10$^4$$\mu$Ωcm/$^{\circ}C$ according to the degree of Ni oxidation. Also temperature coefficient of resistance(TCR) values of Ni oxide thin films depended on the degree of Ni oxidation such as 2,188 ppm/$^{\circ}C$ to 5,630 ppm/$^{\circ}C$ in the temperature range of 0 $^{\circ}C$∼150 $^{\circ}C$. The results demonstrate that Ni oxide thin films of annealing treatment at 40$0^{\circ}C$ for 5hours could be more advantageous than pure Ni thin films and Pt thin films from a point of output properties and TCR, applied to thermal sensors.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
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• pp.193.1-193.1
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• 2014

This study was to investigate the electronic structure and optical properties of Na doped into NiO thin film using XPS and REELS. The films were grown by electron beam evaporation with varying the annealing temperature. The relationship between the electrical characteristics with the local structure of NiO thin films was also discussed. The x-ray photoelectron results showed that the Ni 2p spectra for all films consist of Ni 2p3/2 which indicate the presence of Ni-O bond from NiO phase and for the annealed film at temperature above $200^{\circ}C$ shows the coexist Ni oxide and Ni metal phase. The reflection electron energy loss spectroscopy spectra showed that the band gaps of the NiO thin films were slightly decreased with Na-doped into films. The Na-doped NiO showed relatively low resistivity compared to the undoped NiO thin films. In addition, the Na-doped NiO thin films deposited at room temperature showed the best properties, such as a p-type semiconducting with low electrical resistivity of $11.57{\Omega}.cm$ and high optical transmittance of ~80% in the visible light region. These results indicate that the Na doping followed by annealing process plays a crucial in enhancing the electrical and optical properties of NiO thin films. We believe that our results can be a good guide for those growing NiO thin films with the purpose of device applications, which require deposited at room temperature.

• 전기화학회지
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• 제14권3호
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• pp.163-170
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• 2011

첨가제 농도, 전류밀도, 도금용액 pH가 Ni 박막의 잔류응력, 표면형상, 미세조직에 미치는 영향을 관찰하기 위하여 chloride 도금용액으로부터 나노결정립 Ni 박막이 제조되었다. Ni 박막에서 잔류응력은 첨가제인 saccharin의 농도가 증가함에 따라 인장응력모드(약 150 MPa)로부터 압축응력모드(약 -100 MPa)로의 천이가 관찰되었다. Ni 박막의 미세구조는 도금용액 내에 saccharin의 유무에 따라 변화되었다. Saccharin이 첨가되지 않은 도금용액으로부터 전기도금된 Ni 박막은 주로 FCC(111) 과 FCC(200) 상들로 구성되어 있다. 그러나 Saccharin이 첨가된 도금용액으로부터 전기도금된 Ni 박막은 FCC(111), FCC(200), FCC (311) 상[때로는 FCC (220)]들로 구성되어 있다. 전류밀도는 Ni 박막의 잔류응력에 영향을 미치는 것으로 관찰되었다. $2.5\sim2.5{\mu}10mA{\cdot}cm^{-2}$의 전류밀도에서 가장 낮은 압축응력 값(약 -100 MPa)을 나타내었다. 도금용액의 pH 도 역시 Ni 박막의 잔류응력에 영향을 미쳤다. 한편, 도금용액에 saccharin의 첨가는 Ni 박막의 결정립 크기에 영향을 나타내었다. Saccharin이 첨가되지 않은 경우 Ni 박막의 결정립 크기가 약 60 nm로 측정되었으며, saccharin 함량이 0.0005 M 이상 첨가된 경우 Ni 박막의 결정립 크기가 24~38 nm로 측정되었다. Ni 박막의 표면 형상은 saccharin이 첨가됨에 따라 nodular 형상으로부터 매끄러운 (smooth) 형상으로 변화되었다.

• 한국전기전자재료학회논문지
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• 제13권12호
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• pp.1032-1038
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• 2000

Ni$_{81}$$Fe_{19}$(200 nm) thin films have been deposited by RF-magnetron sputtering on Si(001) substrates, Atomic force microscopy(AFM), X-ray diffraction(XRD) and magnetoresistance(MR) measurements of the thin films for investigating electromagnetic properties and microstructures were employed. During field annelaing for 1hr, there was no big difference n XRD patterns of Ni$_{81}$$Fe_{19}$ thin films. However, there was a significant change in XRD patterns of Ni$_{81}$$Fe_{19}$ thin films deposited at 40$0^{\circ}C$ during in-situ magnetic field deposition. The degree of surface roughness increased with increasing annealing and deposition temperature. With variation of surface roughness, there was no significant difference in MR Characteristics of Ni$_{18}$ $Fe_{19}$ thin films in 1hr-annealed case. High MR ratio was observed in the case of in-situ field deposited Ni$_{81}$$Fe_{19}$ films. 19/ films.

• 센서학회지
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• 제24권4호
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• pp.224-227
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• 2015

In this study, 2 wt% Cr-doped Ni thin films were deposited using DC sputtering on a bare Si substrate using a 4 inch target at room temperature. In order to obtain ultrathin films from Cr-doped Ni thin films with high electrical properties and uniform surface, the micro-structure and electrical properties were investigated as a function of deposition time. For all deposition times, the Cr-doped Ni thin films had low average resistivity and small surface roughness. However, the resistivity of the Cr-doped Ni thin films at various ranges showed large differences for deposition times below 90 s. From the results, 120 s is considered as the appropriate deposition time for Cr-doped Ni thin films to obtain the lowest resistivity, a low surface roughness, and a small difference of resistivity. The Cr-doped Ni thin films are prospective materials for microdevices as ultrathin film electrodes.

• 한국표면공학회지
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• 제51권1호
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• pp.62-70
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• 2018

Sulfamate plating solution containing a small amount of chloride bath was fabricated to study the properties of the electrodeposited Ni thin films. Effects of the changes of current density and additive concentration on current efficiency, residual stress, surface morphology and microstructure of Ni thin films electrodeposited from Ni sulfamate-chloride baths were investigated. The current efficiency was measured to be more than about 95%, independent of the changes of current density and saccharin concentration in the baths. Residual stress of Ni thin film was appeared to be the compressive stress modes in the range of $5{\sim}30mA/cm^2$ current density. Maximum compressive stress was observed at the current density of $10mA/cm^2$. Compressive stress values of Ni thin/thick films were increased to be about -85~-100 MPa with increasing saccharin concentration from 0 to 0.0195 M(4 g/L). Surface morphology was changed from smooth to nodule surface appearance with increasing the current density. Smooth surface morphology of Ni thin films electrodeposited from the baths containing saccharin was observed, independent of the saccharin concentration. Ni thin/thick films consist of FCC(111), FCC(200), FCC(220), FCC(311) and FCC(222) peaks. It was revealed that the FCC(200) peak of Ni thin films is the preferred orientation in the range of $5{\sim}30mA/cm^2$ current density. The intensity of FCC(200) peak was gradually decreased and the intensity of FCC(111) peak was increased with increasing saccharin concentration in the baths.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2000년도 하계학술대회 논문집
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• pp.519-522
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• 2000

The correlation of surface morphology and magnetic property of NiFe thin films on Si(001) deposited by RF-magnetron sputter has been investigated, using AFM, XRD and MR measurements. During short field annealing for 15 min, there was no significant change in XRD patterns of NiFe thin films. However, the degree of surface roughness was changed with increasing annealing temperature. With variation of surface roughness, there was significant difference in MR characteristics of NiFe thin films. In the case of as-deposited NiFe thin films(T$\_$G/ = 150$^{\circ}C$) and UFA400 (T$\_$A/ = 400$^{\circ}C$) having smooth surface, good linearity of MR Curve was observed.

• 전기화학회지
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• 제8권1호
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• pp.32-36
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• 2005

본 연구는 $WO_3$ 박막과 $NiO-WO_3$ 박막을 고진공 저항가열식 thermal evaporation 법으로 (100) n형의 실리콘 단결정 기판 위에 증착시켰고, 막의 결정성 증진을 위하여 공기 중 $500^{\circ}C$에서 30분 동안 열처리하였다. 박막의 결정성 및 결정구조를 분석하기 위해서 X선 회절분석기를 사용하였고, 표면 및 단면 관찰을 위해서는 주사전자현미경을 이용하였다. 그리고 화학 조성 결합에너지는 XPS를 이용하였다. 순수 $WO_3$ 박막의 결정 크기는 $500^{\circ}C$에서 30분 동안 공기중 열처리에 의해서 $0.6{\mu}m$로 성장하였고 $WO_3$ 박막의 두께가 증가할수록 거의 변화 없이 일정하였다. 반면, NiO가 첨가된 $WO_3$ 박막 두께별 결정크기는 각각 $0.12{\mu}m,\;0.28{\mu}m,\;0.32{\mu}m$및 $0.43{\mu}m$로 순수 $WO_3$ 박막에 비해 치밀한 표면을 형성하였고, 최대 5배정도 성장이 억제되었다. 가스감도 측정은 대기 중에서의 센서 저항 값을 기준으로 측정가스 저항 값의 비율 $(R_{NOx}/R_{air})$로 가스감도를 나타내었다. 전기적 성질은 MFC로 NOx가스 5ppm을 일정히 유지시켰고, Multimeter로 계측하여 컴퓨터에 자동 계측되는 시스템을 사용하였다. 순수 $WO_3$박막보다는 $NiO-WO_3$ 박막이 우수한 NOx 감도특성을 보였고 센서의 작동온도는 $250^{\circ}C$에서 우수한 감도를 나타내었다.

• 한국진공학회지
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• 제12권1호
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• pp.16-19
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• 2003

실온에서 p-InP (100) 위에 이온빔 증착법으로 Ni 박막을 성장하였다. Ni 박막의 이차전자방출계수(${\gamma}$)와 일함수를 결정하기 위하여 Ne, Ar, $N_2$, Xe 이온원을 사용하여 가속전압에 따른 $\gamma$를 측정하였다. 여러 가지 기체와 집속이온빔장치의 가속전압에 따른 $\gamma$결과로부터 Ni 박막의 일함 수를 결정하였다. p-InP (100) 위에 성장한 Ni 박막의 일함수는 5.8 eV ~ 5.85 eV 이었다. 실험을 통하여 얻어진 결과들은 실온에서 p-InP (100) 위에 성장한 Ni 박막의 전자적 성질에 관한 중요한 정보를 제공하고 있다.