• Journal of Surface Science and Engineering
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• v.26 no.4
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• pp.175-182
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• 1993

Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.

• Journal of Surface Science and Engineering
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• v.48 no.3
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• pp.100-104
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• 2015

The nickel alloys gets a great deal of attention due to their good mechanical, chemical and magnetic properties. Especially Ni-P alloy systems are very attractive due to their good corrosion resistance and the wear resistance in important technological applications. In this study, the effects of phosphorus acid concentration in plating solution on composition of Ni-P alloy coatings were studied. The Ni-P electrodeposits of the various P contents were investigated in order to understand effect of the composition on mechanical properties of Ni-P electrodeposits. The mechanical properties of electrodeposits increased as the P content in electrodeposits increase. The results of mechanical properties were explained by grain size and P solid solution effect. The effects of heat treatment on mechanical properties of Ni-P alloy coatings were also studied.

• Applied Chemistry for Engineering
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• v.8 no.4
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• pp.568-574
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• 1997

The effect of microencapsulation of maetal hydride (MH) with copper on the electrode performance of a Ni/MH battery has been investigated. The MH electrodes were prepared with a combination of cold press and paste methods. The discharge capacity of the electrode increased with an addition of small amounts if CMC into the electrode, but decreased when heat-treated in an oxygen-free nitrogen flow. The capacity of a Cu-coated $LaNi_5$ electrode was higher than that of LaNi5electrode. The discharge capacity of the electrode prepared with Cu-coated $LaNi_5$ increased with the increase of copper content in the electrode. It is considered that the increase of copper content enhanced the current density on the electrode surface, leading to the increase of the discharge capacity The MH electrode coated by an acidic electroless plating method showed much higher discharge capacity than that using an alkaline electroless plating method. The discharge capacity of the $LaNi_{4.5}Al_{0.5}$ electrode was higher than that of the $LaNi_5$ electrode. Also, the effect of microencapsulation on the deactivation of $LaNi_5$ was studied using an absorption-desorption cycle in CO-containing hydrogen.

• Carbon letters
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• v.3 no.2
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• pp.77-79
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• 2002

• Proceedings of the KWS Conference
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• 2002.05a
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• pp.272-275
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• 2002

• Proceedings of the Korean Magnestics Society Conference
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• 2001.04a
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• pp.146-147
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• 2001

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 1998.05a
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• pp.82-82
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• 1998

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.08a
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• pp.139.4-139
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• 1998

• Journal of Hydrogen and New Energy
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• v.9 no.2
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• pp.65-75
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• 1998

Five different processes were selected and tested to find an useful method of manufacturing Fe-Ti type electrode. Initially, FeTi alloy was prepared by melting in plasma arc furnace and then powdered for shaping. Electroless Ni plating on these powder particles before shaping improved the discharge characteristics. The effects of heat-treatments on the electrode characteristics were also investigated. The discharge capacities of electrods were increased with the increasing heat-treatment temperatures. When heat treated at $1000^{\circ}C$ after shaping, the best results were acquired in the discharge capacity and cycle life. Both electroless Ni plating and heat-treatment were appeared to be crucial for the performance improvement of FeTi type electrode. Fe-Ti -Mn electrodes were prepared according to the process suggested in this study and tested to verify the promising effects of that.

• Korean Journal of Materials Research
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• v.9 no.11
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• pp.1095-1101
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• 1999

Electroless Ni plating is applied to form bumps and UBM layer for flip chip interconnection. Characteristics of electroless Ni are also investigated. Zincate pretreatment is analyzed and plated layer characteristics are investigated according to variables like temperature, pH and heat treatment. Based on these observations, characteristics dependence to each variables and optimum electroless Ni plating conditions for flip-chip interconnection are suggested. Electroless Ni has 10wt% P, $60\mu\Omega$-cm resistivity, 500HV hardness and amorphous structure. It changes crystallized structure and hardness increases after heat treatment After interconnection of electroless Ni bumps by ACF flip chip method, we show their advantages and possibility in microelectronic package applications.