Journal of the Korean institute of surface engineering (한국표면공학회지)

The Korean Institute of Surface Engineering (한국표면공학회)
권호 표지

Electrochemical aspects of electroless nickel-boron plating

무전해 Ni 도금의 전기화학적 고찰

  • 김영기 (한양대학교 공과대학 금속공학과) ;
  • 이원해 (한양대학교 공과대학 금속공학과)
  • Published : 1993.08.01
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Abstract

Electroless plating of nickel was studied electrochemically in the presence of complexing agents. Nickel sulfate solution with dimethylamine borance(DMAB) as the reducing agent was used. Effects of temperature pH, concentration and complexing agents-citric acid, EDTA, tartaric acid-were studied.Experimental meas-urements showed that the rate of electroless nickel deposition was closely related to electrochemical parame-ters such as temdperature, pH, concentration and the properties of complexing agets.

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