• 한국재료학회지
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• 제16권10호
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• pp.614-618
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• 2006

The thermal stability of Cu/Ti(or Ta)/NiSi contacts was investigated. Ti(Ta)-capping layers deposited to form NiSi was utilized as the Cu diffusion barrier. Ti(Ta)/NiSi contacts was thermally stable upto $600^{\circ}C$. However when Cu/Ti(Ta)/NiSi contacts were furnace-annealed at $300{\sim}400^{\circ}C$ for 40 min., the Cu diffusion was found to be effectively suppressed, but NiSi was dissociated and then Ni diffused into the Cu layer to form Cu-Ni solutions. On the other hand, the Ni diffusion did not occur for the Al/Ti/NiSi system. The thermal instability of Cu/Ti(Ta)/NiSi contacts was attributed to the high heat of solution of Ni in Cu.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2006년도 춘계 학술대회 개요집
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• pp.33-35
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• 2006

The interactions between Cu/Sn-Ag-(Cu) and Sn-Ag-(Cu)/Ni interfacial reactions were studied during isothermal aging at $150^{\circ}C$ for up to 1000h using Cu(ENIG)/Sn-3.5Ag-(0.7Cu)/Cu(ENIG) sandwich solder joints. A typical scallop-type Cu-Sn intermetallic compound (IMC) layer formed at the upper Sn-Ag/Cu interface after reflowing, whereas a $(Cu,Ni)_6Sn_5$ IMC layer was observed at the Sn-Ag/ENIG interface. The Cu in the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni side was sourced from the dissolution of the opposite Cu metal pad or Cu-Sn IMC layer. When the dissolved Cu arrived at the interface of the Ni pad, the $(Cu,Ni)_6Sn_5$ IMC layer formed on the Ni interface, preventing the Ni pad from reacting with the solder. Although a long isothermal aging treatment was performed at $150^{\circ}C$, no Ni was detected in the Cu-Sn IMC layer formed on the Cu side. Compared to the single Sn-Ag/ENIG solder joint, the formation of the $(Cu,Ni)_6Sn_5$ IMC layer of the Cu/sn-Ag/ENIG sandwich joint effectively retarded the Ni consumption from the electroless Ni-P layer.

• 한국재료학회지
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• 제17권9호
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• pp.463-468
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• 2007

The interdiffusion characteristics of Cu-plug/Capping Layer/NiSi contacts were investigated. Capping layers were deposited on Ni/Si to form thermally-stable NiSi and then were utilized as diffusion barriers between Cu/NiSi contacts. Four different capping layers such as Ti, Ta, TiN, and TaN with varying thickness from 20 to 100 nm were employed. When Cu/NiSi contacts without barrier layers were furnace-annealed at $400^{\circ}C$ for 40 min., Cu diffused to the NiSi layer and formed $Cu_3Si$, and thus the NiSi layer was dissociated. But for Cu/Capping Layers/NiSi, the Cu diffusion was completely suppressed for all cases. But Ni was found to diffuse into the Cu layer to form the Cu-Ni(30at.%) solid solution, regardless of material and thickness of capping layers. The source of Ni was attributed to the unreacted Ni after the silicidation heat-treatment, and the excess Ni generated by the transformation of $Ni_2Si$ to NiSi during long furnace-annealing.

• 한국자기학회지
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• 제5권3호
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• pp.191-196
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• 1995

고상반응법에 의해 NiCuZn ferrite를 제조하였으며 소결온도 $900^{\circ}C$에서의 조성 및 공정변화에 따른 특성을 검토하였다. NiCuZn ferrite에서 Cu 치환 첨가량과 (Ni+Cu)/Zn의 조성비를 변화시킨 결과 ${(Ni_{0.2}Cu_{0.2}Zn_{0.6}O)}_{1.02}{(Fe_{2}O_{3})}_{0.98}$의 조성을 가질 때 초기투자율이 가장 높게 나타났다. NiCuZn ferrite의 Curie 온도 ($T_{c}$)는 Cu의 치환 첨가량이 증가함에 따라 점차 감소하였으며, Cu의 함량을 고정하고 Ni의 함량을 변화시킬 경우, (Ni+Cu)/Zn의 조성비가 증가할 수록 현저하게 증가하였다. ${(Ni_{0.2}Cu_{0.2}Zn_{0.6}O)}_{1-w}{(Fe_{2}O_{3})}_{1+w}$의 조성에서 분쇄시간을 20~80시간으로 변화시켰을 경우 $Fe_{2}O_{3}$ 결핍량(w)이 -0.015일 때 초기투자율이 가장 높았으며, Curie 온도 ($T_{c}$)는 $Fe_{2}O_{3}$ 결핍량(w)이 0에서 -0.025로 증가할 수록 점차 감소하였다.

• Bulletin of the Korean Chemical Society
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• 제35권7호
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• pp.2019-2024
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• 2014

NiCu alloys have been suggested as potential candidates for catalysts in glucose oxidation. In this study, NiCu alloys with different compositions were prepared on a glassy carbon substrate by changing the electrodeposition potential to examine the effect of Ni/Cu ratios in alloys on catalytic activity toward glucose oxidation. Cyclic voltammetry and chronoamperometry showed that NiCu alloys had higher catalytic activity than pure Ni and Cu catalysts. Especially, Ni59Cu41 had superior catalytic activity, which was about twice that of Ni at a given oxidation potential. X-ray analyses showed that the oxidation state of Ni in NiCu alloys was increased with the content of Cu by lattice expansion. Ni components in alloys with higher oxidation state were more effective in the oxidation of glucose.

• 한국분말재료학회지
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• 제6권4호
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• pp.270-276
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• 1999

Ti-Ni-Cu alloy powders were fabricated by ball milling, and the properties of these powders were characterized. Mixed 50Ti-(50-x)Ni-xCu powders of 5 to 10at.%Cu composition were milled for 100 hours using SUS 1/4" balls in argon atmosphere. Ball to powder ratio was 20:1 and rotating speed was 100 rpm. Tensile strength, microstructure and phase transformation of ball milled Ti-(50-x)Ni-xCu powders were studied. After 100 hours milling, Ti, Ni and Cu elements were alloyed completely and an amorphous phase was formed. Amorphous phase was crystallized to martensite(B 19') and austenite(B2) after heat treatment for 1 hour at $850^{\circ}C$. As the Cu contents were increased, tensile strength of extruded 6061Al/TiNiCu was decreased, and B19'martensite phases In the TiNi particles were the causes of high tensile stress of extruded 6061Al/TiNiCu.NiCu.

• 한국자기학회지
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• 제21권4호
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• pp.132-135
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• 2011

초연자성을 갖는 코네틱(NiFeCuMo) 박막을 NiFe 박막 사이에 삽입한 삼층박막 위에 반강자성체 FeMn을 증착한 다층박막에서 NiFe와 NiFeCuMo 박막의 두께에 따른 교환결합력과 보자력에 관한 특성을 조사하였다. 특히 NiFeCuMo 박막의 두께가 1 nm일 때 NiFe 박막 사이에 삽입한 삼층박막 위에 반강자성체 FeMn을 증착한 다층박막의 교환결합력은 최댓값을 나타내었다. 고정층과 자유층에 각각 NiFeCuMo 박막을 삽입하여 초연자성의 바이오센서용 거대자기저항-스핀밸브(giant magnetoresistive-spin valves; GMR-SV) 소자를 개발할 수 있는 가능성을 보여주었다.

• Bulletin of the Korean Chemical Society
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• 제34권3호
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• pp.768-772
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• 2013

Layered mixed metal hydroxy double salts (HDS) with the formulas $(Cu_{0.75}Ni_{0.25})_2(OH)_3NO_3$ ((Cu, Ni)-HDS) and $Cu_2(OH)_3NO_3$ ((Cu, Cu)-HDS) were prepared via slow hydrolysis reactions of CuO with $Ni(NO_3)_2$ and $Cu(NO_3)_2$, respectively. The crystal structures, morphologies, bonding natures, and magnetic properties of (Cu, Ni)-HDS and (Cu, Cu)-HDS were characterized with X-ray diffraction (XRD), scanning electron microscopy (SEM), Fourier transformation infrared spectroscopy (FT-IR), thermogravimetric analysis (TGA), and a superconducting quantum interference device (SQUID). Even though (Cu, Ni)-HDS has a similar layered structure to that of (Cu, Cu)-HDS, the bonding nature of (Cu, Ni)-HDS is slightly different from that of (Cu, Cu)-HDS. Therefore, the magnetic properties of (Cu, Ni)-HDS are significantly different from those of (Cu, Cu)-HDS. The origin of the abnormal magnetic properties of (Cu, Ni)-HDS can be explained in terms of the bonding natures of the interlayer and intralayer structures.

• 한국표면공학회지
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• 제28권4호
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• pp.243-254
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• 1995

The fabrication process of Cu-base anode for replacing Ni-base anode of molten carbonate fuel cell was investigated. Electrochemical performance and thermal stability of Cu-base anode were also investigated. Green sheet was prepared by mixing Cu and Ni powder with 1.5wt% methylcellulose and 100wt% water. The pore-size distribution of the Cu-base anode sintered at $800^{\circ}C$ for 30min showed almost uniform pore-size ranging from 4 to 20$\mu\textrm{m}$ and it was considered suitable for MCFC anode. Cu-Ni anode containing between 35 to 50wt% Ni exhibited current density of 111mA/$\textrm{cm}^2$ at 100mV overpotential and it was almost the some value for pure Ni anode. The sintering resistance of Cu-Ni increased with an increase of Ni addition. It was considered that the increase of sintering resistance was due to the decrease of diffusion rate of Cu and Ni with increasing the addition of Ni in Cu-Ni alloy.

• Journal of Welding and Joining
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• 제20권6호
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• pp.59-59
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• 2002

Sn-Ag-Cu solder is known as most competitive in many kinds of Pb-free solders. In this study, effects of solderability with plated layers such as Cu, Cu/Sn, Cu/Ni and Cu/Ni/Au were investigated. Sn-3.5Ag-0.7Cu solder balls were reflowed in commercial reflow machine (peak temp. : 250℃ and conveyer speed : 0.6m/min). In wetting test, immersion speed was 5mm/sec., immersion time 5sec., immersion depth 4mm and temperature of solder bath was 250℃. Wettability of Sn-3.5Ag-0.7Cu on Cu, Cu/Sn (5㎛), Cu/Ni (5㎛), and Cu/Ni/Au (5㎛/500Å) layers was investigated. Cu/Ni/Au layer had the best wettability as zero cross time and equilibrium force, and the measured values were 0.93 sec and 7mN, respectively. Surface tension of Sn-3.5Ag-0.7Cu solder turmed out to be 0.52N/m. The thickness of IMC is reduced in the order of Cu, Cu/Sn, Cu/Mi and Cu/Ni/Au coated layer. Shear strength of Cu/Ni, Cu/Sn and Cu was around 560gf but Cu/Ni/Au was 370gf.