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http://dx.doi.org/10.3740/MRSK.2006.16.10.614

A Study on the Thermal Stability of Cu/Ti(Ta)/NiSi Contacts  

You, Jung-Joo (Department of Electronic Materials Engineering, The University of Suwon)
Bae, Kyoo-Sik (Department of Electronic Materials Engineering, The University of Suwon)
Publication Information
Korean Journal of Materials Research / v.16, no.10, 2006 , pp. 614-618 More about this Journal
Abstract
The thermal stability of Cu/Ti(or Ta)/NiSi contacts was investigated. Ti(Ta)-capping layers deposited to form NiSi was utilized as the Cu diffusion barrier. Ti(Ta)/NiSi contacts was thermally stable upto $600^{\circ}C$. However when Cu/Ti(Ta)/NiSi contacts were furnace-annealed at $300{\sim}400^{\circ}C$ for 40 min., the Cu diffusion was found to be effectively suppressed, but NiSi was dissociated and then Ni diffused into the Cu layer to form Cu-Ni solutions. On the other hand, the Ni diffusion did not occur for the Al/Ti/NiSi system. The thermal instability of Cu/Ti(Ta)/NiSi contacts was attributed to the high heat of solution of Ni in Cu.
Keywords
Cu/Ti(Ta)/NiSi Contact; Thermal Stability; Diffusion Barrier; Cu and Ni Diffusion;
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Times Cited By KSCI : 4  (Citation Analysis)
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