• 한국재료학회지
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• 제17권9호
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• pp.463-468
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• 2007

The interdiffusion characteristics of Cu-plug/Capping Layer/NiSi contacts were investigated. Capping layers were deposited on Ni/Si to form thermally-stable NiSi and then were utilized as diffusion barriers between Cu/NiSi contacts. Four different capping layers such as Ti, Ta, TiN, and TaN with varying thickness from 20 to 100 nm were employed. When Cu/NiSi contacts without barrier layers were furnace-annealed at $400^{\circ}C$ for 40 min., Cu diffused to the NiSi layer and formed $Cu_3Si$, and thus the NiSi layer was dissociated. But for Cu/Capping Layers/NiSi, the Cu diffusion was completely suppressed for all cases. But Ni was found to diffuse into the Cu layer to form the Cu-Ni(30at.%) solid solution, regardless of material and thickness of capping layers. The source of Ni was attributed to the unreacted Ni after the silicidation heat-treatment, and the excess Ni generated by the transformation of $Ni_2Si$ to NiSi during long furnace-annealing.

• 대한화학회지
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• 제56권4호
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• pp.448-458
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• 2012

In order to develop alloy resistance in aggressive sulphat ion, the corrosion behavior of metallic glasses $Ni_{92{\cdot}3}Si_{4.5}B_{32}$, $Ni_{82,3}Cr_7Fe_3Si_{4.5}B_{3.2}$ and $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$ (at %) at different concentrations of $H_2SO_4$ solutions was examined by electrochemical methods and Scanning Electron Microscope (SEM) and X-ray Photoelectron Microscopy (XPS) analyses. The corrosion kinetics and passivation behavior was studied. A direct proportion was observed between the corrosion rate and acid concentration in the case of $Ni_{92{\cdot}3}Si_{4.5}B_{32}$ and $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$ alloys. Critical concentration was observed in the case of $Ni_{82,3}Cr_7Fe_3Si_{4.5}B_{3.2}$ alloy. The influence of the alloying element is reflected in the increasing resistance of the protective film. XPS analysis confirms that the protection film on the $Ni_{92{\cdot}3}Si_{4.5}B_{32}$ alloy was NiS which is less protective than that formed on Cr containing alloys. The corrosion rate of $Ni_{82,3}Cr_7Fe_3Si_{4.5}B_{3.2}$ and $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$. alloys containing 7% and 13% Cr are $7.90-26.1{\times}10^{-3}$ mm/y which is lower about 43-54 times of the alloy $Ni_{92{\cdot}3}Si_{4.5}B_{32}$ (free of Cr). The high resistance of $Ni_{75.5}Cr_{13}Fe_{4.2}Si_{4.5}B_{2.8}$ alloy at the very aggressive media may due to thicker passive film of $Cr_2O_3$ which hydrated to hydrated chromium oxyhydroxide.

• 한국재료학회지
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• 제27권2호
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• pp.94-99
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• 2017

Dinickel-silicide $(Ni_2Si)/glass$ was employed as a counter electrode for a dye-sensitized solar cell (DSSC) device. $Ni_2Si$ was formed by rapid thermal annealing (RTA) at $700^{\circ}C$ for 15 seconds of a 50 nm-Ni/50 nm-Si/glass structure. For comparison, $Ni_2Si$ on quartz was also prepared through conventional electric furnace annealing (CEA) at $800^{\circ}C$ for 30 minutes. XRD, XPS, and EDS line scanning of TEM were used to confirm the formation of $Ni_2Si$. TEM and CV were employed to confirm the microstructure and catalytic activity. Photovoltaic properties were examined using a solar simulator and potentiostat. XRD, XPS, and EDS line scanning results showed that both CEA and RTA successfully led to tne formation of nano $thick-Ni_2Si$ phase. The catalytic activity of $CEA-Ni_2Si$ and $RTA-Ni_2Si$ with respect to Pt were 68 % and 56 %. Energy conversion efficiencies (ECEs) of DSSCs with $CEA-Ni_2Si$ and $RTA-Ni_2Si$catalysts were 3.66 % and 3.16 %, respectively. Our results imply that nano-thick $Ni_2Si$ may be used to replace Pt as a reduction catalytic layer for a DSSCs. Moreover, we show that nano-thick $Ni_2Si$ can be made available on a low-cost glass substrate via the RTA process.

• 대한화학회지
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• 제53권3호
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• pp.233-243
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• 2009

실리카지지 니켈(Ni-Si$O_2$), 실리카지지 구리(Cu-Si$O_2$), 몇가지 조성의 실리카지지 니켈과 구리의 합금(Ni/Cu-Si$O_2$)을 실온에서 일산화탄소(CO)의 압력을 넓은 범위에서 변화시키면서(0.2 $torr{\sim}$50 torr) 흡착된 CO의 적외선 스펙트럼을 1500 $cm^{-1}{\sim}2500\;cm^{-1}$ 범위에서 관찰했고 실온에서 진공탈착시키면서 흡착된 CO의 적외선 스펙트럼을 관찰했다. Ni-Si$O_2$에 CO를 흡착시켰을 때 2059.6 $cm^{-1},\;{\sim}$2036.5 $cm^{-1},\;{\sim}$1868.7 $cm^{-1},\;{\sim}$1697.1 $cm^{-1}$의 네 흡수띠가 관찰되었고, Cu-Si$O_2$에 일산화탄소를 흡착시켰을 때 $\sim$2115.5 $cm^{-1},\;{\sim}$1743.0 $cm^{-1}$ 두 흡수띠가 관찰되었으며, Ni/Cu-Si$O_2$에서는 ${\sim}2123.2\;cm^{-1}$, 2059.6 $cm^{-1},\;{\sim}$2036.4 $cm^{-1},\;{\sim}$1899.5 $cm^{-1},\;{\sim}$1697.1 $cm^{-1}$에 다섯 흡수띠가 관찰되었다. Ni/Cu-Si$O_2$, Cu-Si$O_2$, Ni/Cu-Si$O_2$에서 CO를 흡착시켰을 때 관찰된 흡수스펙트럼은 이전의 보고와 근사적으로 일치한다. 1800 $cm^{-1}$ 이하의 흡수띠는 Ni이나 Ni/Cu 합금의 스텦이 있는 결정표면에서 관찰된 바 있는데 Ni-Si$O_2$, Ni/Cu-Si$O_2$를 실온에서 CO를 흡착시켰을 때 나타나는 ${\sim}1697.1\;cm^{-1}$ 흡수띠는 Ni이나 Ni/Cu 합금 표면에서 스텦에 인접한 흡착자리에 흡착한 CO에 기인한 흡수띠로 제시할 수 있다. Cu-Si$O_2$ 시료를 실온에서 CO를 흡착시켰을 때 Cu 결정표면에서 2000 $cm^{-1}$ 이하의 흡수띠가 관찰되는 경우는 드문데 1743.0 $cm^{-1}$ 흡수띠는 Cu 표면의 스텦에 인접한 흡착자리에 흡착한 CO에 기인한 흡수띠로 제시할 수 있다. Ni/Cu-Si$O_2$에서 Cu의 함량이 몰분율 0.5까지 변함에 따라 같은 CO 압력 또는 같은 진공탈착시간에서 흡수띠의 위치가 21 $cm^{-1}$ 이하로 다른 ⅠB 금속을 첨가했을 때보다 작게 변하는데 Cu d 전자의 리간드 효과가 작은 현상에 기인한 것으로 볼 수 있다.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제44회 동계 정기학술대회 초록집
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• pp.215-216
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• 2013

The silicide is a compound of Si with an electropositive component. Silicides are commonly used in silicon-based microelectronics to reduce resistivity of gate and local interconnect metallization. The popular silicide candidates, CoSi2 and TiSi2, have some limitations. TiSi2 showed line width dependent sheet resistance and has difficulty in transformation of the C49 phase to the low resistive C54. CoSi2 consumes more Si than TiSi2. Nickel silicide is a promising material to substitute for those silicide materials providing several advantages; low resistivity, lower Si consumption and lower formation temperature. Nickel silicide (NiSi) nanowire (NW) has features of a geometrically tiny size in terms of diameter and significantly long directional length, with an excellent electrical conductivity. According to these advantages, NiSi NWs have been applied to various nanoscale applications, such as interconnects [1,2], field emitters [3], and functional microscopy tips [4]. Beside its tiny geometric feature, NW can provide a large surface area at a fixed volume. This makes the material viable for photovoltaic architecture, allowing it to be used to enhance the light-active region [5]. Additionally, a recent report has suggested that an effective antireflection coating-layer can be made with by NiSi NW arrays [6]. A unique growth mechanism of nickel silicide (NiSi) nanowires (NWs) was thermodynamically investigated. The reaction between Ni and Si primarily determines NiSi phases according to the deposition condition. Optimum growth conditions were found at $375^{\circ}C$ leading long and high-density NiSi NWs. The ignition of NiSi NWs is determined by the grain size due to the nucleation limited silicide reaction. A successive Ni diffusion through a silicide layer was traced from a NW grown sample. Otherwise Ni-rich or Si-rich phase induces a film type growth. This work demonstrates specific existence of NiSi NW growth [7].

• The Korean Journal of Ceramics
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• 제2권1호
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• pp.19-24
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• 1996

The phase distribution and interface chemistry by the solid-state reaction between SiC and nickel were studied at temperatures between $550 \;and\; 1250^{\circ}C$ for 0.5-100 h. The reaction with the formation of silicides and carbon was first observed above $650^{\circ}C$. At $750^{\circ}C$, as the reaction proceeded, the initially, formed $Ni_3Si_2$ layer was converted to $Ni_2$Si. The thin nickel film reacted completely with SiC after annealing at $950^{\circ}C$ for 2 h. The thermodynamically stable $Ni_2$Si is the only obsrved silicide in the reaction zone up to $1050^{\circ}C$. The formation of $Ni_2$Si layers with carbon precipitates alternated periodically with the carbon free layers. At temperatures between $950^{\circ}C$ and $1050^{\circ}C$, the typical layer sequences in the reaction zone is determined by quantitative microanalysis to be $SiC/Ni_2$$Si+C/Ni_2$$Si/Ni_2$$Si+C/…Ni_2$Si/Ni(Si)/Ni. The mechanism of the periodic band structure formation with the carbon precipitation behaviour was discussed in terms of reaction kinetics and thermodynamic considerations. The reaction kinetics is proposed to estimate the effective reaction constant from the parabolic growth of the reaction zone.

• 한국주조공학회지
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• 제23권5호
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• pp.286-290
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• 2003

본 연구에서는 Ni-Zr-Ti의 3원계 합금을 기본으로 하여, Si 및 Sn 등의 원소를 첨가하여 Ni-rich 영역에서 벌크 비정질 합금을 제조하였다. $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 조성의 합금에서 injection casting에 의하여 약 58 K의 과냉각액상영역을 가지고 있는 직경 3 mm의 벌크 비정질 시편을 제조하였다. 이러한 우수한 비정질 형성능은 액상온도의 저하로 인해 낮은 온도까지 액상이 쉽게 과냉되기 때문인 것으로 사료된다. $Ni_{59}Zr_{20}Ti_{16}Si_5$ 합금은 두 단계에 걸쳐 결정화가 일어나는 반면, $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 합금은 단일 단계에 의해 orthorhombic $Ni_{10}{(Zr,Ti)}_7$ 결정상과 cubic NiTi 결정상으로 결정화가 일어난다. 벌크 비정질 $Ni_{59}Zr_{20}Ti_{16}Si_2Sn_3$ 합금의 경우 압충강도는 2.7 GPa, 연신율은 약 2% 정도의 값을 가진다.

• 한국결정성장학회지
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• 제5권4호
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• pp.358-369
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• 1995

SIC와 금속박막의 반응에 의한 표면구조 및 부착력이 550$^{\circ}C$에서 1450$^{\circ}C$의 온도범위에서 조사되어졌다. SiC/Co계에서는 850$^{\circ}C$ 이상에서, SiC/Ni계에서는 650$^{\circ}C$ 이상에서 여러 가지 규소화물이 형성된 반응이 최초로 나타났다. 코발트는 1050$^{\circ}C$, 0.5 h에서 니켈은 950$^{\circ}C$, 2h에서 SiC와 완전히 반응하여 소모되었다. SiC/Co에서는 CoSi상이 SiC/Ni에서는 Ni$_{2}$Si상이 1250$^{\circ}C$와 1050$^{\circ}C$의 반응에서까지 각각 열역학적으로 안정하게 관찰되어졌다. 탄소는 SiC/Co 반응표면에서는 1450$^{\circ}C$ 이상에서 그리고 SiC/Ni 반응표면에서는 1250$^{\circ}C$ 이상에서의 온도에서 흑연으로 결정화되었다. SiC기판과 금속박막의 임계하중이 scratch test 방법에 의하여 정성적으로 비교되어져, 850$^{\circ}C$에서 1050$^{\circ}C$의 온도범위에서 SiC/Ni couple이 20~33N의 상대적으로 높은 값을 나타내었다.

• 반도체디스플레이기술학회지
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• 제7권1호
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• pp.7-10
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• 2008

Effect of Pd addition on crystal structures of two nickel silicides, NiSi and $NiSi_2$, is investigated by using an ab initio calculation. A Pd atom substitutes a Ni and Si site, respectively, to evaluate the preferable site between them. Pd prefers Ni site to Si site in NiSi, while it prefers Si site to Ni site in $NiSi_2$. The calculated total energy also indicates that the Pd substitution to Si site stabilizes the $NiSi_2$ structure. This calculated data matches well with the experimental data obtained from Atom probe.

• 한국재료학회지
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• 제11권2호
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• pp.71-75
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• 2001

The reaction stability of nickel with side-wall materials of SiO$_2$ and Si$_3$N$_4$ on p-type 4"(100) Si substrate were investigated. Ni on 1300 $\AA$ thick SiO$_2$ and 500 $\AA$ - thick Si$_3$N$_4$ were deposited. Then the samples were annealed at 400, 500, 750 and 100$0^{\circ}C$ for 30min, and the residual Ni layer was removed by a wet process. The interface reaction stability was probed by AES depth Profiling. No reaction was observed at the Ni/SiO$_2$ and Ni/Si$_3$N$_4$, interfaces at 400 and 50$0^{\circ}C$. At 75$0^{\circ}C$, no reaction occurred at Ni/SiO$_2$ interface, while $NiO_x$ and Si$_3$N$_4$ interdiffused at Ni/Si$_3$N$_4$ interface. At 100$0^{\circ}C$, Ni layers on SiO$_2$ and Si$_3$N$_4$ oxidized into $NiO_x$ and then $NiO_x$ interacted with side-wall materials. Once $NiO_x$ was formed, it was not removed in wet etching process and easily diffused into sidewall materials, which could lead to bridge effect of gate-source/drain.