• 한국지능시스템학회:학술대회논문집
• /
• 한국퍼지및지능시스템학회 2004년도 춘계학술대회 학술발표 논문집 제14권 제1호
• /
• pp.334-337
• /
• 2004

차세대 생산 시스템(Next Generation Manufacturing System： NGMS)의 핵심 개념은 분산 생산 시스템과 다품종 소량의 유연 생산 시스템의 지원이다. 이러한 시스템의 구성을 위하여 실시간 데이터에 기반한 예측 모델이 필수적인데, 이러한 예측 기능을 통하여 생산공정의 관리와 운영, 특히 전체 공정관리를 효율적으로 수행할 수 있다. 한편, 공정으로부터 전송된 데이터는 특정한 형태의 지식으로 표현된다. 이러한 지식들은 시스템에 대한 다양한 정보를 가지고 있으므로 정보를 이용하여 시스템 상태를 빠르고 쉽게 진단할 수 있다. 공정 진단은 현재 공정 상태에서 생산되는 제품의 품질을 추정할 수 있는 정보로 활용된다. 본 논문에서는 이러한 개념이 바탕이 되어 공정관리 시스템을 설계하였다. 제안된 시스템의 적용 대상은 반도체 제조 공정의 단위 공정인 에칭 공정이다. 에칭 공정은 공정 중에 연속적인 검사가 수행되지 않고 최종 제품에 대한 검사가 수행되므로 불량 원인을 찾는 것이 쉽지 않다. 따라서 본 논문에서는 공정관리를 위한 의사지원시스템을 통해 공정의 연속적인 간접진단을 수행하고자 하였다. 본 연구에서 사용된 의사지원시스템은 각 공정에서 얻어지는 데이터와 경험적 지식을 토대로 공정시스템의 해석과 진단이 가능한 시스템이다.

• 한국전기전자재료학회논문지
• /
• 제20권3호
• /
• pp.213-217
• /
• 2007

Copper has been used as an interconnect material in the fabrication of semiconductor devices, because of its higher electrical conductivity and superior electro-migration resistance. Chemical mechanical polishing(CMP) technique is required to planarize the overburden Cu film in an interconnect process. Various problems such as dishing, erosion, and delamination are caused by the high pressure and chemical effects in the Cu CMP process. But these problems have to be solved for the fabrication of the next generation semiconductor devices. Therefore, new process which is electro-chemical mechanical polishing(ECMP) or electro-chemical mechanical planarization was introduced to solve the technical difficulties and problems in CMP process. In the ECMP process, Cu ions are dissolved electrochemically by the applying an anodic potential energy on the Cu surface in an electrolyte. And then, Cu complex layer are mechanically removed by the mechanical effects between pad and abrasive. This paper focuses on the manufacturing of ECMP system and its process. ECMP equipment which has better performance and stability was manufactured for the planarization process.

• 한국진공학회:학술대회논문집
• /
• 한국진공학회 2014년도 제46회 동계 정기학술대회 초록집
• /
• pp.445.1-445.1
• /
• 2014

Dye-sensitized solar cells (DSSCs) have been widely investigated as a next-generation solar cell because of their simple structure and low manufacturing cost. The $TiO_2$ film with thickness of $8{\sim}10{\mu}m$, which consists of nanoparticles, acts as both a scaffold with a high surface-to-volume ratio for the dye loading and a pathway to remove the electrons. However, charge carriers have to move across many particle boundaries by a hopping mechanism. So, one dimensional nanostructures such as nanotubes, nanorods and nanowires should improve charge carrier transportation by providing a facile direct electron pathway and lowering the diffusion resistance. However, the efficiencies of DSSCs using one dimensional nanostructures are less than the $TiO_2$ nanoparticle-based DSSCs. In this work, the patterned $TiO_2$ film with thickness of $3{\mu}m$ was deposited using photolithography process to decrease of electron pathway and increase of surface area and transmittance of $TiO_2$ films. Properties of the patterned $TiO_2$ films were investigated by various analysis method such as X-ray diffraction, field emission scanning electron microscopy (FESEM) and UV-visible spectrophotometer.

• 진공이야기
• /
• 제2권1호
• /
• pp.10-16
• /
• 2015

With the recognition of nanotechnology as one of the future strategic technologies, the R&D efforts have been performed under exclusive supports of governments and private sectors. At present, nanotechnology is at the focus of research and public attention in almost every advanced country including USA, Japan, and many others in EU. Keeping tracks of such technical trends, center for nanoscale mechatronics and manufacturing (CNMM) was established in 2002 as a part of national nanotechnology promotion policy led by ministry of science and technology (MOST) in Korea. It will hold widespread potential applications in electronics, optical electronics, biotechnology, micro systems, etc, with the promises of commercial visibility and competitiveness. In this paper, wafer scale multilayer nanoimprint lithography technology which is well-known the next generation lithography, roll-typed nanoimprint lithography (R-NIL), roll-typed liquid transfer imprint lithography (R-LTIL), the key technology for nanomanufacturing and nanoscale measurement technology will be introduced. Additionally, its applications and some achievements such as solar cell, biosensor, hard disk drive, and MOSFET, etc by means of the developed multilayer nanoimprint lithography system are introduced.

• 한국정밀공학회지
• /
• 제31권6호
• /
• pp.497-504
• /
• 2014

The digital signage display is actively researched as the next generation of large FPD. To commercialize those digital signage display, the manufacturing cost must be downed with printing method instead of conventional photolithography. Here, we demonstrate a reverse offset printed TFT electrodes for the digital signage display. For the fabricated source/drain and gate electrode, we used Ag ink, silicone blanket, Clich$\acute{e}$ and reverse offset printer. We printed uniform TFT electrode patterns with narrow line width(10 ${\mu}m$ range) and thin thickness(nm range). In the end the printing source/drain and gate electrode are successfully achieved by optimization of experimental conditions such as Clich$\acute{e}$ surface treatment, ink coating process, delay time, off/set process and curing temperature. Also, we checked that the printing align accuracy was within 5 ${\mu}m$.

• 마이크로전자및패키징학회지
• /
• 제20권3호
• /
• pp.1-6
• /
• 2013

TSV는 그동안 3D IC 적층을 하는데 핵심 기술로 많이 연구되어 왔고, RC delay를 줄여 소자의 성능을 향상시키고, 전체 시스템 사이즈를 줄일 수 있는 기술로 각광을 받아왔다. 최근에는 TSV를 전기적 연결이 아닌 소자의 열관리를 위한 구조로 연구되고 있다. TSV를 이용한 liquid cooling 시스템 개발은 TSV 제조, TSV 디자인 (aspect ratio, size, distribution), 배선 밀도, microchannel 제조, sealing, 그리고 micropump 제조까지 풀어야 할 과제가 아직 많이 남아있다. 그러나 TSV를 이용한 liquid cooling 시스템은 열관리뿐 아니라 신호 대기시간(latency), 대역폭(bandwidth), 전력 소비(power consumption), 등에 크게 영향을 미치기 때문에 3D IC 적층 기술의 장점을 최대로 이용한 차세대 cooling 시스템으로 지속적인 개발이 필요하다.

• 한국경제지리학회지
• /
• 제6권2호
• /
• pp.293-306
• /
• 2003

충북지역은 지역 내 총생산의 이윤부문이 외부로 유출되고 있으므로 기반산업의 육성이 필요한데 이를 위해 주력 제조업은 주 업종으로 석유화학, 반도체 업종을, 부차적인 업종은 자동차 산업으로 하고 이들 업종에 디지털 산업을 결합시켜 고부가가치의 차세대 산업동력으로 발전시켜 나가야 할 것이다. 그리고 충북지역의 지식기반 서비스업인 교육 서비스와 보건복지 및 연구개발 서비스업은 정밀화학, 생물산업의 주 업종과 부차적인 정밀기기 업종의 지원사업으로 이들 기업간의 네트워크를 형성하고 교육기관과 연계하여 지역혁신체제를 구축하여야 할 것이다.

• 반도체디스플레이기술학회지
• /
• 제15권3호
• /
• pp.35-39
• /
• 2016

Extreme Ultraviolet Lithography (EUVL) is the most promising technique in the field of Next Generation Lithography (NGL) expected to be used in the 1x-nm node for High Volume Manufacturing (HVM). But there exits remaining challenges for proper defect control of EUV mask. It was considered development of EUV pellicle for protecting the EUV mask has many obstacles due to high extinction coefficient of EUV wavelength. Recently researchers in the industry of semiconductor argue about the necessity of EUV pellicle and make effort to achieve it. In this paper, we investigated that the relationship between imaging performance and transmittance of EUV pellicle quantitatively. We made in-house EUV pellicle and analyzed its imaging performance of the dependence of pellicle transmittance using Coherent Scattering Microscopy(CSM). The imaging performance of EUV mask with pellicle is affected by its transmittance and we found that the performance of EUV mask improved with higher transmittance pellicle.

• 한국산학기술학회:학술대회논문집
• /
• 한국산학기술학회 2001년도 춘계학술대회 발표논문집
• /
• pp.124-128
• /
• 2001

A present semiconductor cleaning technology is based upon RCA cleaning technology which consumes vast amounts of chemicals and ultra pure water(UPW) and is the high temperature Process. Therefore, this technology gives rise to the many environmental issues, and some alternatives such as functional water cleaning are being studied. The electrolyzed water was generated by an electrolysis system which consists of anode, cathode, and middle chambers. Oxidative water and reductive water were obtained in anode and cathode chambers, respectively. In case of NH$_4$Cl electrolyte, the oxidation-reduction potential and pH for anode water(AW) and cathode water(CW) were measured to be +1050mV and 4.8, and -750mV and 10.0, respectively. AW and CW were deteriorated after electrolyzed, but maintained their characteristics for more than 40 minutes sufficiently enough for cleaning. Their deterioration was correlated with CO$_2$ concentration changes dissolved from air. It was known that AW was effective for Cu removal, while CW was more effective for Fe removal. The particle distributions after various particle removal processes maintained the same pattern. In this work, RCA consumed about 9$\ell$chemicals, while EW did only 400$m\ell$ HCI electrolyte or 600$m\ell$ NH$_4$Cl electrolyte. It was hence concluded that EW cleaning technology would be very effective for eliminating environment, safety, and health(ESH) issues in the next generation semiconductor manufacturing.

• 한국산학기술학회논문지
• /
• 제13권8호
• /
• pp.3618-3622
• /
• 2012

본 연구에서는 LCD 생산라인에서 장기적으로 정체상태에 있는 모듈의 수율을 높이고, 현재 TFT-LCD 생산공정에 필수적인 고압의 실리콘주입 장비 및 정밀 제어시스템을 개발하였다. 본 개발을 통하여 향후 본격생산을 준비중인 차세대 디스플레이 생산라인뿐만 아니라 중국으로 이전중인 LCD 생산 설비의 라인 환경에서 장비의 효율을 최대한 발휘함으로써 신규 투자비용을 최소화하고 최대의 효과를 창출할 수 있도록 세부 동작 시퀀스를 제어하기 위한 H/W와 S/W 시스템을 생산라인에 실장하였다. 또한, Fast-evacuating을 위한 Vacuum pump 구조를 제안하고 Pump control 회로 설계 및 실험을 통해 제품화하였다.