• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.641-641
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• 2013

We report the transparentsilver nanowire electrode fabricated by a direct printing process, liquid-bridge-mediated nanotransfer molding. We fabricated silver nanowire arrays by liquidbridge- mediated nanotransfer molding using the silver nanoparticle ink and PEDOT:PSS polymer. Weinvestigated the formation of silver nanowire arrays by SEM and transmittance of the transparent silver nanowire electrode. We also measured the conductivity to confirm the potential of our approach.

• Proceedings of the Korean Vacuum Society Conference
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• 2016.02a
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• pp.293.1-293.1
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• 2016

Various materials including conductive, dielectric, and semi-conductive materials, constitute suitable candidates for printed electronics. Metal nanoparticles (e.g. Ag, Cu, Ni, Au) are typically used in conductive ink. However, easily oxidized metals, such as Cu, must be processed at low temperatures and as such, photonic sintering has gained significant attention as a new low-temperature processing method. This method is based on the principle of selective heating of a strongly absorbent film, without light-source-induced damage to the transparent substrate. However, Cu nanoparticles used in inks are susceptible to the growth of a native copper-oxide layer on their surface. Copper-oxide-nanoparticle ink subjected to a reduction mechanism has therefore been introduced in an attempt to achieve long-term stability and reliability. In this work, a flash-light sintering process was used for the reduction of an inkjet-printed Cu(II)O thin film to a Cu film. Using a photographic lighting instrument, the intensity of the light (or intense pulse light) was controlled by the charged power (Ws). The resulting changes in the structure, as well as the optical and electrical properties of the light-irradiated Cu(II)O films, were investigated. A Cu thin film was obtained from Cu(II)O via photo-thermal reduction at 2500 Ws. More importantly, at one shot of 3000 Ws, a low sheet resistance value ($0.2527{\Omega}/sq.$) and a high resistivity (${\sim}5.05-6.32{\times}10^{-8}{\Omega}m$), which was ~3.0-3.8 times that of bulk Cu was achieved for the ~200-250-nm-thick film.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.34 no.11
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• pp.975-982
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• 2010

In this study, the laser sintering of inkjet-printed silver lines was evaluated. Silver-nanoparticle ink and a drop-ondemand (DOD) inkjet printer were used for printing on glass and polyethylene terephthalate (PET) substrates with various thicknesses. To sinter the printed silver nanoparticles, the silver layer printed on the transparent substrates was irradiated by focused CW laser beams that were incident normal to the substrates; the irradiation was carried out for various beam intensities and for various irradiation times. The electrical conductivity of the laser-sintered silver patterns was measured and compared with the conductivity of silver patterns sintered by using an oven. The increase in the temperature caused by laser irradiation was also calculated on the basis of the laser beam intensity, irradiation time, surface reflectivity, and thermophysical property of the substrate in order to estimate the increase in the electrical conductivity caused by laser sintering.

• Journal of the Microelectronics and Packaging Society
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• v.17 no.2
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• pp.1-9
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• 2010

In this paper, trends on technology of metal and ceramic nanoparticle inks using eco-friendly process were reviewed. There are two types of eco-friendly processes, dry and wet. In case of dry process, gas evaporation process was being used to synthesize the ultrafine nanoparticles. Also, in case of wet process, low temperature process excluding harmful elements such as $Cl^-$ and ${NO_3}^-$ was being used to synthesize the ultrafine nanoparticles. Sizes of nanoparticles were less than 10 nm using the eco-friendly processes, and the nanoparticles were well dispersed into ink solvent. The ink was successfully applied to fabricate directly printed pattern.

• Korean Journal of Materials Research
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• v.26 no.4
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• pp.216-221
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• 2016

A sintering process for copper based films using a rapid thermal process with infrared lamps is proposed to improve the electrical properties. Compared with films produced by conventional thermal sintering, the microstructure of the copper based films contained fewer internal and interfacial pores and larger grains after the rapid thermal process. This high-density microstructure is due to the high heating rate, which causes the abrupt decomposition of the organic shell at higher temperatures than is the case for the low heating rate; the high heating rate also induces densification of the copper based films. In order to confirm the effect of the rapid thermal process on copper nanoink, copper based films were prepared under varying of conditions such as the sintering temperature, time, and heating rate. As a result, the resistivity of the copper based films showed no significant changes at high temperature ($300^{\circ}C$) according to the sintering conditions. On the other hand, at low temperatures, the resistivity of the copper based films depended on the heating rate of the rapid thermal process.

• Journal of the Korean Society for Nondestructive Testing
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• v.34 no.5
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• pp.377-383
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• 2014

An addressable conducting network (ACN) makes it possible to monitor the condition of a structure using the electrical resistance between electrodes on the surface of a carbon fiber reinforced plastics (CFRP) structure. To improve the damage detection reliability of the ACN, the contact resistances between the electrodes and CFRP laminates needs to be minimized. In this study, silver nanoparticle electrodes were fabricated via printed electronics techniques on a CFRP composite. The contact resistance between the silver electrodes and CFRP were measured with respect to various fabrication conditions such as the sintering temperature of the silver nano-ink and the surface roughness of the CFRP laminates. The interfaces between the silver electrode and carbon fibers were observed using a scanning electron microscope (SEM). Based on this study, it was found that the lowest contact resistance of $0.3664{\Omega}$ could be achieved when the sintering temperature of the silver nano-ink and surface roughness were $120^{\circ}C$ and 0.230 a, respectively.

• Proceedings of the Materials Research Society of Korea Conference
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• 2011.05a
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• pp.1.1-1.1
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• 2011

Printed electronics based on the direct writing of solution processable functional materials have been of paramount interest and importance. In this talk, the synthesis of printable inorganic functional materials (conductors and semiconductors) for thin-film transistors (TFTs) and photovoltaic devices, device fabrication based on a printing technique, and specific characteristics of devices are presented. For printable conductor materials, Ag ink is designed to achieve the long-term dispersion stability and good adhesion property on a glass substrate, and Cu ink is sophisticatedly formulated to endow the oxidation stability in air and even aqueous solvent system. The both inks were successfully printed onto either polymer or glass substrate, exhibiting the superior conductivity comparable to that of bulk one. In addition, the organic thin-film transistor based on the printed metal source/drain electrode exhibits the electrical performance comparable to that of a transistor based on a vacuum deposited Au electrode. For printable amorphous oxide semiconductors (AOSs), I introduce the noble ways to resolve the critical problems, a high processing temperature above $400^{\circ}C$ and low mobility of AOSs annealed at a low temperature below $400^{\circ}C$. The dependency of TFT performances on the chemical structure of AOSs is compared and contrasted to clarify which factor should be considered to realize the low temperature annealed, high performance AOSs. For photovoltaic application, CI(G)S nanoparticle ink for solution processable high performance solar cells is presented. By overcoming the critical drawbacks of conventional solution processed CI(G)S absorber layers, the device quality dense CI(G)S layer is obtained, affording 7.3% efficiency CI(G)S photovoltaic device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.36 no.5
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• pp.454-462
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• 2023

Flash lamp annealing (FLA) of metal nanoparticle (NP) ink has provided powerful strategies to fabricate high-performance electrodes on a flexible substrate because of its rapid processing capability (in milliseconds), low-temperature process, and compatibility with to roll-to-roll process. However, metal NPs [e.g., gold (Au), silver (Ag), copper (Cu), etc.] have limitations such as difficulty in synthesizing fine metal NPs (diameter less than 10 nm), high price, and degradation during ink storage and FLA processing. In this regard, organometallic ink has been proposed as a material that can replace metal NPs due to their low-cost (usually 1/100 times cheaper than metal nano inks), low-temperature processability, and high material stability. Despite these advantages, the fabrication of flexible electrodes through FLA treatment of organometallic compounds has not been extensively researched. In this paper, we experimentally guide how to determine the optimal conditions for forming electrodes on flexible substrates by considering material parameters, and flashlight processing parameters (energy density, pulse duration, etc) to minimize the difficulties that may arise during the FLA of organometallic ink.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2011.06a
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• pp.675-676
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• 2011

• Journal of the Microelectronics and Packaging Society
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• v.17 no.1
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• pp.33-39
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• 2010

Printing technologies have been indicated as alternative methods for patterning conductive, semi-conductive or insulative materials on account of their low-cost, large-area patternability and pattern flexibility. For application of the printing technologies in manufacture of semiconductor or display modules, ink or paste composed of nanoparticles, solvent and additives are basically needed. Here, we report recent advances in eco-friendly nano-ink technology for semiconductor and display technology. Then, we will introduce an eco-friendly ink formation technology developed in our group with an example of manufacturing $SiO_2$ nanopowders and inks. We tried to manufacture ultrafine $SiO_2$ nanoparticles by applying a low-temperature synthetic method, and then attempted to fabricate the printed $SiO_2$ film onto the glass substrate to see whether the $SiO_2$ nanoparticles are feasible for the printing or not. Finally, the electrical characteristics of the films were measured to investigate the effect of the manufacturing parameters.