• Journal of Powder Materials
• /
• v.10 no.4
• /
• pp.262-269
• /
• 2003

Nano-sized Ni-ferrite powder was fabricated by spray pyrolysis process using the waste solution resulting from shadow mask processing. The average particle size of the powder was below 100 nm. The effects of the concentration of raw material solution, the nozzle tip size and air pressure on the properties of powder were studied. As the concentration increased, the average particle size of the powder gradually increased and its specific surface area decreased, but size distribution was much wider and the fraction of the Ni-ferrite phase greatly increased as the concentration increasing. As the nozzle tip size increased from 1 mm to 2 mm, the average particle size of the powder decreased. In case of 3 mm nozzle tip size, the average particle size of the powder increased slightly. On the other hand, in case of 5 mm nozzle tip size, average particle size of the powder decreased. Size distribution of the powder was unhomogeneous, and the fraction of the Ni-ferrite phase decreased as the nozzle tip size increasing. As air pressure increased up to 1 kg/$cm^2$, the average particle size of the powder decreased slightly, on the other hand, the fraction of the Ni-ferrite phase was almost constant. In case of 3kg/$cm^2$ air pressure, average particle size of the powder and the fraction of the Ni-ferrite phase remarkably decreased, but size distribution was narrow.

• Journal of Powder Materials
• /
• v.14 no.1 s.60
• /
• pp.26-31
• /
• 2007

Manufacturing bulk nanostructured materials with least grain growth from initial powders is challenging because of the bottle neck of bottom-up methods using the conventional powder metallurgy of compaction and sintering. In this study, bottom-up type powder metallurgy processing and top-down type SPD (Severe Plastic Deformation) approaches were combined in order to achieve both real density and grain refinement of metallic powders. ECAP (Equal Channel Angular Pressing), one of the most promising processes in SPD, was used for the powder consolidation method. For understanding the ECAP process, investigating the powder density as well as internal stress, strain distribution is crucial. We investigated the consolidation and plastic deformation of the metallic powders during ECAP using the finite element simulations. Almost independent behavior of powder densification in the entry channel and shear deformation in the main deformation zone was found by the finite element method. Effects of processing parameters on densification and density distributions were investigated.

• Transactions of Materials Processing
• /
• v.28 no.5
• /
• pp.239-246
• /
• 2019

Various surface texturing techniques have been studied because of the effective applicability of micro or nano scale surface patterns. Particularly, the most promising types of patterns include the hierarchical patterns, which consists of micro/nano structures. Different processes such as MEMS, laser machining, micro cutting and micro grinding have been applied in the production of hierarchical patterns on various material surfaces. This study demonstrates the process of hot imprinting to induce the hierarchical patterns on the Al alloy surfaces. Wire electrical discharge machining (WEDM) process was used to imprint molds with micro scale sinusoidal pattern. In addition, the sinusoidal pattern with rough surface morphology was obtained as a result of the discharge craters. Consequently, the hierarchical patterns consisting of the sinusoidal pattern and the discharge craters were prepared on the imprinting mold surface. Hot imprinting process for the Al plates was conducted on the prepared mold, and the replication performance was analyzed. As a result, it was confirmed that the hierarchical patterns of the mold were effectively duplicated on the surface of Al plate.

• Journal of Ceramic Processing Research
• /
• v.13 no.spc2
• /
• pp.295-299
• /
• 2012

We investigated the crystal and the optical properties of GaN-based blue light emitting diodes (LEDs) which were simultaneously grown on c-plane (0001) and semipolar (11-22) GaN templates by using metal-organic chemical vapor deposition (MOCVD). The X-ray rocking curves (XRCs) full width at half maximums (FWHMs) of c-plane (0001) and semipolar (11-22) GaN templates were 275 and 889 arcsec, respectively. In addition, high-resolution X-ray ω-2θ scan showed that satellite peaks of semipolar (11-22) InGaN quantum-wells (QWs) was weaker and broader than that of c-plane (0001) InGaN QWs, indicating that the interface quality of c-plane (0001) QWs was superior to that of semipolar (11-22) QWs. Photoluminescence (PL) and electroluminescence (EL) results showed that the emission intensity and the FWHMs of polar c-plane (0001) LED were much higher and narrower than those of semipolar (11-22) LED, respectively. From these results, we believed that relative poor crystal quality of semipolar (11-22) GaN template might give rise to the poor interfacial quality of QWs, resulting in lower output power than conventional c-plane (0001) GaN-based LEDs.

• Laser Solutions
• /
• v.17 no.2
• /
• pp.19-25
• /
• 2014

Optical embedded diffraction gratings with the bulk modification in BK-7 glass plates excited by tightly focused high-intensity femtosecond (130fs) Ti: sapphire laser (peak wavelength = 790nm) were demonstrated. The structural modifications with diameters ranging from 400nm to $4{\mu}m$ were photo-induced after plasma formation occurred upon irradiation with peak intensities of more than $1{\times}1013W/cm^2$. The graded refractive index profile was fabricated to be a symmetric around from the center of the point at which low-density plasma occurred. The maximum refractive index change was estimated to be $1.5{\times}10^{-2}$. The two optical embedded gratings in BK-7 glass plate were demonstrated with refractive index modification induced by the scanning of low-density plasma formation.

• The Journal of the Korea institute of electronic communication sciences
• /
• v.11 no.9
• /
• pp.877-884
• /
• 2016

Nano communication system technologies are future core technologies that facilitate the implementation of tiny wireless communication systems with sizes in the range of hundreds of nanometers to tens of micrometers, which cannot be implemented by current wireless communication system technologies. In particular, novel nano communication system technology, which is based on electrical and mechanical resonance characteristics of carbon nanotube(: CNT), does not simply miniaturize system modules, but suggests a new approach that changes system architectures. Therefore, this paper surveys the state of the art on CNT-based nano communication technologies in aspects of system implementation, and proposes important research issues for convergence of nano and communication technologies.

• Transactions of Materials Processing
• /
• v.16 no.1 s.91
• /
• pp.20-24
• /
• 2007

Polypropylene substrate with hair-like nano features(aspect $ratio{\sim}10$) on the surface is fabricated by injection molding process. Pure aluminum plate is anodized to have nano pore array on the surface and used as a stamper for molding nano features, The size and the thickness of the stamper is $30mm{\times}30mm$ and 1mm. The fabricated pore is about 120nm in diameter and 1.5 um deep. For molding of a substrate with nano-hair type of surface features, the stamper is heated up over $150^{\circ}C$ before the filling stage and cooled down below $70^{\circ}C$ after filling to release the molded part. For heating the stamper, stamper itself is used as a heating element by applying electrical power directly to each end of the stamper. The stamper becomes cooled down without circulation of coolant such as water or oil. With this new stamper heating method, nano hairs with aspect ratio of about 10 was successfully injection molded. We also found the heating & cooling process of the stamper is good for releasing of molded nano-hairs.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2007.05a
• /
• pp.371-374
• /
• 2007

A method for metal nano powder imprinting is proposed as a patterning process for conductive tracks that is inexpensive and scalable down to the nanoscale. Conductive tracks with line widths of $0.5{\sim}20{\mu}m$ were fabricated using this method. The processing conditions were optimized to avoid various types of defects, and to increase the degree of sintering and electric conductivity of the imprinted conductive tracks. The mean electric resistivity of the conductive tracks imprinted under optimum conditions was $8.95{\mu}{\Omega}{\cdot}cm$, which is in the range required for practical applications.

• Proceedings of the Materials Research Society of Korea Conference
• /
• 2003.11a
• /
• pp.65-65
• /
• 2003

Chemical mechanical polishing (CMP) is one of the most important processes in recent ULSI (Ultra Large Scale Integrated Circuit) manufacturing technology. Recently, ceria slurries with surfactant have recently been used in STI-CMP,[1] became they have high oxide-to-nitride removal selectivity and widen the processing margin The role of the abrasives, however, on the effect of planarization on STI-CMP is not yet clear. In this study, we investigated how the crystal characteristic affects the planarization efficiency of wafer surface with controlling crystallite size and poly crystalline abrasive size independently.

• Transactions on Electrical and Electronic Materials
• /
• v.11 no.2
• /
• pp.89-91
• /
• 2010

Partial discharge (PD) resistances were investigated for three types of samples: original epoxy resins, epoxy micro composites with and without the silane processing, and mixture composites with micro and nano particles. The PD was applied to these materials using rod, gap, and plane electrodes. The partial discharge resistance found in the micro composites was better than that found in the original epoxy resin. Moreover, the mixture composites of $SiO_2$ nano and micro particles had much larger resistances than the original epoxy resin or microcomposites. It can be regarded that this excellent property was due to the fact that the nano particles have a dense structure between the micro particles.