Browse > Article
http://dx.doi.org/10.4313/TEEM.2010.11.2.089

The Partial Discharge Resistances of Epoxy-Nano-and-Micro Composites  

Lee, Chang-Hoon (Department of Electrical Electronic Engineering, Joongbu University)
Park, Jae-Jun (Department of Electrical Electronic Engineering, Joongbu University)
Publication Information
Transactions on Electrical and Electronic Materials / v.11, no.2, 2010 , pp. 89-91 More about this Journal
Abstract
Partial discharge (PD) resistances were investigated for three types of samples: original epoxy resins, epoxy micro composites with and without the silane processing, and mixture composites with micro and nano particles. The PD was applied to these materials using rod, gap, and plane electrodes. The partial discharge resistance found in the micro composites was better than that found in the original epoxy resin. Moreover, the mixture composites of $SiO_2$ nano and micro particles had much larger resistances than the original epoxy resin or microcomposites. It can be regarded that this excellent property was due to the fact that the nano particles have a dense structure between the micro particles.
Keywords
Epoxy nano-and-micro mixture composites; Nanocomposites; Microcomposites; Original epoxy resins; Partial discharge resistance;
Citations & Related Records
Times Cited By KSCI : 1  (Citation Analysis)
연도 인용수 순위
1 M. Kozako, N. Fuse, K. Shibata, N. Hirai, Y. Ohki, T. Okamoto, and T. Tanaka, Annual Report Conference on Electrical Insulation and Dielectric Phenomena (Albuquerque, NM 2003 Oct. 19-22, IEEE Dielectrics and Insulation Society) p. 75.
2 M. Kozako, N. Fuse, Y. Ohki, T. Okamoto, and T. Tanaka, IEEE Trans. Dielectr. Electr. Insul. 11, 833 (2004) [DOI: 10.1109/ TDEI.2004.1349788].   DOI   ScienceOn
3 M. Kozako, R. Kido, N. Fuse, Y. Ohki, T. Okamoto, and T. Tanaka, Annual Report Conference on Electrical Insulation and Dielectric Phenomena (Boulder, CO 2004 Oct. 17-20, IEEE Dielectrics and Electrical insulation Society) p. 398. [DOI: 10.1109/CEIDP.2004.1364271].   DOI
4 M. Kozako, R. Kido, T. Imai, T. Ozaki, T. Shimizu, and T. Tanaka, Proceedings of 2005 International Symposium on Electrical Insulating Materials (ISEIM 2005) (Kitakyushu, Japan 2005 Jun. 5-9, IEEE Dielectrics and Electrical Insulation Society) p. 661.
5 M. Kozako, S. Yamano, R. Kido, Y. Ohki, M. Kohtoh, S. Okabe, and T. Tanaka, Proceedings of 2005 International Symposium on Electrical Insulating Materials (ISEIM 2005) (Kitakyushu, Japan 2005 Jun. 5-9, IEEE Dielectrics and Electrical Insulation Society) p. 231. [DOI: 10.1109/ISEIM.2005.193385].   DOI
6 J. J. Park, J. KIEEME 21, 749 (2008).
7 J. H. Ahn and J. J. Park, J. KIEEME 20, 348 (2007).
8 T. Tanaka, S. Kuge, M. Kozako, T. Imai, T. Ozaki, and T. Shimizu, International Conference on Electrical Engineering (ICEE '06) (San Juan, PR 2006 Jul. 23-28, The International Network for Engineering Education and Research) p. 4.
9 T. Tanaka, Y. Ohki, M. Ochi, M. Harada, and T. Imai, IEEE Trans. Dielectr. Electr. Insul. 15, 81 (2008) [DOI: 10.1109/TDEI. 2008.4446739].   DOI
10 T. Imai, F. Sawa, T. Ozaki, T. Shimizu, S.-c. Kuge, M. Kozako, and T. Tanaka, IEEJ Trans. Fundam. Mater. 126, 1136 (2006) [DOI:10.1541/ieejfms.126.1136].   DOI   ScienceOn