• Title/Summary/Keyword: Nano-copper

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Effective Control of CH4/H2 Plasma Condition to Synthesize Graphene Nano-walls with Controlled Morphology and Structural Quality

  • Park, Hyun Jae;Shin, Jin-ha;Lee, Kang-il;Choi, Yong Sup;Song, Young Il;Suh, Su Jeong;Jung, Yong Ho
    • Applied Science and Convergence Technology
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    • v.26 no.6
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    • pp.179-183
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    • 2017
  • The direct growth method is simplified manufacturing process used to avoid damages and contaminants from the graphene transfer process. In this paper, graphene nano-walls (GNWs) were direct synthesized using electron cyclotron resonance (ECR) plasma by varying the $CH_4/H_2$ gas flow rate on the copper foil at low temperature (without substrate heater). Investigations were carried out of the changes in the morphology and characteristic of GNWs due to the relative intensity of hydrocarbon radical and molecule in the ECR plasma. The results of these investigations were then discussed.

Characteristics of VOx Thin Film, NiOx Thin Film, and CuIx Thin Film for Carrier Selective Contacts Solar Cells (전하선택접촉 태양전지 적용을 위한 VOx 박막, NiOx 박막, CuIx 박막의 특성 연구)

  • Kiseok Jeon;Minseob Kim;Eunbi Lee;Jinho Shin;Sangwoo Lim;Chaehwan Jeong
    • Current Photovoltaic Research
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    • v.11 no.2
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    • pp.39-43
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    • 2023
  • Carrier-selective contacts (CSCs) solar cells are considerably attractive on highly efficient crystalline silicon heterojunction (SHJ) solar cells due to their advantages of high thermal tolerance and the simple fabrication process. CSCs solar cells require a hole selective contact (HSC) layer that selectively collects only holes. In order to selectively collect holes, it must have a work function characteristic of 5.0 eV or more when contacted with n-type Si. The VOx, NiOx, and CuIx thin films were fabricated and analyzed respectively to confirm their potential usage as a hole-selective contact (HSC) layer. All thin films showed characteristics of band-gap engergy > 3.0 eV, work function > 5.0 eV and minority carrier lifetime > 1.5 ms.

Some nanotoxicity effects of copper (60-80 nm) and copper oxide (40 nm) nanoparticles on Artemia salina

  • Isil Canan Cicek Cimen;Durali Danabas;Mehmet Ates
    • Advances in nano research
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    • v.16 no.5
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    • pp.501-508
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    • 2024
  • In this study, nanotoxicity tests were made by exposure of Artemia salina to copper (Cu 60-80 nm) and copper oxide (CuO 40 nm) nanoparticles (NPs) at different concentrations (0.2, 1, 5, 10, 25, and 50 mg/L). The LC50 value of Cu (60-80 nm) NPs on the A. salina individuals at the beginning (0), 24th, 48th and 72nd hours and elimination period was 52.37 mg/L while the LC50 value of CuO (40 nm) NPs was 55.39 mg/L. The results of UV-Vis absorbance values showed that all statistical data revealed that maximum effect was observed between 24-30 hours and 25 ppm absorbance concentration was more effective. The multiple R, correlation coefficient (R2) and adjusted R2 values of Cu NP for the suitable Quadratic model were, respectively; 92.96 %, 86.42 % and 76.71 % while they are 98.31 %, 96.64 % and 94.25 % for CuO NP. Also, the data, was indicated effect size significantly changed based on the type and size of NP. Considering the microscope results, it was clearly noticed that A. salina organisms took the NPs in to their body. The accumulation in the gut of A. salina was observed and the images were taken with phase contrast microscope for both of NPs. The highest decrease for survival rates of A. salina individuals exposed to Cu NP was observed in the 10 ppm concentration (43.47 %) and in the 5 ppm concentration (46.20 %) for CuO NP. The results revealed that Cu and CuO NPS showed different toxic effects and that Cu NPs were more toxic than CuO.

Self-assembly Coordination Compounds of Cu(II), Zn(II) and Ag(I) with btp Ligands (btp = 2,6-bis(N'-1,2,4-triazolyl)pyridine):Counteranion Effects

  • Kim, Cheal;Kim, Sung-Jin;Kim, Young-Mee
    • Korean Journal of Crystallography
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    • v.16 no.2
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    • pp.107-127
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    • 2005
  • Five Cu(II) compounds were obtained from different copper salts with btp ligands, and their structures were determined by X-ray crystallography. The structure of coordination polymer 2 contains btp-bridged tetranuclear Cu(II) units weakly connected by nitrate ions, and the structure of a discrete Cu(II) molecule 1 contains acetates and btp ligands. With perchlorate anions, two btp ligands bridge Cu(II) ions to form a double zigzag chain 3, while a single zigzag chain 4 is created with sulfate anions. The reaction of $Cu(NO_{3})_{2}$ containing $NH_{4}PF_{6}$ with btp ligands also produced a polymeric compound 5 containing $Cu(H_{2}O)_{2}^{2+}$ and $Cu(NO_{3})_{2}$ units alternatively bridged by btp ligands with H-bonds between copper bonded water and nitrate oxygen atoms. Five Zn(II) compounds were obtained from different zinc salts with btp ligands, and the structures of polymeric compounds (6, 7 and 8) and monomeric compounds (9 and 10) were determined by X-ray crystallography. With nitrate, chloride and bromide anions, btp ligands bridge Zn(II) ions to form polymeric compounds (6, 7 and 8), but btp ligands coordinate to a Zn(II) ion to form monomeric complexes (9 and 10) with $PF_{6}^{-}$ and perchlorate anions. Four silver salts and btp ligands produced two kinds of structures, dinuclear 20-membered rings and one-dimensional zigzag chain depending on different anions. For $ClO_{4}^{-}$ and OTf anions, weak interactions between Ag(I) and anions make dinuclear 20-membered rings construct polymeric compounds (11 and 13). For $PF_{6}^{-}$ anion, there are also weak interactions between Ag(I) and $F(PF_{6}^{-})(12)$, but they do not construct a polymeric compound. For $O_{2}CCF_{3}^{-}$ anion, btp ligands bridge Ag(I) atoms to make one-dimensional zigzag chain (14), and there are also interactions between Ag(I) and anions.

Analysis and Design of Planar Textile Resonator for Wearable Magnetic Resonance-Wireless Power Transfer (의복용 자기공진형 무선전력전송 시스템을 위한 평면형 직물공진기의 설계 및 연구)

  • Kang, Seok Hyon;Jung, Chang Won
    • Journal of the Institute of Electronics and Information Engineers
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    • v.53 no.8
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    • pp.119-126
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    • 2016
  • In this paper, we proposed the planar textile resonator for constructing wearable MR-WPT system and analyzed the characteristic of textile substrates used in resonators. The planar textile resonators were designed to resonate at 1-10 MHz. The loop and coil were fabricated planar structure on textile substrate using conductive materials. Polyester fiber and cotton widely used in real life were chosen as textile resonators for wearable applications and copper tape and silver paste were used for fabricating planar loop and coil on textile substrate. For comparison analysis on transfer efficiency according to the types of textile, transmitter and receiver parts were symmetric. According to the result, for the highest transfer efficiency of wearable WPT system, the planar resonators have specifications of relative thick textile substrate with low permittivity and low surface resistance of conductive pattern. The performed experiments show that the planar textile resonator is possible to be used for resonator in wearable MR-WPT system.

Effect of Post-Annealing Conditions on Interfacial Adhesion Energy of Cu-Cu Bonding for 3-D IC Integration (3차원 소자 집적을 위한 Cu-Cu 접합의 계면접착에너지에 미치는 후속 열처리의 영향)

  • Jang, Eun-Jung;Pfeiffer, Sarah;Kim, Bi-Oh;Mtthias, Thorsten;Hyun, Seung-Min;Lee, Hak-Joo;Park, Young-Bae
    • Korean Journal of Materials Research
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    • v.18 no.4
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    • pp.204-210
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    • 2008
  • $1.5\;{\mu}m$-thick copper films deposited on silicon wafers were successfully bonded at $415^{\circ}C$/25 kN for 40 minutes in a thermo-compression bonding method that did not involve a pre-cleaning or pre-annealing process. The original copper bonding interface disappeared and showed a homogeneous microstructure with few voids at the original bonding interface. Quantitative interfacial adhesion energies were greater than $10.4\;J/m^2$ as measured via a four-point bending test. Post-bonding annealing at a temperature that was less than $300^{\circ}C$ had only a slight effect on the bonding energy, whereas an oxygen environment significantly deteriorated the bonding energy over $400^{\circ}C$. This was most likely due to the fast growth of brittle interfacial oxides. Therefore, the annealing environment and temperature conditions greatly affect the interfacial bonding energy and reliability in Cu-Cu bonded wafer stacks.

Synthesis of Nano Sulfur/Chitosan-Copper Complex and Its Nematicidal Effect against Meloidogyne incognita In Vitro and on Coffee Pots

  • Hong Nhung Nguyen;Phuoc Tho Tran;Nghiem Anh Tuan Le;Quoc Hien Nguyen;Duy Du Bui
    • The Plant Pathology Journal
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    • v.40 no.3
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    • pp.261-271
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    • 2024
  • Sulfur is one of the inorganic elements used by plants to develop and produce phytoalexin to resist certain diseases. This study reported a method for preparing a material for plant disease resistance. Sulfur nanoparticles (SNPs) stabilized in the chitosan-Cu2+ (CS-Cu2+) complex were synthesized by hydrolysis of Na2S2O3 in an acidic medium. The obtained SNPs/CS-Cu2+ complex consisting of 0.32% S, 4% CS, and 0.7% Cu (w/v), contained SNPs with an average size of ~28 nm as measured by transmission electron microscopy images. The X-ray diffraction pattern of the SNPs/CS-Cu2+ complex showed that SNPs had orthorhombic crystal structures. Interaction between SNPs and the CS-Cu2+ complex was also investigated by ultraviolet-visible. Results in vitro nematicidal effect of materials against Meloidogyne incognita showed that SNPs/CS-Cu2+ complex was more effective in killing second-stage juveniles (J2) nematodes and inhibiting egg hatching than that of CS and CS-Cu2+ complex. The values of LC50 in killing J2 nematodes and EC50 in inhibiting egg hatching of SNPs/CS-Cu2+ complex were 75 and 51 mg/l, respectively. These values were lower than those of CS and the CS-Cu2+ complex. The test results on the nematicidal effect against M. incognita on coffee pots showed that the SNPs/CS-Cu2+ complex was 100% effective at a concentration of 150 mg/l. Therefore, the SNPs/CS-Cu2+ complex could be considered as a biochemical material with potential for agricultural applications to control root-knot nematodes.

A Study on the standardize the characteristic evaluation of DC magnetron sputtered silver coatings for engineering purposes (D.C. magnetron sputter를 이용한 Ag layer 건식 도금층의 특성 평가 국제 표준화에 대한 연구)

  • Gyawali, Gobinda;Choi, Jinhyuk;Lim, Tae Kwan;Jung, Myoung Joon;Lee, Soo Wohn
    • Proceedings of the Korean Institute of Surface Engineering Conference
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    • 2015.11a
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    • pp.249-249
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    • 2015
  • Silver films have been of considerable interest for years due to their better performance relative to other metal films for engineering applications. A series of multi-layer silver coatings with different thickness (i.e. 0.3 um to 1.5 um) were prepared on Aluminium substrate containing copper undercoat by direct current (DC) magnetron sputtering method. For the comparative purpose, similar thickness silver coatings were prepared by electrolytic deposition method. Microstructural, morphological, and mechanical characteristics of the silver coatings were evaluated by means of scanning electron microscope (SEM), X-ray diffraction (XRD), Surface roughness test, microhardness test and nano-scratch test. From the results, it has been elucidated that the silver films prepared by DC magnetron sputtering method has superior properties in comparison to the wet coating method. On the other hand, DC magnetron sputtering method is relatively easier, faster, eco-friendly and more productive than the electrolytic deposition method that uses several kinds of hazardous chemicals for bath formulation. Therefore, a New Work Item Proposal (NWIP) for the test methods standardization of DC magnetron sputtered silver coatings has recently been proposed via KATS, Korea and a NP ballot is being progressed within a technical committee "ISO/TC107-metallic and other inorganic coating".

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Effect of Nano-Bubble on Removal of Complex Heavy Metals (나노버블이 복합중금속(구리/납) 오염물 제거에 미치는 영향 분석)

  • Lee, Yang-Gyu;Han, Jung-Geun;Choi, Ju-Hyun;Kim, Dong-Chan;You, Seung-Kyong;Hong, Kikwon
    • Journal of the Korean Geosynthetics Society
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    • v.14 no.4
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    • pp.139-146
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    • 2015
  • This paper describes a effect of nano-bubble on removal of complex heavy metals, in order to remove pollutants of soil with copper (Cu) and lead (Pb) based on column test. It was conducted column test considering inflow and fine soil contents condition, and then it was analyzed removal effect of nano-bubble on Cu and Cu/Pb. The test result showed that the removal effect of the nano-bubble was higher than that of distilled water regardless of fine soil contents in case of Cu pollutant, and the removal effect of nano-bubble on heavy metals was found to have a significant impact on Pb than Cu in case of Cu/Pb pollutants. It was also analyzed that engineering properties (like a flow path and permeability) of soil due to void ratio has influenced a significant impact the pollutants removal of nano-bubble. The test results determined that nano-bubble can be applied as a flushing agent for priority target pollutant in complex heavy metals.

Peel strengths of the Composite Structure of Metal and Metal Oxide Laminate (Metal과 Metal Oxidefh 구성된 복합구조의 Peel Strength)

  • Shin, Hyeong-Won;Jung, Taek-Kyun;Lee, Hyo-Soo;Jung, Seung-Boo
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.4
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    • pp.13-16
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    • 2013
  • A lot of various researches have been going on to use heat spreader for LED module. Nano porous aluminum anodic oxide (AAO) applied LED, which is produced from anodization, is easy and economically advantageous. Convensional LED module is consist of aluminum/adhesive/copper circuit. The polymer adhesive in this module is used as heat spreader. However the thermal emission of LED component is degraded because of low heat conductivity of polymer and also reliability of LED component is reduced. Therefore, AAO in this work was applied to heat spreader of LED module which has higher heat conductivity compare to polymer. Bonding strength between AAO and copper circuit was improved with Ti/Cu seed layer by copper sputtering process (DBC) before the bonding. And this copper circuit has been fabricated by electro plating method. Peel strength of AAO and copper circuit in this work showed range between 1.18~1.45 kgf/cm with anodizing process which is very suitable for high power LED application.