• Title/Summary/Keyword: Nano Lapping Surface

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Study on Experimental Modeling and Estimation of Roughness of Nanoscale Lapping Surface Based on Laser Scattering Patterns (레이저산란패턴 기반 나노 래핑 표면 거칠기의 실험적 모델링 및 추정에 관한 연구)

  • Hong, Yeon-Ki;Kim, Gyung-Bum
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.35 no.1
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    • pp.107-114
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    • 2011
  • In this study, a correlation between the roughness of nanoscale lapping surface and its laser scattering pattern has been identified experimentally. The characteristics of laser scattering on a reflected surface are investigated, and a laser scattering mechanism is newly designed by adopting the dark-field method. Laser scattering patterns resulting from nanoscale lapping shape are in the shape of crossed irregular lattice. In addition, optimum laser scattering images are obtained by the design of experiment, and the roughness of nanoscale lapping surface is estimated using regression analysis certain useful features of the laser scattering patterns. The results of fifty experiments on three types of nanoscale lapping surfaces show that the roughness of nanoscale lapping surfaces can be accurately estimated by the proposed mathematical modeling method.

Thick Copper Substrate Fabrication by Air-Cooled Lapping and Post Polishing Process (공기 냉각 방식의 래핑을 이용한 구리 기판 연마 공정 개발)

  • Lee, Ho-Cheol;Kim, Dong-Jun;Lee, Hyun-Il
    • Journal of the Korean Society of Manufacturing Technology Engineers
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    • v.19 no.5
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    • pp.616-621
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    • 2010
  • New type of the base material of the light-emitting diode requires copper wafer in view of heat and electrical conductance. Therefore, polishing process of the substrate level is needed to get a nanometer level of surface roughness as compared with pattern structure of nano-size in the semiconductor industry. In this paper, a series of lapping and polishing technique is shown for the rough and deflected copper substrate of thickness 3mm. Lapping by sand papers tried air cooling method. And two steps of polishing used the diamond abrasives and the $Al_2O_3$ slurry of size 100mm considering the residual scratch. White-light interferometer proved successfully a mirror-like surface roughness of Ra 6nm on the area of $0.56mm{\times}0.42mm$.

Comparative Study on the Grinded Surface Characteristics of Quartz Glass and SF-5 Glass using ELID(Electrolytic In-Process Dressing) Grinding (수정유리와 SF-5 유리의 ELID 연삭특성 비교)

  • 박상후;양동열;곽태수;오오모리히토시
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 2003.06a
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    • pp.94-97
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    • 2003
  • A precise fabrication technology of glass is increasingly demanded fer the latest Industrial applications of spherical lenses. micro-optical components, laser applications and so on. Most of cases, the surface roughness of glass is required to be minute for improving the optical characteristics. Then. the machining characteristics of SF-5 glass and quarts glass were studied by using the ELID grinding process to get mirror surface and productivity compared with a general lapping process. A rotary type grinder with ELID generator was used to make the mirror surface of glass and a Mitutoyo surface tester and a nano-hardness tester were also used to measure the grinded surface or glass. As the results of experiments. they showed that the surface roughness(Ra) of SF-5 glass was under 7.8 nm and that of quartz glass was under 3.0 nm using the # 8000 grinder. So, the possibility of highly efficient and accurate surface for optical components can be achieved by the ELID grinding process.

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A Study on the Nano Grinding of Sapphire by Ultra-Precision Grinder (초정밀 연삭기에 의한 사파이어의 나노가공)

  • 김우순;김동현;난바의치
    • Transactions of the Korean Society of Machine Tool Engineers
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    • v.12 no.5
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    • pp.40-45
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    • 2003
  • Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

Wear characteristics on particle volume fraction of nano silica composite materials (입자 함유율의 변화에 따른 나노 실리카 복합재료의 마모 특성)

  • Lee, Jung-Kyu;Koh, Sung Wi
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.49 no.4
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    • pp.492-499
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    • 2013
  • The characteristics of abrasive wear of the rubber matrix composites filled with nano sized silica particles were investigated at ambient temperature by pin-on-disc friction test. The range of volume fraction of silica particles tested are between 11% to 25%. The cumulative wear volume and friction coefficient of these materials on particle volume fraction were determined experimentally. The major failure mechanisms were lapping layers, deformation of matrix, ploughing, deboding of particles and microcracking by scanning electric microscopy photograph of the tested surface. The cumulative wear volume showed a tendency to increase nonlinear with increase of sliding distance. As increasing the silica particles of these composites indicated higher friction coefficient.

A Study on the Zeta-potential of CMP processed Sapphire Wafers (CMP 가공된 사파이어웨이퍼의 웨이퍼내 표면전위에 관한 연구)

  • Hwang Sung Won;Shin Gwisu;Kim Keunjoo
    • Journal of the Korean Society for Precision Engineering
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    • v.22 no.2
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    • pp.46-52
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    • 2005
  • The sapphire wafer was polished by the implementation of the surface machining technology based on nano-tribology, The removal process has been performed by grinding, lapping and chemical-mechanical polishing. For the chemical mechanical polishing process, the chemical reaction between the slurry and sapphire wafer was investigated in terms of the change of Zeta-potential between two materials. The Zeta-potential was -4.98 mV without the slurry in deionized water and was -37.05 mV for the slurry solution. By including the slurry into the deionized water the Zeta-potential -29.73 mV, indicating that the surface atoms of sapphire become more repulsive to be easy to separate. The average roughness of the polished surface of sapphire wafer was ranged to 1∼4$\AA$.

A Study on the ELID Grinding Characteristics of SF-5 Glass and Quartz Glass for the Nano Surface Roughness (나노 표면거칠기틀 위한 SF-5유리와 수정유리의 ELID 연삭 특성에 관한 연구)

  • 곽태수;박상후;오오모리히토시;배원병;양동열
    • Journal of the Korean Society for Precision Engineering
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    • v.20 no.7
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    • pp.56-62
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    • 2003
  • The precision fabrication of glass is increasingly demanded for the latest industrial applications of spherical lenses, micro-optical components, and so on. In many cases, the surface roughness of glass is required to be minute for improving the optical characteristics. In this paper, machining characteristics of SF-5 glass and quarts glass are studied by using the ELID grinding process to get mirror surface and productivity compared with a general lapping process. A rotary type grinder with air spindle was used for the experiments. Mitutoyo surface tester and AFM were also used to measure the grinded surface of glass. As the results of experiments, they showed that the surface roughness (Ra) of SF-5 glass was under 7.8 nm and that of quartz glass was under 3.0 m using the # 8000 grinder. So, the possibility of highly efficient and accurate surface for optical components can be achieved by the ELID grinding process.

An experimental study of the friction and wear on counterpart roughness of silica particle reinforced nano composites (상대재의 거칠기에 따른 실리카 입자강화 나노 복합재료의 마찰 및 마모에 관한 실험적 연구)

  • Kim, Hyung Jin;Lee, Jung-Kyu;Koh, Sung Wi
    • Journal of the Korean Society of Fisheries and Ocean Technology
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    • v.50 no.2
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    • pp.162-168
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    • 2014
  • The friction and wear characteristics of the rubber matrix composites filled with nano sized silica particles were investigated at ambient temperature by pin-on-disc friction test. The volume fraction of silica particles was 19%. The cumulative wear volume and wear rate of these materials on counterpart roughness were determined experimentally. The major failure mechanisms were lapping layers, deformation of matrix, ploughing, debonding of particles, fracture of particles and microcracking by scanning electric microscopy photograph of the tested surface. The cumulative wear volume showed a tendency to increase with increase of sliding distance. The wear rate of these composites tested indicated low value as increasing the sliding distance.

Fabrication of uniform micropattern arrays using nonionic surfactant-based wet etching process of high purity aluminum (비이온계 계면활성제기반 고순도 알루미늄 습식식각을 통한 균일한 마이크로패턴 어레이 제작)

  • Jang, Woong-Ki;Jeon, Eun Chae;Choi, Doo Sun;Kim, Byeong Hee;Seo, Young Ho
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.13 no.4
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    • pp.13-20
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    • 2014
  • In this paper, the effects of a nonionic surfactant on the etch uniformity and the etch profile during the wet-etching process of high-purity aluminum were investigated for the fabrication of uniform micropattern arrays. To improve the surface roughness of a high-purity aluminum plate, a mechanical lapping process and an electrolytic polishing process were used. After electrolytic polishing process, the surface roughness, Ra, of the high-purity aluminum plate was improved from $1.25{\mu}m$ to $0.02{\mu}m$. A photoresist was used as an etching mask during the aluminum etching process, where the mixture of phosphoric acid, acetic acid, nitric acid, a nonionic surfactant and water was used as the aluminum etchant. Different amounts of the Triton X-100 nonionic surfactant were added to the aluminum etchant to investigate the effect of a nonionic surfactant during the wet-etching process of high-purity aluminum. The etch rate and the etch profile were measured by an optical interferometer and a scanning electron microscope.