A Study on the Nano Grinding of Sapphire by Ultra-Precision Grinder

초정밀 연삭기에 의한 사파이어의 나노가공

  • 김우순 (원광대학교 기계시스템디자인공학부) ;
  • 김동현 (원광대학교 기계시스템디자인공학부) ;
  • 난바의치 (일본 중부대학교 기계공학부)
  • Published : 2003.10.01

Abstract

Optical and electronic industries are using lapping and polishing processing as a final finish rather than grinding, because they need more accurate parts of brittles non-metallic materials such as single crystals. Sapphire has been ground by the ultra-precision surface grinder having a glass -ceramic spindle of extremely-low thermal expansion with various cup-type resinoid-bonded diamond wheels of #400-#3000 in grain size. Sapphire can be ground in the ductile mode. And also, the surface roughness and grinding conditions has been clarified. The smooth surface of Sapphire less than 1nm RMS, 1nm Ra can be obtained by the ultra-precision grinding without any polishing process.

Keywords

References

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