• Proceedings of the Materials Research Society of Korea Conference
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• 2009.05a
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• pp.24.2-24.2
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• 2009

Nanostuctures such as nanodot and nanowire have been extensively studied as building blocks for nanoscale devices. However, the direct growth of the nanostuctures at the desired position is one of the most important requirements for realization of the practical devices with high integrity. Self-assembled nanotemplate is one of viable methods to produce highly-ordered nanostructures because it exhibits the highly ordered nanometer-sized pattern without resorting to lithography techniques. And selective epitaxial growth (SEG) can be a proper method for nanostructure fabrication because selective growth on the patterned openings obtained from nanotemplate can be a proper direction to achieve high level of control and reproducibility of nanostructucture fabrication. Especially, SiGe has led to the development of semiconductor devices in which the band structure is varied by the composition and strain distribution, and nanostructures of SiGe has represented new class of devices such nanowire metal-oxide-semiconductor field-effect transistors and photovoltaics. So, in this study, various shaped SiGe nanostructures were selectively grown on Si substrate through ultrahigh vacuum chemical vapor deposition (UHV-CVD) of SiGe on the hexagonally arranged Si openings obtained using nanotemplates. We adopted two types of nanotemplates in this study; anodic aluminum oxide (AAO) and diblock copolymer of PS-b-PMMA. Well ordered and various shaped nanostructure of SiGe, nanodots and nanowire, were fabricated on Si openings by combining SEG of SiGe to self-assembled nanotemplates. Nanostructure fabrication method adopted in this study will open up the easy way to produce the integrated nanoelectronic device arrays using the well ordered nano-building blocks obtained from the combination of SEG and self-assembled nanotemplates.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.4
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• pp.267-271
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• 2018

A high directivity TIR (total internal reflection) lens in the UV-A region was designed using a silicone resin, and a UV light source module with a maximum irradiation density of $150mW/cm^2$ was fabricated. The beam angle of the TIR lens was designed to be $8.04^{\circ}$ and the maximum diameter of the TIR lens was Ø13.5. A silicone resin having a UV transmittance of 93% and a refractive index of 1.4 at a wavelength of 365 nm was used, and the lens was manufactured using an aluminum mold, from which silicone could be easily released. The module was fabricated in a metal printed circuit board of COB (chip on board) type using a $0.75{\times}0.75mm^2$ UV chip. A jig was used to adjust the focal length between lens and chip and to fix the position of the lens. The optical characteristics such as illumination distributions of the lens and module were designed using 'LightTools' optical simulation software. The heat dissipation system was designed to use a forced-air cooling method using a heat-sink and fan.

• Journal of Adhesion and Interface
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• v.20 no.3
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• pp.102-109
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• 2019

The material constitution of multi-layered thin film coated on the PET base film was analyzed using ATR FT-IR and pyro GC/MS combination. The cross section of the film was acquired by cracking the film after dipping in liquid nitrogen and was observed using optical microscope. Total thickness of the coated film was $70{\mu}m$ and three layers were observed. Since each layers were too thin to analyze directly except the surface layer, analyzable area of each layers were exposed by using a proper solvent and were investigated using ATR FT-IR and pyro GC/MS. Results shows that three layers were commonly consisted of urethane-acrylate copolymers. Also, inorganic and/or metal inclusions detected by XPS and SEM-EDAX were exhibited by nano size $SiO_2$ particles in layer(1) and aluminum flakes in layer(2).

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.5
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• pp.135-141
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• 2021

As a trend of lightening automobiles and electronic products, several studies are currently underway to replace parts of metals with resins. In particular, heterojunctions between metals and resins are now under the spotlight. This study aims to evaluate the variation in bonding strength with process conditions when the polybutylene terephthalate (PBT) polymer is bonded to a specimen of the lightweight 6061 aluminum alloy (AL6061). Conditions of the bonding surface of the AL6061 specimen, the temperature of the injection mold, and the content of the glass fiber were considered to be process variables. Bonded specimens were manufactured for different values of these variables. Bonding strength tests were then performed on these specimens and variations were analyzed in their characteristics corresponding to those of the process conditions. Fractures in these specimens were assessed using scanning electron microscopy (SEM) to assess the fracture surface. This was then used to analyze the fracture shape and determine whether anodizing the specimen led to the development of cracks on the joint surface. Results of the above test indicated that while the surface condition of the specimen and the temperature of the injection mold significantly influenced the strength of bonding, the content of the glass fiber did not.

• Journal of the Korean Society for Heat Treatment
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• v.37 no.3
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• pp.121-127
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• 2024

We investigate the effect of T6 heat treatment on the microstructure and mechanical properties of AA365 (Al-10.3Si-0.37Mg-0.6Mn-0.11Fe, wt.%) alloy fabricated by vacuum-assisted high pressure die casting by means of thermodynamic calculation, X-ray diffraction, scanning and transmission electron microscopy, and tensile tests. The as-cast alloy consists of primary Al (with dendrite arm spacing of 10~15 ㎛), needle-like eutectic Si, and blocky α-AlFeMnSi phases. The solution treatment at 490 ℃ induces the spheroidization of eutectic Si and increase in the fraction of eutectic Si and α-AlFeMnSi phases. While as-cast alloy does not contain nano-sized precipitates, the T6-treated alloy contains fine β' and β' precipitates less than 20 nm that formed during aging at 190℃. T6 heat treatment improves the yield strength from 165 to 186 MPa due to the strengthening effect of β' and β' precipitates. However, the β' and β' precipitates reduce the strain hardening rate and accelerate the necking phenomenon, degrading the tensile strength (from 290 to 244 MPa) and fracture elongation (from 6.6 to 5.0%). Fractography reveals that the coarse α-AlFeMnSi and eutectic Si phases act as crack sites in both the as-cast and T6 treated alloys.

• Korean Journal of Materials Research
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• v.34 no.3
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• pp.175-183
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• 2024

Geopolymer, also known as alkali aluminum silicate, is used as a substitute for Portland cement, and it is also used as a binder because of its good adhesive properties and heat resistance. Since Davidovits developed Geopolymer matrix composites (GMCs) based on the binder properties of geopolymer, they have been utilized as flame exhaust ducts and aircraft fire protection materials. Geopolymer structures are formed through hydrolysis and dehydration reactions, and their physical properties can be influenced by reaction conditions such as concentration, reaction time, and temperature. The aim of this study is to examine the effects of silica size and aging time on the mechanical properties of composites. Commercial water glass and kaolin were used to synthesize geopolymers, and two types of silica powder were added to increase the silicon content. Using carbon fiber mats, a fiber-reinforced composite material was fabricated using the hand lay-up method. Spectroscopy was used to confirm polymerization, aging effects, and heat treatment, and composite materials were used to measure flexural strength. As a result, it was confirmed that the longer time aging and use of nano-sized silica particles were helpful in improving the mechanical properties of the geopolymer matrix composite.

• Textile Coloration and Finishing
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• v.28 no.1
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• pp.48-56
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• 2016

Improvement of heat sink technology related to the continuous implementation performance and extension of device-life in circumstance of easy heating and more compact space has been becoming more important issue as multi-functional integration and miniaturization trend of electronic gadgets and products has been generalized. In this study, it purposed to minimize of decline of the heat diffusivity by gluing polymer through compounding of inorganic particles which have thermal conductive properties. We used NH-9300 as base resin and used inorganic fillers such as silicon carbide(SiC), aluminum nitride(AlN), and boron nitride(BN) to improve heat diffusivity. After making film which was made from 100 part of acrylic resin mixed hardener(1.0 part more or less) with inorganic particles. The film was matured at $80^{\circ}C$ for 24h. Diffusivity were tested according to sorts of particles and density of particles as well as size and structure of particle to improve the effect of heat sink in view of morphology assessing diffusivity by LFA(Netzsch/LFA 447 Nano Flash) and adhesion strength by UTM(Universal Testing Machine). The correlation between diffusivity of pure inorganic particles and composite as well as the relation between density and morphology of inorganic particles has been studied. The study related morphology showed that globular type had superior diffusivity at low density of 25% but on the contarary globular type was inferior to non-globular type at high density of 80%.

• Journal of Powder Materials
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• v.9 no.6
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• pp.394-408
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• 2002

Nanostructured high strength metastable Al-, Mg- and Ti-based alloys containing different amorphous, quasicrystalline and nanocrystalline phases are synthesized by non-equilibrium processing techniques. Such alloys can be prepared by quenching from the melt or by powder metallurgy techniques. This paper focuses on one hand on mechanically alloyed and ball milled powders containing different volume fractions of amorphous or nano-(quasi)crystalline phases, consolidated bulk specimens and, on the other hand. on cast specimens containing different constituent phases with different length-scale. As one example. $Mg_{55}Y_{15}Cu_{30}$- based metallic glass matrix composites are produced by mechanical alloying of elemental powder mixtures containing up to 30 vol.% $Y_2O_3$ particles. The comparison with the particle-free metallic glass reveals that the nanosized second phase oxide particles do not significantly affect the glass-forming ability upon mechanical alloying despite some limited particle dissolution. A supercooled liquid region with an extension of about 50 K can be maintained in the presence of the oxides. The distinct viscosity decrease in the supercooled liquid regime allows to consolidate the powders into bulk samples by uniaxial hot pressing. The $Y_2O_3$ additions increase the mechanical strength of the composites compared to the $Mg_{55}Y_{15}Cu_{30}$ metallic glass. The second example deals with Al-Mn-Ce and Al-Cu-Fe composites with quasicrystalline particles as reinforcements, which are prepared by quenching from the melt and by powder metallurgy. $Al_{98-x}Mn_xCe_2$ (x =5,6,7) melt-spun ribbons containing a major quasicrystalline phase coexisting with an Al-matrix on a nanometer scale are pulverized by ball milling. The powders are consolidated by hot extrusion. Grain growth during consolidation causes the formation of a micrometer-scale microstructure. Mechanical alloying of $Al_{63}Cu_{25}Fe_{12}$ leads to single-phase quasicrystalline powders. which are blended with different volume fractions of pure Al-powder and hot extruded forming $Al_{100-x}$$(Al_{0.63}Cu_{0.25}Fe_{0.12})_x$ (x = 40,50,60,80) micrometer-scale composites. Compression test data reveal a high yield strength of ${\sigma}_y{\geq}$700 MPa and a ductility of ${\varepsilon}_{pl}{\geq}$5% for than the Al-Mn-Ce bulk samples. The strength level of the Al-Cu-Fe alloys is ${\sigma}_y{\leq}$550 MPa significantly lower. By the addition of different amounts of aluminum, the mechanical properties can be tuned to a wide range. Finally, a bulk metallic glass-forming Ti-Cu-Ni-Sn alloy with in situ formed composite microstructure prepared by both centrifugal and injection casting presents more than 6% plastic strain under compressive stress at room temperature. The in situ formed composite contains dendritic hcp Ti solid solution precipitates and a few $Ti_3Sn,\;{\beta}$-(Cu, Sn) grains dispersed in a glassy matrix. The composite micro- structure can avoid the development of the highly localized shear bands typical for the room temperature defor-mation of monolithic glasses. Instead, widely developed shear bands with evident protuberance are observed. resulting in significant yielding and homogeneous plastic deformation over the entire sample.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.19 no.4
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• pp.202-207
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• 2009

Nanocomposite formation of metal-metal oxide systems by mechanical alloying (MA) has been investigated at room temperature. The systems we chose are the $Fe_3O_4$-M (M = AI, Ti), where pure metals are used as reducing agent. It is found that $Fe/Al_2O_3$ and $Fe/TiO_2$ nanocomposite powders in which $Al_2O_3$ and $TiO_2$ are dispersed in ${\alpha}$-Fe matrix with nano-sized grains are obtained by MA of $Fe_3O_4$ with Al and Ti for 25 and 75 hours, respectively. It is suggested that the shorter MA time for the nanocomposite formation in $Fe/Al_2O_3$ is due to a large negative heat associated with the chemical reduction of magnetite by aluminum. X-ray diffraction results show that the average grain size of ${\alpha}$-Fe in $Fe/TiO_2$ nanocomposite powders is in the range of 30 nm. The change in magnetic properties also reflects the details of the solid-state reduction of magnetite by pure metals during MA.

• Proceedings of the Korean Vacuum Society Conference
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• 2011.02a
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• pp.134-134
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• 2011

High-k dielectric materials such as $HfO_2$, $ZrO_2$ and $Al_2O_3$ increase gate capacitance and reduce gate leakage current in MOSFET structures. This behavior suggests that high-k materials will be promise candidates to substitute as a tunnel barrier. Furthermore, stack structure of low-k and high-k tunnel barrier named variable oxide thickness (VARIOT) is more efficient.[1] In this study, we fabricated the $WSi_2$ nanocrystals nonvolatile memory device with $SiO_2/HfO_2/Al_2O_3$ tunnel layer. The $WSi_2$ nano-floating gate capacitors were fabricated on p-type Si (100) wafers. After wafer cleaning, the phosphorus in-situ doped poly-Si layer with a thickness of 100 nm was deposited on isolated active region to confine source and drain. Then, on the gate region defined by using reactive ion etching, the barrier engineered multi-stack tunnel layers of $SiO_2/HfO_2/Al_2O_3$ (2 nm/1 nm/3 nm) were deposited the gate region on Si substrate by using atomic layer deposition. To fabricate $WSi_2$ nanocrystals, the ultrathin $WSi_2$ film with a thickness of 3-4 nm was deposited on the multi-stack tunnel layer by using direct current magnetron sputtering system [2]. Subsequently, the first post annealing process was carried out at $900^{\circ}C$ for 1 min by using rapid thermal annealing system in nitrogen gas ambient. The 15-nm-thick $SiO_2$ control layer was deposited by using ultra-high vacuum magnetron sputtering. For $SiO_2$ layer density, the second post annealing process was carried out at $900^{\circ}C$ for 30 seconds by using rapid thermal annealing system in nitrogen gas ambient. The aluminum gate electrodes of 200-nm thickness were formed by thermal evaporation. The electrical properties of devices were measured by using a HP 4156A precision semiconductor parameter analyzer with HP 41501A pulse generator, an Agillent 81104A 80MHz pulse/pattern generator and an Agillent E5250A low leakage switch mainframe. We will discuss the electrical properties for application next generation non-volatile memory device.