Comparative Analysis of Heat Sink and Adhesion Properties of Thermal Conductive Particles for Sheet Adhesive |
Kim, Yeong Su
(Department of Materials Design Engineering, Kumoh National Institute of Technology)
Park, Sang Ha (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) Choi, Jeong Woo (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) Kong, Lee Seong (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) Yun, Gwan Han (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) Min, Byung Gil (Department of Polymer Science and Engineering, Kumoh National Institute of Technology) Lee, Seung Han (kit Convergence Technology Research center, Kumoh National Institute of Technology) |
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