• 제목/요약/키워드: Multilayered Module

검색결과 11건 처리시간 0.023초

LTCC Tape 제조 및 고주파 유전특성 평가 (Fabrication of LTCC Tape and Its Microwave Dielectric Properties)

  • 이경호;최병훈;안달;성정현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집 Vol.14 No.1
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    • pp.382-385
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    • 2001
  • In the previous study, a new LTCC material in the $PbWO_{4}-TiO_{2}-B_{2}O_{3}-CuO$ system was introduced. The developed material can be sintered at $850^{\circ}C$ and its dielectric properties are $\varepsilon_{r}=20-25$, $Q{\times}f_{o}=30000\sim50000GHz$, and $\tau_{f}=0.2{\sim}30ppm/^{\circ}C$, respectively. Therefore this material can be used as a LTCC substrate material for fabrication of multilayered high frequency communication module set. In present study, using this material, tape casting condition was established. With this condition, a multilayered resonator was fabricated and its electrical properties were examined. In present study, an antenna-duplexer module was also fabricated. Frequency characteristics of as-fabricated antenna-duplexer module was compared with simulation results.

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LTCC Tape 제조 및 고추파 유전특성 평가 (Fabrication of LTCC Tape and Its Microwave Dielectric Properties)

  • 이경호;최병훈;안달;성정현
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2001년도 추계학술대회 논문집
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    • pp.382-385
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    • 2001
  • In the previous study, a new LTCC material in the PbWO$_4$-TiO$_2$-B$_2$O$_3$-CuO system was introduced. The developed material can be sintered at 850$^{\circ}C$ and its dielectric properties are $\varepsilon$$\sub$r/=20-25, Qxf$\sub$o/=30000∼500000Hz, and $\tau$$\sub$f/=0.2∼30ppm/$^{\circ}C$, respectively Therefore this material can be used as a LTCC substrate material for fabrication of multilayered high frequency communication module set. In present study, using this material, tape casting condition was established. With this condition, a multilayered resonator was fabricated and its electrical properties were examined. In present study, an antenna-duplexer module was also fabricated. Frequency characteristics of as-fabricated antenna-duplexer module was compared with simulation results.

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Dynamic response of vertically loaded rectangular barrettes in multilayered viscoelastic soil

  • Cao, Geng;Zhu, Ming X.;Gong, Wei M.;Wang, Xiao;Dai, Guo L.
    • Geomechanics and Engineering
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    • 제23권3호
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    • pp.275-287
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    • 2020
  • Rectangular barrettes have been increasingly used as foundations for many infrastructure projects, but the vertical vibration of a barrette has been rarely addressed theoretically. This paper presents an analysis method of dynamic response for a rectangular barrette subjected to a time-harmonic vertical force with the aid of a modified Vlasov foundation model in multilayered viscoelastic soil. The barrette-soil system is modeled as a continuum, the vertical continuous displacement model for the barrette and soil is proposed. The governing equations of the barrette-soil system and the boundary conditions are obtained and the vertical shaft resistance of barrette is established by employing Hamilton's principle for the system and thin layer element, respectively. The physical meaning of the governing equations and shaft resistance is interpreted. The iterative solution algorithm flow is proposed to obtain the dynamic response of barrette. Good agreement of the analysis and comparison confirms the correctness of the present solution. A parametric study is further used to demonstrate the effects of cross section aspect ratio of barrettes, depth of soil column, and module ratio of substratum to the upper soil layers on the complex barrette-head stiffness and the resistance stiffness.

낸드플래시 메모리의 냉각효과에 관한 수치적 연구 (A Numerical Study of NAND Flash Memory on the cooling effect)

  • 김기준;구교욱;임효재;이혁
    • 한국전산유체공학회:학술대회논문집
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    • 한국전산유체공학회 2011년 춘계학술대회논문집
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    • pp.117-123
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    • 2011
  • The low electric power and high efficiency chips are required because of the appearance of smart phones. Also, high-capacity memory chips are needed. e-MMC(embedded Multi-Media Card) for this is defined by JEDEC(Joint Electron Device Engineering Council). The e-MMC memory for research and development is a memory mulit-chip module of 64GB using 16-multilayers of 4GB NAND-flash memory. And it has simplified the chip by using SIP technique. But mulit-chip module generates high heat by higher integration. According to the result of study, whenever semiconductor chip is about 10 $^{\circ}C$ higher than the design temperature it makes the life of the chip shorten more than 50%. Therefore, it is required that we solve the problem of heating value and make the efficiency of e-MMC improved. In this study, geometry of 16-multilayered structure is compared the temperature distribution of four different geometries along the numerical analysis. As a result, it is con finned that a multilayer structure of stair type is more efficient than a multilayer structure of vertical type because a multi-layer structure of stair type is about 9 $^{\circ}C$ lower than a multilayer structure of vertical type.

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Flexible PCB를 이용한 내장형 캐패시터의 분석 (Analysis of embedded capacitor using Flexible PCB)

  • 유찬세;김진완;유명재;박성대;이우성;이형규;강남기
    • 한국전기전자재료학회:학술대회논문집
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    • 한국전기전자재료학회 2004년도 춘계학술대회 논문집 반도체 재료 센서 박막재료 전자세라믹스
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    • pp.150-152
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    • 2004
  • The number of layers in rigid PCB(printed circuit board) is restricted, so the number of components can be embedded in module is restricted also. But using flexible multilayer PCB, the layers over than 7 can be evaluated. In this study, to verify the possibility of application of flexible multilayer PCB to RF modules, multilayered embedded capacitor is fabricated and analyzed. The characteristics of embedded capacitor is analyzed and compared to that of MLCC and LTCC capacitor. Embedded capacitor has better electrical features than MLCC and compatible one to LTCC capacitor.

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Fabrication of Infrared Filters for Three-Dimensional CMOS Image Sensor Applications

  • Lee, Myung Bok
    • Transactions on Electrical and Electronic Materials
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    • 제18권6호
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    • pp.341-344
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    • 2017
  • Infrared (IR) filters were developed to implement integrated three-dimensional (3D) image sensors that are capable of obtaining both color image and depth information at the same time. The combination of light filters applicable to the 3D image sensor is composed of a modified IR cut filter mounted on the objective lens module and on-chip filters such as IR pass filters and color filters. The IR cut filters were fabricated by inorganic $SiO_2/TiO_2$ multilayered thin-film deposition using RF magnetron sputtering. On-chip IR pass filters were synthetized by dissolving various pigments and dyes in organic solvents and by subsequent patterning with photolithography. The fabrication process of the filters is fairly compatible with the complementary metal oxide semiconductor (CMOS) process. Thus, the IR cut filter and IR pass filter combined with conventional color filters are considered successfully applicable to 3D image sensors.

적층형 2-Pole 대역통과 필터 제작을 통한 개발된 LTCC 조성의 특성 평가 (Characterization of As-Developed LTCC Material Through The Fabrication of 2-Pole Band Pass Filter)

  • 이경호;최병훈;방재철
    • 한국마이크로전자및패키징학회:학술대회논문집
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    • 한국마이크로전자및패키징학회 2002년도 춘계 기술심포지움 논문집
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    • pp.134-137
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    • 2002
  • A new LTCC material in the $PbWO_4-TiO_2-B_2O_3-CuO$ system was developed. The developed material can be sintered at $850^{\circ}C$ and its dielectric properties are $\varepsilon_r=20-25, Q\timesf_o=30000~50000GHz$ , and $\tau_f=0.2~30ppm/^{\circ}C$, depending on the components moi ratio. Due to its low sintering temperature and microwave dielectric properties, the developed material can be used as a LTCC substrate for fabrication of multilayered microwave communication module set. In present study, using this material, tape casting condition was established. With this processing condition, a T-resonator was fabricated and its electrical properties were examined. Also, a 2-Pole band pass filter was fabricated and its frequency characteristics were compared with simulation results.

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태양광어레이 최적화에 의한 단위 부지면적당 발전량 개선 (Improvement of generation capacity per unit site area by the optimization of photovoltaic array)

  • 김의환
    • 한국신재생에너지학회:학술대회논문집
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    • 한국신재생에너지학회 2011년도 춘계학술대회 초록집
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    • pp.109.2-109.2
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    • 2011
  • A photovoltaic system is getting the spotlight for a environment-friendly energy source. But its location is limited because a lot of land is necessary for photovoltaic arrays. Nevertheless, its dissemination is rapidly increasing more than 40 % every year and exceeded about 400 MW in 2009. The radical growth of a photovoltaic system aggravated a lack of sites, so that forests and farmland were destroyed. It is demanded to make use of a vacant lot or little piece of land for the way to solve the lack of sites and improve the location requirements for a photovoltaic system. General photovoltaic arrays are consist of a single layer structure and needs enough separation distances to maximize the amount of solar radiation and to eliminate influences by the shadow of other arrays. So that a large amount of land is required for the site. The solar cell arrays with long separation distances can not be placed in a small vacant lot and its site application efficiency is low. This study optimized photovoltaic arrays as multilayered structure with movable sleeves for the efficient photovoltaic in a small site. The existing photovoltaic arrays with a single layer structure were fixed or tracking systems. In this experimental equipment, photovoltaic arrays attached to the multilayers have rectilinear movement and rotary motion using sleeves. Therefore, shadow influences were removed and the generation capacity was improved. On the simulation result, generation increased by about 30% in the same site considering shadow influences and so on.

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다층 포토닉 밴드갭 구조를 이용한 소형의 광대역 저지 여파기 설계 (Design of a Compact and Wide Bandstop Filter using a Multilayered Photonic Bandgap Structure)

  • 서재옥;박성대;김진양;이해영
    • 대한전자공학회논문지TC
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    • 제39권11호
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    • pp.34-39
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    • 2002
  • 본 논문에서는 마이크로스트립 전송선로의 유전체 기판(substrate) 내에 삽입된 EGP(Elevated Ground Plane)와 비아를 이용하는 소형의 새로운 포토닉 밴드갭(PBG:Photonic Bandgap) 구조를 제안였하고, 세라믹 기판에 적용된 최적구조를 설계하였다. 해석 결과, 제안된 새로운 PBG 구조는 기존의 평면 PBG 구조에 비해서 크기가 52.5 % 축소되었고 대역폭은 45 % 증가하였다. 그리고 접지면 식각 다층 PBG 구조에 비해서는 크기가 32 % 감소하였고 첨예도(sharpness)가 향상되었으며 차단주파수 이상에서 40 GHz까지 전력손실이 8 dB 이상 개선되었다. 따라서 본 논문에서 제안된 PBG 구조는 대역 저지 또는 저역통과 여파기로 사용할 수 있으며, 이러한 여파기 특성은 경박 단소화된 마이크로파 대역 집적회로나 모듈 개발에 효과적으로 활용될 수 있으리라 기대된다.

결정화유리의 첨가에 의한 BNT계 세라믹스의 저온소결 및 마이크로파 유전특성 (Sintering and Dielectric Properties of BaO-Nd2O3-TiO2 Microwave Ceramics with Glass-Ceramics)

  • 허동수;이우석;정순종;송재성;;류봉기
    • 한국세라믹학회지
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    • 제41권6호
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    • pp.444-449
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    • 2004
  • BaO-Nd$_2$O$_3$-TiO$_2$계 마이크로파 유전체 세라믹스에 결정화유리를 첨가하여 세라믹-결정화유리 복합체 유전재료를 제작하여, 적층 일체형 RF수동소자 모듈 구현을 위한 저온소결 유전재료로서의 응용가능성에 대해 검토하였다. BaO-Nd$_2$O$_3$-TiO$_2$계 유전체 세라믹스에 PbO-TiO$_2$-Al$_2$O$_3$-SiO$_2$ 조성의 결정화 유리를 5∼30 wt% 범위로 첨가하여 소결온도를 130$0^{\circ}C$에서 105$0^{\circ}C$까지 낮출 수 있었으며, 첨가량의 증가에 따라 유리의 연화로 인한 소결밀도의 증가 및 입성장이 뚜렷하게 관찰되었다. 특히, 결정화 유리를 20 wt% 이상 첨가하였을 경우, 105$0^{\circ}C$의 소결온도에서 95% 이상의 상대밀도를 갖는 양호한 소결체를 얻을 수 있었고, 이 때 유전을($\varepsilon$$_{r}$)은 72, 품질계수(Q-f)는 1500이었고, 공진주파수 온도계수($ au$$_{f}$)는 22ppm/$^{\circ}C$을 나타내었다. 이러한 높은 유전율은 유리속의 결정상 PbTiO$_3$의 존재에 기인한 것이다.