• Proceedings of the IEEK Conference
• /
• 2005.11a
• /
• pp.913-916
• /
• 2005

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}pa$. $m^3/cm^2$.

• KSII Transactions on Internet and Information Systems (TIIS)
• /
• v.10 no.1
• /
• pp.1-17
• /
• 2016

The separated management and operation of commercial IP/optical multilayer networks makes network operators look for a unified control plane (UCP) to reduce their capital and operational expenditure. Software-defined networking (SDN) provides a central control plane with a programmable mechanism, regarded as a promising UCP for future optical networks. The general control and scheduling mechanism in SDN-based optical burst switching (OBS) networks is insufficient so the controller has to process a large number of messages per second, resulting in low network resource utilization. In view of this, this paper presents the burst-flow scheduling mechanism (BFSM) with a proposed scheduling algorithm considering channel usage. The simulation results show that, compared with the general control and scheduling mechanism, BFSM provides higher resource utilization and controller performance for the SDN-based OBS network in terms of burst loss rate, the number of messages to which the controller responds, and the average latency of the controller to process a message.

• Journal of the Korean Magnetics Society
• /
• v.10 no.5
• /
• pp.210-219
• /
• 2000

The magnetoresistance characteristics of FeN/Co/Cu/Co and FeN/Co/Cu/Co/Cu/Co/FeN multilayers using ferromagnetic iron-nitrides (FeN) has been studied. The microstructure of FeN film is the mixed ${\alpha}$-Fe and $\varepsilon$-Fe$_3$N phase on the condition that the flow rate of N$_2$ gas is over 0.4 sccm. The magnetoresistance effect is observed because of shape magnetic anisotropy induced by needle-shaped $\varepsilon$-Fe$_3$N phase. This magnetoresistance effect changes, because the degree that the shape magnetic anisotropy adheres to the adjacent Co pinned layer is varied according to the flow rate of N$_2$ gas and the thickness of FeN film. The best magnetoresistance effect is obtained on the condition that the thickness of Co free layer is 70 ${\AA}$ and the maximum MR ratio(%) value of 3.2% shows in the FeN(250 ${\AA}$)/Co(70 ${\AA}$)/Cu(25 ${\AA}$)/Co(70 ${\AA}$)/Cu(25 ${\AA}$)/Co(70 ${\AA}$)/FeN(250 ${\AA}$) mutilayer film which is fabricated at the N, gas flow rate of 0.5 sccm and the FeN film thickness of 250 ${\AA}$. Four steps are observed in the magnetoresistance curve owing to this difference of coercive force, because respective magnetic layers in the multilayer possess different coercive forces. These effects observed in these mutilayer films can be expected to application to the memory device the same MRAM as can carry out simultaneously four signals.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 2004.04b
• /
• pp.129-132
• /
• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 sccm at a supplied voltage of 100 V with a 50 % duty cycle, maximum non-linearity was 2.24 % FS and leak rate was $3.03{\times}10^{-8}\;pa{\cdot}m^3/cm^2$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• KSII Transactions on Internet and Information Systems (TIIS)
• /
• v.6 no.9
• /
• pp.2170-2190
• /
• 2012

There are nowadays strong demands for intelligent surveillance systems, which can infer or understand more complex behavior. The application of crowd density estimation methods could lead to a better understanding of crowd behavior, improved design of the built environment, and increased pedestrian safety. In this paper, we propose a new crowd density estimation method, which aims at estimating not only a moving crowd, but also a stationary crowd, using images captured from surveillance cameras situated in various public locations. The crowd density of the moving people is measured, based on the moving area during a specified time period. The moving area is defined as the area where the magnitude of the accumulated optical flow exceeds a predefined threshold. In contrast, the stationary crowd density is estimated from the coarseness of textures, under the assumption that each person can be regarded as a textural unit. A multilayer neural network is designed, to classify crowd density levels into 5 classes. Finally, the proposed method is experimented with PETS 2009 and the platform of Gangnam subway station image sequences.

• Journal of Sensor Science and Technology
• /
• v.13 no.3
• /
• pp.230-235
• /
• 2004

This paper describes the design, fabrication and characteristics of a piezoelectric valve using MCA(Multilayer ceramic actuator). The MCA valve, which has the buckling effect, consists of three separate structures; MCA, a valve actuator die and an a seat die. The design of the actuator die was done by FEM modeling and displacement measurement, respectively. The valve seat die with 6 trenches was made, and the actuator die, which is driven to MCA under optimized conditions, was also fabricated. After Si-wafer direct bonding between the seat die and the actuator die, MCA was also anodic bonded to the seat/actuator die structure. PDMS sealing pad was fabricated to minimize a leak-rate. It was also bonded to seat die and SUS package. The MCA valve shows a flow rate of 9.13 seem at a supplied voltage of 100 V with a 50% duty cycle, maximum non-linearity was 2.24% FS and leak rate was $3.03{\times}10^{-8}pa{\codt}m^{3}/cm^{2}$. Therefore, the fabricated MCA valve is suitable for a variety of flow control equipment, a medical bio-system, automobile and air transportation industry.

• Journal of the Semiconductor & Display Technology
• /
• v.22 no.4
• /
• pp.26-31
• /
• 2023

We investigated the impact of NF₃ / H₂O remote plasma dry cleaning conditions on the SiO₂ etching rate at different preparation states during the fabrication of ultra-large-scale integration (ULSI) devices. This included consideration of factors like Si crystal orientation prior to oxidation and three-dimensional structures. The dry cleaning process were carried out varying the parameters of pressure, NF₃ flow rate, and H₂O flow rate. We found that the pressure had an effective role in controlling anisotropic etching when a thin SiO₂ layer was situated between Si₃N₄ and Si layers in a multilayer trench structure. Based on these observations, we would like to provide further guidelines for implementing the dry cleaning process in the fabrication of semiconductor devices having 3D structures.

• Composites Research
• /
• v.32 no.6
• /
• pp.314-318
• /
• 2019

A simple and very flexible automatic dipping machine was constructed for producing functional multilayer films on wide substrates via the layer-by-layer (LbL) assembly technique. The proposed machine exhibits several features that allow a fully automated coating operation, such as various depositing recipes, control of the dipping depth and time, operating speed, and rinsing flow, air-assist drying nozzles, and an operation display. The machine uniformly dips a substrate into aqueous mixtures containing complementary (e.g., oppositely charged, capable of hydrogen bonding, or capable of covalent bonding) species. Between the dipping of each species, the sample is spray cleaned with deionized water and blow-dried with air. The dipping, rinsing, and drying areas and times are adjustable by a computer program. Graphene-based thin films up to ten-bilayers were prepared and characterized. This film exhibits the highly filled multilayer structures and low thermal resistance, indicating that the robotic dipping system is simple to produce functional thin film coatings with a variety of different layers.

• Journal of the Korean Vacuum Society
• /
• v.17 no.2
• /
• pp.113-116
• /
• 2008

As the integration in semiconductor display develops, semiconductor process becomes multilayer. In order to form several layer patterns, etching process which uses photoresistor (PR) must be performed in multilayer process. Repeated etching processes which take long time and PR residue cause mortal problems in semiconductor. To overcome such problems, we studied about the solution which eliminates PR effectively by using normal dry and wet etching method using plasma activated PR strip solvent in liquid condition. At first, we simulate the device which activates the plasma and make sure whether gas flow in device is uniform or not. Under activated plasma, etching effect is elevated. This improvement reduces etching time as well as display production time of semiconductor process. Generally, increasing etching process increases environmental hazards. Reducing etching process can save the etchant and protect environment as well.

• International Journal of Naval Architecture and Ocean Engineering
• /
• v.2 no.1
• /
• pp.14-23
• /
• 2010

A numerical model was developed for simulating a three-dimensional multilayer hydrodynamic and thermodynamic model in domains with irregular bottom topography. The model was designed for examining the interactions between flow and topography. The model was based on the three-dimensional Navier-Stokes equations and was solved using the fractional step method, which combines the finite difference method in the horizontal plane and the finite element method in the vertical plane. The numerical techniques were described and the model test and application were presented. For the model application to the northern part of Ariake Sea, the hydrodynamic and thermodynamic results were predicted. The numerically predicted amplitudes and phase angles were well consistent with the field observations.