• 한국지반공학회논문집
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• 제34권11호
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• pp.5-19
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• 2018

지반앵커의 정착장에 작용하는 정착응력 분포 특성은 매우 비선형적이며 공학적인 메카니즘이 비교적 복잡하기 때문에 다양한 지반조건 및 비선형적 주면전단거동을 구체적으로 모사하여 지반앵커를 설계하는데 어려움이 크다. 이런 한계로 인하여 현재 대부분의 관련 설계 기준서에는 편의상 정착장 전장에 걸쳐 일정한 주면전단응력분포를 가정하여 설계에 적용하고 있다. 따라서 본 연구에서는 인장형 앵커의 인발거동 특성을 분석하기 위하여 풍화토 지반조건을 대상으로 현장인발시험을 수행하였으며 이를 토대로 앵커 정착장의 주면전단거동을 정립하고, 정착장 거동특성을 비교적 간편하게 예측하기 위한 다중선형모델 및 이를 적용한 해석적 기법을 제안하였다. 현장시험결과와 해석적 결과가 상호 유사하게 나타남에 따라 본 연구에서 제시된 다중선형모델 및 이를 이용한 해석적 기법의 적용성 및 유효성을 확인할 수 있었다. 정착장 주면전단거동의 경우 최대인발하중 보다 작은 하중조건에서는 정착장 시작점에서 최대전단응력이 분포하게 되나 최대인발하중이 발생한 이후부터는 정착장 시작점에서 전단응력이 가장 작게 분포하고, 정착장 시작점으로부터 일정거리 이격된 지점에서 최대전단응력이 발생함을 확인하였다.

• Composites Research
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• 제36권4호
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• pp.253-258
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• 2023

교통수단의 발전은 이동이 불편한 장애인들의 이동권 보장을 실현하였지만 차량사고시 발생할 수 있는 장애인 탑승객의 안전 향상은 일반 승객좌석에 비해 낮다고 할 수 있다. 특히 갑자기 발생할 수 있는 후방 추돌 사고의 경우 장애인 탑승객의 머리와 목 부상에 취약한 것이 현실이다. 이에 본 연구에서는 휠체어 운송 차량의 후방 추돌 시 차량내 장애인 탑승객의 머리와 목 상해지수 개선을 위해 headrest를 관상면으로 3등분한 multi-layer headrest foam이 제안되었다. 간이 모델을 통한 저속 후방 추돌 해석을 통해 foam의 다양한 압축 특성을 부여하기 위한 stress scale factor의 범위가 선정되었으며, 해당 범위를 parameter로 지정하여 GA최적화가 수행되었다. 최적화결과를 통해 layer의 압축 특성에 따른 HIC와 NIC간의 상간관계 분석이 이뤄졌으며, HIC는 Front layer, NIC는 Mid layer의 압축 특성에 가장 민감하게 반응하였고 Rear layer의 압축 특성은 가장 낮게 나타났다. Validation model에 일반headrest와 최적화된 multi-layer headrest를 각각 배치하여 저속 후방 추돌 sled test 해석을 수행하였으며, 일반headrest대비 multi-layer headrest에서의 HIC와 NIC가 낮게 도출되었다. multi-layer headrest에서의 압축 거동 역시 명확하게 나타나 multi-layer headrest가 일반headrest대비 머리와 목의 상해지수 개선에 효과적인 것이 검증되었다.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.473-476
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• 2003

This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• 대한금속재료학회지
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• 제46권5호
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• pp.283-288
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• 2008

We observed the in-situ stress behavior of Cu and Ag thin films during deposition using a thermal evaporation method. Multi-beam curvature measurement system was used to monitor the evolution of in-situ stress in Cu and Ag thin films on 100 Si(100) substrates. The measured curvature was converted to film stress using Stoney formula. To investigate the effects of the deposition rates on the stress evolution in Cu and Ag thin films, Cu and Ag films were deposited at rates ranging from 0.1 to $3.0{\AA}/s$ for Cu and from 0.5 to $4.0{\AA}/s$ for Ag. Both Cu and Ag films showed a unique three stress stages, such as 'initial compressive', 'a tensile maximum' and followed by 'incremental compressive' stress. For both Cu and Ag films, there is no remarkable effect of deposition rate on the thickness and average stress at the tensile maximum. There is, however, a definite decrease in the incremental compressive stress with increasing deposition rate.

• 대한금속재료학회지
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• 제47권8호
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• pp.466-473
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• 2009

Our group previously observed the intrinsic stress evolution of Cu thin films during deposition by changing the deposition rate. Intrinsic stress of Cu thin films, which show Volmer-Weber growth, is reported to display three unique stress stages, initial compressive, broad tensile, and incremental compressive stress. The mechanisms of the initial compressive stress and incremental compressive stages remain subjects of debate, despite intensive research inquiries. The tensile stress stage may be related to volume contraction through grain growth and coalescence to reduce over-accumulate Cu adatoms on the film surface. The in-situ intrinsic stresses behavior in Cu thin films was investigated in the present study using a multi-beam curvature measurement system attached to a thermal evaporation device. The effect of substrate surface roughness was monitored by observed the in-situ intrinsic stress behavior in Cu thin films during deposition, using $100{\mu}m$ thick Si(111) wafer substrates with three different levels of surface roughness.

• Steel and Composite Structures
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• 제27권1호
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• pp.27-33
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• 2018

In this study, a mixed-interpolated tensorial component 4 nodes method (MITC4) is treated as a numerical analysis model for topology optimization using multiple materials assigned within Reissner-Mindlin plates. Multi-material optimal topology and shape are produced as alternative plate retrofit designs to provide reasonable material assignments based on stress distributions. Element density distribution contours of mixing multiple material densities are linked to Solid Isotropic Material with Penalization (SIMP) as a design model. Mathematical formulation of multi-material topology optimization problem solving minimum compliance is an alternating active-phase algorithm with the Gauss-Seidel version as an optimization model of optimality criteria. Numerical examples illustrate the reliability and accuracy of the present design method for multi-material topology optimization with Reissner-Mindlin plates using MITC4 elements and steel materials.

• Transactions on Electrical and Electronic Materials
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• 제5권4호
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• pp.138-142
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• 2004

This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년도 학술대회
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• pp.84-91
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• 2008

Generalized hydrodynamic (GH) theory for multi-species gas and the computational models are developed for the numerical simulation of hypersonic rarefied gas flow on the basis of Eu's GH theory. The rotational non-equilibrium effect of diatomic molecules is taken into account by introducing excess normal stress associated with the bulk viscosity. The numerical model for the diatomic GH theory is developed and tested. Moreover, with the experience of developing the dia-tomic GH computational model, the GH theory is extended to a multi-species gas including 5 species; O$_2$, N$_2$, NO, O, N. The multi-species GH model includes diffusion relation due to the molecular collision and thermal phenomena. Two kinds of GH models are developed for an axisymmetric flow solver. By compar-ing the computed results of diatomic and multi-species GH theories with those of the Navier-Stokes equations and the DSMC results, the accuracy and physical consistency of the GH computational models are examined.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년 추계학술대회논문집
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• pp.84-91
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• 2008

Generalized hydrodynamic (GH) theory for multi-species gas and the computational models are developed for the numerical simulation of hypersonic rarefied gas flow on the basis of Eu's GH theory. The rotational non-equilibrium effect of diatomic molecules is taken into account by introducing excess normal stress associated with the bulk viscosity. The numerical model for the diatomic GH theory is developed and tested. Moreover, with the experience of developing the dia-tomic GH computational model, the GH theory is extended to a multi-species gas including 5 species; $O_2,\;N_2$, NO, O, N. The multi-species GH model includes diffusion relation due to the molecular collision and thermal phenomena. Two kinds of GH models are developed for an axisymmetric flow solver. By compar-ing the computed results of diatomic and multi-species GH theories with those of the Navier-Stokes equations and the DSMC results, the accuracy and physical consistency of the GH computational models are examined.