• Journal of the Korean Geotechnical Society
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• 제34권11호
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• pp.5-19
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• 2018

The characteristics of the skin shear stress distribution for the fixed length of the ground anchor are extremely nonlinear and the engineering mechanisms are complex relatively. So it is difficult to design the anchors simulating the actual behavior by considering various soil conditions and nonlinear behavior. Due to these limits, constant skin shear stress distributions for the whole fixed length of the ground anchor are usually assumed in the design for the sake of convenience. In this study, to assess the pull-out behavior of the tension-type ground anchors, the in-situ pull-out tests in weathered-soil conditions were carried out. Based on the test results, the skin shear behaviors for the fixed length of tension-type ground anchors were established and the multi-linear slip shear model predicting this behavior and an analytical technique applying this model were proposed. From the similarity between the results of the in-situ pull-out tests and those of the analytical technique, the applicability and availability of the multi-linear slip shear model and the proposed analytical technique were verified. The maximum shear stress was developed at the start point of the fixed length acting with the smaller load than the maximum pull-out load but the minimum shear stress was developed at the start point of the fixed length and the maximum shear stress was developed at the point apart from the start point of the fixed length after the maximum pull-out load.

• Composites Research
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• 제36권4호
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• pp.253-258
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• 2023

Although the development of transportation means has realized the right to mobility for the disabled who have difficulty in moving, it can be said that the improvement of the safety of passengers with disabilities that can occur in a car accident is lower than that of ordinary passenger seats. In particular, in the case of a rear-end collision that can occur suddenly, it is a reality that disabled passengers are vulnerable to head and neck injuries. Therefore, in this study, a multi-layer headrest foam that divides the headrest into three parts in the coronal plane was proposed to improve the head and neck injury index of disabled passengers in the vehicle in the event of a rear-end collision of a wheelchair transport vehicle. A range of stress scale factors was selected to give various compressive characteristics of the foam through low-speed rear-end collision analysis through a simple model, and GA optimization was performed by specifying the range as a parameter. Through the optimization result, the phase relationship between HIC and NIC was analyzed according to the compression characteristics of the layers. HIC responded most sensitively to the compression characteristics of the front layer and NIC responded to the compression characteristics of the mid layer, and the compression characteristics of the rear layer showed the lowest. A normal headrest and an optimized multi-layer headrest were placed in the validation model to analyze the low-speed rear-end collision sled test, and HIC and NIC were derived lower in the multi-layer headrest than in the general headrest. The compression behavior of the multi-layer headrest was also clearly shown, and it was verified that the multi-layer headrest was effective in improving the injury index of the head and neck compared to the general headrest.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2003년도 추계학술대회 논문집 Vol.16
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• pp.473-476
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• 2003

This paper shows necessity of encapsulation layer to maximite flexibility of brittle indium-tin-oxide (ITO) on polymer substrates. And, Young's modulus (E) of encapsulation layer have an significant effect on external bending stress and the coefficient of thermal expansion (CTE) of that have a significant effect on internal thermal stress. To compare magnitude of total mechanical stress including both bending stress and thermal stress, the mechanical stress of triple-layer structure (substrate / ITO / encapsulation layer or substrate / buffer layer / ITO) can be quantified and numerically analyzed through the farthest cracked island position. As a result, it should be noted that multi-layer structures with more elastic encapsulation material have small mechanical stress compared to that of buffer and encapsulation structure of large Young's modulus material when they were externally bent.

• Korean Journal of Metals and Materials
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• 제46권5호
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• pp.283-288
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• 2008

We observed the in-situ stress behavior of Cu and Ag thin films during deposition using a thermal evaporation method. Multi-beam curvature measurement system was used to monitor the evolution of in-situ stress in Cu and Ag thin films on 100 Si(100) substrates. The measured curvature was converted to film stress using Stoney formula. To investigate the effects of the deposition rates on the stress evolution in Cu and Ag thin films, Cu and Ag films were deposited at rates ranging from 0.1 to $3.0{\AA}/s$ for Cu and from 0.5 to $4.0{\AA}/s$ for Ag. Both Cu and Ag films showed a unique three stress stages, such as 'initial compressive', 'a tensile maximum' and followed by 'incremental compressive' stress. For both Cu and Ag films, there is no remarkable effect of deposition rate on the thickness and average stress at the tensile maximum. There is, however, a definite decrease in the incremental compressive stress with increasing deposition rate.

• Korean Journal of Metals and Materials
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• 제47권8호
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• pp.466-473
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• 2009

Our group previously observed the intrinsic stress evolution of Cu thin films during deposition by changing the deposition rate. Intrinsic stress of Cu thin films, which show Volmer-Weber growth, is reported to display three unique stress stages, initial compressive, broad tensile, and incremental compressive stress. The mechanisms of the initial compressive stress and incremental compressive stages remain subjects of debate, despite intensive research inquiries. The tensile stress stage may be related to volume contraction through grain growth and coalescence to reduce over-accumulate Cu adatoms on the film surface. The in-situ intrinsic stresses behavior in Cu thin films was investigated in the present study using a multi-beam curvature measurement system attached to a thermal evaporation device. The effect of substrate surface roughness was monitored by observed the in-situ intrinsic stress behavior in Cu thin films during deposition, using $100{\mu}m$ thick Si(111) wafer substrates with three different levels of surface roughness.

• Steel and Composite Structures
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• 제27권1호
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• pp.27-33
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• 2018

In this study, a mixed-interpolated tensorial component 4 nodes method (MITC4) is treated as a numerical analysis model for topology optimization using multiple materials assigned within Reissner-Mindlin plates. Multi-material optimal topology and shape are produced as alternative plate retrofit designs to provide reasonable material assignments based on stress distributions. Element density distribution contours of mixing multiple material densities are linked to Solid Isotropic Material with Penalization (SIMP) as a design model. Mathematical formulation of multi-material topology optimization problem solving minimum compliance is an alternating active-phase algorithm with the Gauss-Seidel version as an optimization model of optimality criteria. Numerical examples illustrate the reliability and accuracy of the present design method for multi-material topology optimization with Reissner-Mindlin plates using MITC4 elements and steel materials.

• Transactions on Electrical and Electronic Materials
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• 제5권4호
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• pp.138-142
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• 2004

This paper presents the improved bum-in method for the reliability of SRAM in Multi Chip Package (MCP). Semiconductor reliability is commonly improved through the bum-in process. Reliability problem is more significant in MCP that includes over two chips in a package, because the failure of one chip (SRAM) has a large influence on the yield and quality of the other chips - Flash Memory, DRAM, etc. Therefore, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level bum-in process using multi cells selection method in addition to the previously used methods. That method is effective in detecting special failure. Finally, with the composition of some kind of methods, we could achieve the high quality of SRAM in Multi Chip Package.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 한국전기전자재료학회 2004년도 추계학술대회 논문집 Vol.17
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• pp.53-56
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• 2004

This paper presents the improved burn-in method for the reliability of SRAM in MCP Semiconductor reliability is commonly improved through the burn-in process. Reliability problem is more significant in the Multi Chip Package, because of including over two devices in a package. In the SRAM-based Multi Chip Package, the failure of SRAM has a large effect on the yield and quality of the other chips - Flash Memory, DRAM, etc. So, the quality of SRAM must be guaranteed. To improve the quality of SRAM, we applied the improved wafer level burn-in process using multi cell selection method in addition to the current used methods. That method is effective in detecting special failure. Finally, with the composition of some kinds of methods, we could achieve the high qualify of SRAM in Multi Chip Package.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년도 학술대회
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• pp.84-91
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• 2008

Generalized hydrodynamic (GH) theory for multi-species gas and the computational models are developed for the numerical simulation of hypersonic rarefied gas flow on the basis of Eu's GH theory. The rotational non-equilibrium effect of diatomic molecules is taken into account by introducing excess normal stress associated with the bulk viscosity. The numerical model for the diatomic GH theory is developed and tested. Moreover, with the experience of developing the dia-tomic GH computational model, the GH theory is extended to a multi-species gas including 5 species; O$_2$, N$_2$, NO, O, N. The multi-species GH model includes diffusion relation due to the molecular collision and thermal phenomena. Two kinds of GH models are developed for an axisymmetric flow solver. By compar-ing the computed results of diatomic and multi-species GH theories with those of the Navier-Stokes equations and the DSMC results, the accuracy and physical consistency of the GH computational models are examined.

• 한국전산유체공학회:학술대회논문집
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• 한국전산유체공학회 2008년 추계학술대회논문집
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• pp.84-91
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• 2008

Generalized hydrodynamic (GH) theory for multi-species gas and the computational models are developed for the numerical simulation of hypersonic rarefied gas flow on the basis of Eu's GH theory. The rotational non-equilibrium effect of diatomic molecules is taken into account by introducing excess normal stress associated with the bulk viscosity. The numerical model for the diatomic GH theory is developed and tested. Moreover, with the experience of developing the dia-tomic GH computational model, the GH theory is extended to a multi-species gas including 5 species; $O_2,\;N_2$, NO, O, N. The multi-species GH model includes diffusion relation due to the molecular collision and thermal phenomena. Two kinds of GH models are developed for an axisymmetric flow solver. By compar-ing the computed results of diatomic and multi-species GH theories with those of the Navier-Stokes equations and the DSMC results, the accuracy and physical consistency of the GH computational models are examined.