• Journal of the Korean Vacuum Society
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• v.9 no.4
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• pp.400-405
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• 2000

We investigated the effect of TMIn (trimethly-indium) source depletion on InGaAs, InGaAsP and 1.55 $\mu\textrm{m}$ InGaAs/InGaAsP SMQW by using EPISON ultrasonic monitor for measuring the concentration of metalorganic/carrier gas mixtures. And the problems for the growth reproducibility in MOCVD was solved by using an EPISON ultrasonic monitor with closed-loop mode under the condition of TMIn source depletion. The saturation pressure of TMIn was dramatically decreased over consumption of 80%. In the case of bulk epilayer, Up-shifting of 300 arcsec to Ga-rich direction and FWHM broadening by a factor of two in DCXRD spectrum were observed due to the TMIn source depletion. In the case of SMQW, Up-shifting of 300 arcsec to Ga-rich direction in DCXRD spectrum and blue-shift of 40 nm in PL spectrum were observed due to the TMIn source depletion. However, good reproducibility ($\Delta\theta$<$\pm$100 arcsec) was achieved even the condition of 95% of TMIn consumption, when we used the EPISON with closed-loop mode.

• Korean Journal of Optics and Photonics
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• v.12 no.4
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• pp.312-319
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• 2001

We proposed a B-RWG LD (Buried-ridge waveguide laser diode) having more merits than a conventional RWG-LD. It's ridge width is controlled easily, it has the advantage of being more planar than the RWG-LD and it is possible to control refractive index with growth layer thickness. Before fabricating the device, we designed the optimal device for single mode, high efficiency and high power operation. From theoretical analysis, we have to control the $d_2, d_3$ layer thicknesses for lateral effective index difference, $\Delta_{nL}$ to be higher than critical value, and simultaneously consider the ridge width for single mode and low threshold current operation. As a result, it is possible to make a single mode LD having the ridge width of $6~9{\mu}m$ if the lateral effective index difference was controlled properly. perly.

• Korean Journal of Optics and Photonics
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• v.18 no.2
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• pp.155-161
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• 2007

A new and simple method of 3-dimensional circuit modeling and analysis is proposed and verified experimentally for the first time by determining 3-dimensional current flow and 2-dimensional light distribution in blue InGaN/GaN multi-quantum well (MQW) light emitting diode (LED) devices. Circuit parameters of the LED consist of the resistance of the metallic film and epitaxial layer, and the intrinsic diode which represents the active region emitting the light. The circuit parameters are extracted from the transmission line model (TLM) and current-voltage relation. We applied the >> proposed method and extracted circuit parameters to obtain the light emission pattern in a top-surface emitting-type LED. The current spreading effect is analyzed theoretically and quantitatively with a variation of the resistance of metallic and epitaxial layers. The emitting-light distribution of the fabricated blue LED showed a good agreement with the analyzed result, which shows the dark emission intensity at the corner of the p-electrode.

• Korean Journal of Materials Research
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• v.25 no.1
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• pp.1-8
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• 2015

This study suggested comprehensive structural characterization methods for the commercial blue light emitting diodes(LEDs). By using the Z-contrast intensity profile of Cs-corrected high-angle annular dark field scanning transmission electron microscope(HAADF-STEM) images from a commercial lateral GaN-based blue light emitting diode, we obtained important structural information on the epilayer structure of the LED, which would have been difficult to obtain by conventional analysis. This method was simple but very powerful to obtain structural and chemical information on epi-structures in a nanometer-scale resolution. One of the examples was that we could determine whether the barrier in the multi-quantum well(MQW) was GaN or InGaN. Plan-view TEM observations were performed from the commercial blue LED to characterize the threading dislocations(TDs) and the related V-pit defects. Each TD observed in the region with the total LED epilayer structure including the MQW showed V-pit defects for almost of TDs independent of the TD types: edge-, screw-, mixed TDs. The total TD density from the region with the total LED epilayer structure including the MQW was about $3.6{\times}10^8cm^{-2}$ with a relative ratio of Edge- : Screw- :Mixed-TD portion as 80%: 7%: 13%. However, in the mesa-etched region without the MQW total TD density was about $2.5{\times}10^8cm^{-2}$ with a relative ratio of Edge- : Screw- :Mixed-TD portion of 86%: 5%: 9 %. The higher TD density in the total LED epilayer structure implied new generation of TDs mostly from the MQW region.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.02a
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• pp.463-463
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• 2010

고휘도 고효율 백색 LED (lighting emitting diode)가 차세대 조명광원으로 급부상하고 있다. 백색 LED를 생산하기 위한 공정에서 MOCVD (유기금속화학증착)장비를 이용한 Epi wafer공정은 에피층과 기판의 격자상수 차이와 열팽창계수차이로 인하여 생성되는 에피결함의 제거를 위하여 기판과 GaN 박막층 사이에 완충작용을 해줄 수 있는 버퍼층 (Buffer layer)을 만들고 그 위에 InGaN/GaN MQW (Multi Quantum Well)공정을 하여 고휘도 고효율 백색 LED를 구현할 수 있다. 이 공정에서 기판의 온도가 불균일해지면 wafer 파장 균일도가 나빠지므로 백색 LED의 yield가 떨어진다. 균일한 기판 온도를 갖기 위한 조건으로 기판과 induction heater의 간격, 가스의 흐름, 기판의 회전, 유도가열코일의 디자인 등이 장비의 설계 요소이다. 코일에 교류전류를 흘려주면 이 코일 안 또는 근처에 있는 도전체에 와전류가 유도되어 가열되는 유도가열 방식은 가열 효율이 높아 경제적이고, 온도에 대한 신속한 응답성으로 인하여 열 손실을 줄일 수 있으며, 출력 온도 제어의 용이성 및 배출 가스 등의 오염 없다는 장점이 있다. 본 연구에서는 유도가열방식의 induction heater를 이용하여 회전에 의한 기판의 온도 균일도 측정을 하였다. 기초 실험으로 저항 가열 히터를 통하여 대류에 의한 온도 균일도를 평가하였다. 그 결과 gap이 3 mm일 때, 평균 온도 $166.5^{\circ}C$ 에서 불균일도 6.5 %를 얻었으며 이를 바탕으로 induction heater와 graphite susceptor의 간격이 3 mm일 때, 회전에 의한 온도 균일도를 측정을 하였다. 가열원은 induction heater (viewtong, VT-180C2)를 사용하였고, 가열된 graphite 표면의 온도를 2차원적으로 평가하기 위하여 적외선 열화상 카메라(Fluke, Ti-10)을 이용하여 온도를 측정하였다. 기판을 회전하면서 표면 온도의 평균과 표준 편차를 측정한 결과 2.5 RPM일 때 평균온도 $163^{\circ}C$ 에서 가장 좋은 5.5 %의 불균일도를 확인할 수 있었고, 이를 상용화 전산 유체 역학 코드인 CFD-ACE+의 모델링 결과와 비교 분석 하였다.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.08a
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• pp.99-99
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• 2013

In this talk, I will present two research works in progress, which are: i) mapping of piezoelectric polarization and associated charge density distribution in the heteroepitaxial InGaN/GaN multi-quantum well (MQW) structure of a light emitting diode (LED) by using inline electron holography and ii) in-situ observation of the polarization switching process of an ferroelectric Pb(Zr1-x,Tix)O3 (PZT) thin film capacitor under an applied electric field in transmission electron microscope (TEM). In the first part, I will show that strain as well as total charge density distributions can be mapped quantitatively across all the functional layers constituting a LED, including n-type GaN, InGaN/GaN MQWs, and p-type GaN with sub-nm spatial resolution (~0.8 nm) by using inline electron holography. The experimentally obtained strain maps were verified by comparison with finite element method simulations and confirmed that not only InGaN QWs (2.5 nm in thickness) but also GaN QBs (10 nm in thickness) in the MQW structure are strained complementary to accommodate the lattice misfit strain. Because of this complementary strain of GaN QBs, the strain gradient and also (piezoelectric) polarization gradient across the MQW changes more steeply than expected, resulting in more polarization charge density at the MQW interfaces than the typically expected value from the spontaneous polarization mismatch alone. By quantitative and comparative analysis of the total charge density map with the polarization charge map, we can clarify what extent of the polarization charges are compensated by the electrons supplied from the n-doped GaN QBs. Comparison with the simulated energy band diagrams with various screening parameters show that only 60% of the net polarization charges are compensated by the electrons from the GaN QBs, which results in the internal field of ~2.0 MV cm-1 across each pair of GaN/InGaN of the MQW structure. In the second part of my talk, I will present in-situ observations of the polarization switching process of a planar Ni/PZT/SrRuO3 capacitor using TEM. We observed the preferential, but asymmetric, nucleation and forward growth of switched c-domains at the PZT/electrode interfaces arising from the built-in electric field beneath each interface. The subsequent sideways growth was inhibited by the depolarization field due to the imperfect charge compensation at the counter electrode and preexisting a-domain walls, leading to asymmetric switching. It was found that the preexisting a-domains split into fine a- and c-domains constituting a $90^{\circ}$ stripe domain pattern during the $180^{\circ}$ polarization switching process, revealing that these domains also actively participated in the out-of-plane polarization switching. The real-time observations uncovered the origin of the switching asymmetry and further clarified the importance of charged domain walls and the interfaces with electrodes in the ferroelectric switching processes.

• Proceedings of the Korean Vacuum Society Conference
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• 2010.08a
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• pp.115-115
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• 2010

고휘도 고효율 백색 LED (lighting emitting diode)가 차세대 조명광원으로 급부상하고 있다. 백색 LED를 생산하기 위한 공정에서 MOCVD (유기금속화학증착)장비를 이용한 에피웨이퍼공정은 에피층과 기판의 격자상수 차이와 열팽창계수차이로 인하여 생성되는 에피결함의 문제로 기판과 GaN 박막층 사이에 완충작용을 해줄 수 있는 버퍼층 (Buffer layer)을 만든다. 그 위에 InGaN/GaN MQW (Multi Quantum Well)공정을 하여 고휘도 고효율 백색 LED를 구현 할 수 있다. 이 공정에서 기판의 온도가 불균일해지면 wafer 파장 균일도가 나빠지므로 백색 LED의 yield가 떨어진다. 균일한 기판 온도를 갖기 위한 조건으로 기판과 induction heater의 간격, 가스의 흐름, 기판의 회전, 유도가열코일의 디자인 등이 장비의 설계 요소이다. 본 연구에서는 유도가열방식의 유도가열히터를 이용하여 기판과 히터의 간격에 차이에 따른 기판 균일도 측정했고, 회전에 의한 기판의 온도분포와 자기장분포의 실험적 결과를 상용화 유체역학 코드인 CFD-ACE+의 모델링 결과와 비교 했다. 또한 가스의 inlet위치에 따른 기판의 온도 균일도를 측정하였다. 본 연구에서 사용된 가열원은 유도가열히터 (Viewtong, VT-180C2)를 사용했고, 가열된 흑연판 표면의 온도를 2차원적으로 평가하기 위하여 적외선 열화상 카메라 (Fluke, Ti-10)를 이용하여 온도를 측정했다. 와전류에 의한 흑연판의 가열 현상을 누출 전계의 분포로 확인하기 위하여 Tektronix사의 A6302 probe와 TM502A amplifier를 사용했다. 흑연판 위에 1 cm2 간격으로 211곳에서 유도 전류를 측정했다. 유도전류는 벡터양이므로 $E{\theta}$를 측정했으며, 이때의 측정 방향은 흑연판의 원주방향이다. 또한 자기장에 의한 유도전류의 분포를 확인하기 위하여 KANETEC사의 TM-501을 이용하여 흑연판 중심으로부터 10 mm 간격으로 자기장을 측정 했다. 저항 가열 히터를 통하여 대류에 의한 온도 균일도를 평가한 결과 gap이 3 mm일때, 평균 온도 $166.5^{\circ}C$에서 불균일도 6.5%를 얻었으며, 회전에 의한 온도 균일도 측정 결과는 2.5 RPM일 때 평균온도 $163^{\circ}C$에서 5.5%의 불균일도를 확인했다. 또한 CFD-ACE+를 이용한 모델링 결과 자기장의 분포는 중심이 높은 분포를 나타냄을 확인했고, 기판의 온도분포는 중심으로부터 55 mm되는 곳에서 300 W/m3로 가장 높은 분포를 나타냈다. 가스 inlet 위치를 흑연판 중심으로 수직, 수평 방향으로 흘려주었을 때의 불균일도는 각각 10.5%, 8.0%로 수평 방향으로 가스를 흘려주었을 때 2.5% 온도 균일도 향상을 확인했다.

• Korean Journal of Optics and Photonics
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• v.14 no.2
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• pp.142-145
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• 2003

The nonreciprocal phase shift characteristics of infinite slab optical waveguides with magneto-optic materials in the cladding layer was calculated at 1.55 ${\mu}{\textrm}{m}$ for optical isolators. The infinite slab waveguide structures considered in this paper were as follows. rho magneto-optic materials used as a cladding layer were Ce:YIG and LNB(LuNdBi)$_3$(FeAl)$_{5}$)$_{12}$,). Their specific Faraday rotations Θ$_{F}$ are 4500$^{\circ}$/cm, 500$^{\circ}$/cm at wavelength 1.55 ${\mu}{\textrm}{m}$ respectively. The guiding layer with multi-quantum well structure was used, and it consists of 1.3Q and InGaAs. In order to investigate the effect of evanescent field penetrating the cadding, layer, guiding mode characteristics were calculated for the cases when the substrate is InP and air. We calculated the minimum lengths of 90$^{\circ}$ nonreciprocal phase shifters and their optimum guiding layer thicknesses in various optical waveguide structures.res.s.

• Journal of the Korean Crystal Growth and Crystal Technology
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• v.22 no.1
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• pp.5-10
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• 2012

In general, the fabrications of the LEDs with mesa structure are performed grown by MOCVD method. In order to etch and separate each chips, the LEDs are passed the RIE and scribing processes. The RIE process using plasma dry etching occur some problems such as defects, dislocations and the formation of dangling bond in surface result in decline of device characteristic. The SAG method has attracted considerable interest for the growth of high quality GaN epi layer on the sapphire substrate. In this paper, the SAG method was introduced for simplification and fabrication of the high quality epi layer. And we report that the size of selective area do not affect the characteristics of original LED. The diameter of SAG circle patterns were choose as 2500, 1000, 350, and 200 ${\mu}m$. The SAG-LEDs were measured to obtain the device characteristics using by SEM, EL and I-V. The main emission peaks of 2500, 1000, 350, and 200 ${\mu}m$ were 485, 480, 450, and 445 nm respectively. The chips of 350, 200 ${\mu}m$ diameter were observed non-uniform surface and resistance was higher than original LED, however, the chips of 2500, 1000 ${\mu}m$ diameter had uniform surface and current-voltage characteristics were better than small sizes. Therefore, we suggest that the suitable diameter which do not affect the characteristic of original LED is more than 1000 ${\mu}m$.