• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.10a
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• pp.273-276
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• 2003

High-temperature superconduction materials(Bi2223) possess electrical/electronic and magnetic properties. Because high-temperature superconduction materials is a ceramic powder, that can not be produced singlehandedly. So Ag sheathed Bi-2223 wire was produced by drawing process using powder-in-tube(PIT) method. This superconductor has many difficulties to produce. The main difficulty is that the mechanical properties of the ceramic powder are very different from those of the Ag sheath. Bi2223 high-temperature superconductivity have a single filament drawing process, and multi-filament drawing process. This study analysed multi-filament drawing process by FEM, a defects during multi-filament drawing was studied by FEM.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2003.05a
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• pp.258-261
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• 2003

In this study, finite element analysis for multi-stage deep drawing process of rectangular configuration with extreme aspect ratio is carried out especially for the blank design. The analysis of rectangular deep drawing process with extreme aspect ratio is likewise very difficult with respect to the design process parameters including the intermediate die profile. In order to solve the difficulties, numerical approach using finite element method is performed in the present analysis and design. A series of experiments for multi-stage rectangular deep drawing process are conducted and the deformed configuration is investigated by comparing with the results of the finite element analysis. Additionally, to minimize amount of removal material after trimming process, finite element simulation is applied for the blank modification. The analysis incorporates brick elements for a rigid-plastic finite element method with an explicit time integration scheme using LS-DYNA3D.

• Journal of Korea Society of Industrial Information Systems
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• v.15 no.1
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• pp.47-57
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• 2010

There have been many problems to apply SPC(Statistical Process Control) which is a traditional process control technology to the process of multi-product, small-sized production because a machine in the process manufactures small numbers, but various kinds of products. Therefore, we need the new process control system that can flexibly control the process by setting up the SPEC rules and the KNOWHOW rules. The SPEC rule contains the combination of diverse conditions to specify the characteristics of various products. The KNOWHOW rule is based on engineers' know-how. The study suggests the Rule-base Process Control that can be optimized to the multi-product, small-sized production. It was validated in the process of semiconductor production.

• 제어로봇시스템학회:학술대회논문집
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• 2002.10a
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• pp.102.2-102
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• 2002

In this paper, the improved Multi-FNN (Fuzzy-Neural Networks) model is identified and optimized using HCM (Hard C-Means) clustering method and optimization algorithms. The proposed Multi-FNN is based on FNN and use simplified and linear inference as fuzzy inference method and error back propagation algorithm as learning rules. We use a HCM clustering and genetic algorithms (GAs) to identify both the structure and the parameters of a Multi-FNN model. Here, HCM clustering method, which is carried out for the process data preprocessing of system modeling, is utilized to determine the structure of Multi-FNN according to the divisions of input-output space using I/O process data. Also, the parame...

• Journal of Korean Institute of Industrial Engineers
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• v.36 no.3
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• pp.154-163
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• 2010

Process monitoring of output variables affecting final performance have been mainly executed in semiconductor manufacturing process. However, even earlier detection of causes of output variation cannot completely prevent yield loss because a number of wafers after detecting them must be re-processed or cast away. Semiconductor manufacturers have put more attention toward monitoring process inputs to prevent yield loss by early detecting change-point of the process. In the paper, we propose the method to efficiently monitor functional input variables in multi-phase semiconductor manufacturing process. Measured input variables in the multi-phase process tend to be of functional structured form. After data pre-processing for these functional input data, change-point analysis is practiced to the pre-processed data set. If process variation occurs, key variables affecting process variation are selected using contribution plot for monitoring efficiency. To evaluate the propriety of proposed monitoring method, we used real data set in semiconductor manufacturing process. The experiment shows that the proposed method has better performance than previous output monitoring method in terms of fault detection and process monitoring.

• Wind and Structures
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• v.1 no.2
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• pp.161-174
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• 1998

Wind forces on structures are usually schematized by the sum of their mean static part and a nil mean fluctuation generally treated as a stationary process randomly varying in space and time. The multi-variate and multi-dimensional nature of such a process requires a considerable quantity of numerical procedures to carry out the dynamic analysis of the structural response. With the aim of drastically reducing the above computational burden, this paper introduces a method by means of which the external fluctuating wind forces on slender structures and structural elements are schematized by an equivalent process identically coherent in space. This process is identified by a power spectral density function, called the Generalized Equivalent Spectrum, whose expression is given in closed form.

• Transactions of Materials Processing
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• v.28 no.5
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• pp.275-280
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• 2019

The aim of this study is to fabricate an ultra-fine pure rhodium wire using multi-pass wire drawing process. To manufacture $30{\mu}m$ ultra-fine rhodium wire from the initial $50{\mu}m$ wire, a multi-pass wire drawing process was designed based on the uniform reduction ratio theory. The elastic-plastic finite element analysis was then conducted to validate the efficacy of the designed process. The drawing load, drawing stress, and the distribution of the effective strain were evaluated using the finite element analysis. Finally, the wire drawing experiment was performed to validate the designed wire drawing process. From the results of the experiment, the diameter of the final drawn wire was found to be $29.85{\mu}m$.

• Proceedings of the KIEE Conference
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• 2005.05a
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• pp.148-151
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• 2005

This paper proposes a high speed interface using redundant multi-valued logic for high speed communication ICs. This circuit is composed of encoding circuit that serial binary data are received and converted into parallel redundant multi-valued data, and decoding circuit that convert redundant multi-valued data to parallel binary data. Because of the multi-valued data conversion, this circuit makes it possible to achieve higher operating speeds than that of a conventional binary logic. Using this logic, a 1:4 demultiplexer (DEMUX, serial-parallel converter) IC was designed using a 0.35${\mu}m$ standard CMOS Process. Proposed demultiplexer is achieved an operating speed of 3Gb/s with a supply voltage of 3.3V and with power consumption of 48mW. Designed circuit is limited by maximum operating frequency of process. Therefore, this circuit is to achieve CMOS communication ICs with an operating speed greater than 3Gb/s in submicron process of high of operating frequency.

• Journal of IKEEE
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• v.22 no.2
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• pp.302-308
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• 2018

Multi-Layer Sputtering is aim to develop desired thickness thin film multi-layer with different materials. The multi-layer thin film deposition process occupies a relatively large portion in the process time, because the main reason is that it takes much time to move the substrate to be deposited and to make the chamber into a high vacuum state compared to the process time. Most of semiconductor and display industries sputter a single substance in one chamber and move boards through multi-continuous robots to another chamber to sputter other materials. This will inevitably require multiple chambers, vacuum pumps, and multi-contamination robots within the process facility. To solve these problems, this paper proposes a control system for multi-layer thin film sputtering devices that deposit different materials within a single vacuum chamber and is applied in TFT process. The manufacture and experiment of the control system proved its validity.

• Journal of the Korean Society for Precision Engineering
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• v.26 no.11
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• pp.124-130
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• 2009

In the multi-stage shape drawing process, the most important aspect for the economy is the correct design of the various drawing stage. For most of the products commonly available round or square materials can be used as initial material. However, special products should be pre-rolled. This study proposes a process design method of multi-stage shape drawing process for producing cross roller guide. Firstly, a standard classification of shape drawing process is suggested based on the requirement of pre-rolling process. And a design method is proposed to design the intermediate die shape. The process design method is applied to design the multi-stage shape drawing process for producing cross roller guide. Finally, the effectiveness of the proposed design method is verified by FE-analysis and shape drawing experiment.