• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 1997.11a
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• pp.456-460
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• 1997

As device sizes are scaled to submicron dimensions, planarization technology becomes increasing1y important, both during device fabrication and during formation of multilevel interconnects and wiring. Chemical Mechanical Polishing (CMP) has emerged recently as a new processing technique for achieving a high degree of planarization for submicron VLSI applications. This paper is presented the results of CMP process window characterization studies for 0.35 micron process with 6 metal layers.

• Structural Monitoring and Maintenance
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• v.3 no.2
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• pp.175-194
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• 2016

Based on the change of traditional viscoelastic damper structure, a brand-new damper is designed to control simultaneously the translational vibration and the rotational vibration for platforms. Experimental study has been carried out on the mechanical properties of viscoelastic material and on its multi-dimensional seismic response control effect of viscoelastic damper. Three types of viscoelastic dampers with different shapes of viscoelastic material are designed to test the influence of excited frequency, strain amplitude and ambient temperature on the mechanical property parameters such as circular dissipation per unit, equivalent stiffness, loss factor and storage shear modulus. Then, shaking table tests are done on a group of single-storey platform systems containing one symmetric platform and three asymmetric platforms with different eccentric forms. Experimental results show that the simulation precision of the restoring force model is rather good for the shear deformation of viscoelastic damper and is also satisfied for the torsion deformation and combined deformations of viscoelastic damper. The shaking table tests have verified that the new-type viscoelastic damper is capable of mitigating the multi-dimensional seismic response of offshore platform.

• Journal of Institute of Control, Robotics and Systems
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• v.18 no.9
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• pp.854-862
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• 2012

The optimal design of batch-storage network by using periodic square wave model provides analytical lot sizing equations for a complex supply chain network characterized as multi-supplier, multi-product, multi-stage, non-serial, multi-customer, cyclic system including recycling and/or remanufacturing. The network structure includes multiple currency flows as well as material flows. The processes are represented by multiple feedstock/product materials with fixed composition which are very suitable for production processes. In this study, transportation processes that carry multiple materials with unknown composition are added and the time frame is changed from single period into multiple periods in order to represent nonperiodic parameter variations. The objective function of the optimization involves minimizing the opportunity costs of annualized capital investments and currency/material inventories minus the benefit to stockholders in the numeraire currency. The expressions for the Kuhn-Tucker conditions of the optimization problem are reduced to a multiperiod subproblem for average flow rates and analytical lot-sizing equations. The multiperiod lot sizing equations are different from single period ones. The effects of corporate income taxes, interest rates and exchange rates are incorporated.

• Korean Journal of Computational Design and Engineering
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• v.11 no.4
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• pp.235-245
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• 2006

This paper proposes a CSG-based representation scheme for heterogeneous objects including multi-material objects and Functionally Graded Materials (FGMs). In particular, this scheme focuses on the construction of complicated heterogeneous objects guaranteeing desired material continuities at all the interfaces. In order to create various types of heterogeneous primitives, we first describe methods for specifying material composition functions such as geometry-independent, geometry-dependent functions. Constructive Material Composition (CMC) and corresponding heterogeneous Boolean Operators (e.g. material union, difference, intersection. and partition) are then proposed to illustrate how material continuities are dealt with. Finally, we describe the model hierarchy and data structure for computer representation. Even though the proposed scheme alone is sufficient for modeling all sorts of heterogeneous objects, the proposed scheme adopts a hybrid representation between CSG and decomposition. That is because hybrid representation can avoid the unnecessary growth of binary trees.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.207-208
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• 2007

Recently, high performance microelectronic devices are designed in multi-layer structure in order to make dense wiring of metal conductors in compact size. Imprint lithography have received significant attention due to an alternative technology for photolithography on such devices. In this work, we synthesized dielectric composite materials based on epoxy resin, and investigated their thermal stabilities and dynamic mechanical properties for thermal imprint lithography. In order to enhance the mechanical properties and toughness of dielectric material, various modified polyetherimide(PEI) was applied in the resin system. Curing behaviours, thermal stabilities, and dynamic mechanical properties of the dielectric materials cured with various conditions were studied using dynamic differential scanning calorimetry (DSC), thermo gravimetric analysis (TGA), and Universal Test Method (INSTRON).

• 대한공업교육학회지
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• v.35 no.2
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• pp.224-237
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• 2010

When the underwater structure sails high speed, noise and vibration propagate to the sensor in the nose of the dome. In this paper, to avoid this kind of noise and vibration CRP(Carbon Reinforced Plastic) material and SNORE ring(Self-NOise REduction Ring) are attached at the curved structure and simulates its isolation characteristics using commercial software. Vibration displacement and stress are calculated at the planar sensor array. The material of the curved structure is aluminum and maximum outer diameter is 53Omm, 215mm in length, 270mm in planar diameter, respectively. Based on the simulation results, reduction ratio of the received normal stress at the sensor is above 95% at the frequency of 12kHz and 15kHz. At the mid point of the planar sensor the normal stress is higher than 20mm and 40mm apart. This results can be used to increase the sensitivity of the acoustic sensor as a basic data.

• Journal of KSNVE
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• v.8 no.6
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• pp.1093-1102
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• 1998

The success of controllability of smart structures depends on the quality of the bonding along the interface between the main structure and the attached sensing and acuating elements. Generally, the analysis procedures neglect the effect of the interfacial bond layer or assume that this bond layer behaves like viscoelastic material. Three different bond layers. two modified epoxy adhesives, and one isocyanate adhesive were prepared for their toughness and moduli. Bond layer of the chosen adhesive provides an almost perfect bonding condition between the composite structure and the PZT while bended significantly like arrow-shape. The perfect bonding condition is tested by considering various material properties of the bond layers. and based on this perfect bonding condition, the effects of the interfacial bond layer on the dynamic behavior and controllability of the test structure is experimentally studied. Once the perfect bonding condition is achieved. dynamic effects of the bond layer itself on the dynamic characteristics of the main structure is negligible. but the contribution of the attached PZT elements on the stiffness of the multi-layered structure becomes significant when the thickness of the bond layer increased.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.291-294
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• 2003

The circuit substrate was made from the Low Temperature Cofired Ceramics(LTCC) that a $\varepsilon_\gamma$ was 7.8. Accumulated Varactor and the low noise transistor which were a Surface Mount Device-type element on LTCC substrate. Let passive element composed R, L, C with strip-line of three dimension in the multilayer substrate circuit inside, and one structure accumulate band-pass filter, resonator, a bias line, a matching circuit, and made it. Used Screen-Print process, and made Strip-line resonator. A design produced and multilayer-type VCO(Voltage Controlled Oscillator), and recognized a characteristic with the Spectrum Analyzer which was measurement equipment. Measured multilayer structure VCO is oscillation frequency 1292[MHz], oscillation output -28.38[dBm], hamonics characteristic -45[dBc] in control voltage 1.5[V], A phase noise is -68.22[dBc/Hz] in 100 KHz offset frequency. The oscillation frequency variable characteristic showed 30[MHz/V] characteristic, and consumption electric current is approximately 10[mA].

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.33 no.3
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• pp.173-176
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• 2020

This study focuses on a pillar in which is implanted a P-type maneuver under a P base. This structure is called a super junction structure. By inserting the pillar, the electric field concentrated on the P base is shared by the pillar, so the columns can be dispersed while maintaining a high breakdown voltage. Ten pillars were generated during the multi epitaxial process. The interval between pillars is varied to optimize the electric field to be concentrated on the pillar at a threshold voltage of 6 V, a yield voltage of 4,500 V, and an on-state voltage drop of 3.8 V. The density of the filler gradually decreased when the interval was extended by implanting a filler with the same density. The results confirmed that the size of the depletion layer between the filler and the N-epitaxy layer was reduced, and the current flowing along the N-epitaxy layer was increased. As the interval between the fillers decreased, the cost of the epitaxial process also decreased. However, it is possible to confirm the trade-off relationship that deteriorated the electrical characteristics and efficiency.

• Steel and Composite Structures
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• v.33 no.1
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• pp.93-109
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• 2019

In the present study, vibration analysis of double bonded micro sandwich cylindrical shells with saturated porous core and carbon/boron nitride nanotubes (CNT/BNNT) reinforced composite face sheets under multi-physical loadings based on Cooper-Naghdi theory is investigated. The material properties of the micro structure are assumed to be temperature dependent, and each of the micro-tubes is placed on the Pasternak elastic foundations, and mechanical, moisture, thermal, electrical, and magnetic forces are effective on the structural behavior. The distributions of porous materials in three distributions such as non-linear non-symmetric, nonlinear-symmetric, and uniform are considered. The relationship including electro-magneto-hydro-thermo-mechanical loadings based on modified couple stress theory is obtained and moreover the governing equations of motion using the energy method and the Hamilton's principle are derived. Also, Navier's type solution is also used to solve the governing equations of motion. The effects of various parameters such as material length scale parameter, temperature change, various distributions of nanotube, volume fraction of nanotubes, porosity and Skempton coefficients, and geometric parameters on the natural frequency of double bonded micro sandwich cylindrical shells are investigated. Increasing the porosity and the Skempton coefficients of the core in micro sandwich cylindrical shell lead to increase the natural frequency of the structure. Cylindrical shells and porous materials in the industry of filters and separators, heat exchangers and coolers are widely used and are generally accepted today.