• Proceedings of the Korea Concrete Institute Conference
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• 2006.11a
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• pp.397-400
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• 2006

Most of the civil structures in Korea and abroad have many kinds of damages when they are facing over-loaded traffics, long-term serviceability, and severe environmental conditions. Repair, rehabilitation, and retrofit are important for maintaining the serviceability of structures. In recent year, VES-LMC has been widely used as repair material for bridge deck repair and rehabilitation, because the VES-LMC has a various benefits such as traffic opening after 3 hours of curing, higher durability and bond strength. In case of any structure repaired or rehabilitated with VES-LMC, those were influenced capacity of bond between the base layer of slab and VES-LMC as well as physical properties of each other materials. The capacity of bond depended on purity of interface, micro cracks, curing of VES-LMC and so like. A kind of popular concrete repair technique, High pressure water jetting equipment is extremely efficient at removing damaged concrete. Removing damaged or poor quality concrete from sensitive structures such as bridge, tunnels, multi-story car parking decks and runways, using the high pressure water jetting could remove damaged or poor quality concrete remaining healthy and sound concrete. Accordingly, the purpose of this study is that it was to evaluate effect of hydrodemolition on the bond strength of VES-LMC overlay compared with effects of other method such as breaker, untreated. Also, it was evaluated the effect of surface moisture.

• International Journal of Highway Engineering
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• v.18 no.1
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• pp.85-90
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• 2016

PURPOSES : The objective of this paper is to understand the deterioration phenomenon and causes in the pavement of a ramp area. METHODS : Ramp areas need to be sloped because of the centrifugal force, which depends on the vehicle speed and grade of the ramp area. As a result, vertical and horizontal forces are applied on the pavement surface of the ramp area. Furthermore, the horizontal force depends on the vehicle speed and grade of the ramp area. In order to analyze the pavement structure of a ramp area, a multi-layered elastic analysis program was used to evaluate the weakest link of fatigue cracking deterioration, according to the simultaneously applied vertical and horizontal forces. RESULTS : From case studies related to the bonding conditions between the surface and base layer in a ramp area, it was found that the partially bonded cases resulted in a critical potential of fatigue cracking deterioration, in a comparison of 50%, 70%, and fully bonded cases. CONCLUSIONS : According to the results of the case studies, the pavement structure system should be reinforced by upgrading the material or increasing the thickness compared to the general pavement areas, in order to provide a performance life similar to the mainline pavements in the ramp areas.

• Restorative Dentistry and Endodontics
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• v.24 no.4
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• pp.546-553
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• 1999

In Older to evaluate the effectiveness of 'One-bottle dentin adhesive system', the shear bond strengths of two fourth generation dentin adhesive systems and two One-bottle systems to the occlusal dentin of the freshly extracted third molars were measured by the regulation of the ISO TR 11405. The fourth generation dentin adhesive systems used in this study were Scotchbond Multi-Purpose Plus and All-Bond 2, and the One-bottle systems were Single Bond and One-Step. The effects of the thickness of hybrid layer and adhesive layer, the diameter of resin tag and the ratio between the diameter of resin tag and that of dentinal tubule were analyzed as the contributing factors of the shear bond strength of dentin bonding systems from the Scanning Electron Microscopic images. The results were as follows: 1. The shear bond strengths of Scotchbond Multi-Purpose, All-Bond 2, and Single Bond were 16.98${\pm}$3.40 MPa, 15.10${\pm}$2.77 MPa and 15.05${\pm}$3.18 MPa, respectively. There were no statistical differences(p>0.05). 2. But, the shear bond strength of One-Step were significantly lower than those of the other groups (11.81${\pm}$1.95 MPa, p<0.05). 3. The thicknesses of hybrid layer and adhesive layer of One-Step were significantly thinner than those of the other groups(p<0.05). The differences of the diameter of resin tag(p=0.0685) and the ratio between the diameter of resin tag and that of dentinal tubule(p=0.2401) were not significant among all the material groups. 4. The thickness of hybrid layer and adhesive layer might be considered as contributing factors of the she at bond strengths of dentin bonding systems, but the diameter of resin tag and the ratio between the diameter of resin tag and that of dentinal tubule might not.

• Korean Journal of Materials Research
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• v.20 no.11
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• pp.606-610
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• 2010

Films consisting of a silicon quantum dot superlattice were fabricated by alternating deposition of silicon rich silicon nitride and $Si_3N_4$ layers using an rf magnetron co-sputtering system. In order to use the silicon quantum dot super lattice structure for third generation multi junction solar cell applications, it is important to control the dot size. Moreover, silicon quantum dots have to be in a regularly spaced array in the dielectric matrix material for in order to allow for effective carrier transport. In this study, therefore, we fabricated silicon quantum dot superlattice films under various conditions and investigated crystallization behavior of the silicon quantum dot super lattice structure. Fourier transform infrared spectroscopy (FTIR) spectra showed an increased intensity of the $840\;cm^{-1}$ peak with increasing annealing temperature due to the increase in the number of Si-N bonds. A more conspicuous characteristic of this process is the increased intensity of the $1100\;cm^{-1}$ peak. This peak was attributed to annealing induced reordering in the films that led to increased Si-$N_4$ bonding. X-ray photoelectron spectroscopy (XPS) analysis showed that peak position was shifted to higher bonding energy as silicon 2p bonding energy changed. This transition is related to the formation of silicon quantum dots. Transmission electron microscopy (TEM) and electron spin resonance (ESR) analysis also confirmed the formation of silicon quantum dots. This study revealed that post annealing at $1100^{\circ}C$ for at least one hour is necessary to precipitate the silicon quantum dots in the $SiN_x$ matrix.

• Composites Research
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• v.30 no.3
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• pp.215-222
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• 2017

The effect of a multi walled carbon nanotubes (MWNCT) on the adhesive properties and thermal properties of epoxy were studied by double lap-shear tests. Epoxy/MWCNT resins were prepared from a different amount of the MWCNT incorporated into the epoxy resins (araldite 2011). Steel plates and carbon fiber reinforced plastics (CFRP) were chosen as materials. Mechanical tests were performed by a universal testing machine (UTM). The analysis of thermal properties were conducted by a thermogravimetric analyzer (TGA) and a differential scanning calorimetry (DSC). The fracture surface morphology was examined using a scanning electron microscopy (SEM) and optical microscope. Compared to neat epoxy, it was found that the mechanical properties of epoxy/MWCNT resins are increased.

• Steel and Composite Structures
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• v.35 no.4
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• pp.463-474
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• 2020

In this paper, the influence of adding multi-walled carbon nanotube (MWCNT) on the pull behavior of steel and GFRP bars in ultra-high-performance concrete (UHPC) was examined experimentally and numerically. For numerical analysis, 3D nonlinear finite element modeling (FEM) with the help of ABAQUS software was used. Mechanical properties of the specimens, including Young's modulus, tensile strength and compressive strength, were extracted from the experimental results of the tests performed on standard cube specimens and for different values of weight percent of MWCNTs. In order to consider more realistic assumptions, the bond between concrete and bar was simulated using adhesive surfaces and Cohesive Zone Model (CZM), whose parameters were obtained by calibrating the results of the finite element model with the experimental results of pullout tests. The accuracy of the results of the finite element model was proved with conducting the pullout experimental test which showed high accuracy of the proposed model. Then, the effect of different parameters such as the material of bar, the diameter of the bar, as well as the weight percent of MWCNT on the bond behavior of bar and UHPC were studied. The results suggest that modifying UHPC with MWCNT improves bond strength between concrete and bar. In MWCNT per 0.01 and 0.3 wt% of MWCNT, the maximum pullout strength of steel bar with a diameter of 16 mm increased by 52.5% and 58.7% compared to the control specimen (UHPC without nanoparticle). Also, this increase in GFRP bars with a diameter of 16 mm was 34.3% and 45%.

• The Journal of Korean Academy of Prosthodontics
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• v.46 no.2
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• pp.148-156
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• 2008

Statement of problems: Self-etch adhesives exhibit some clinical benefits such as ease of manipulation and reduced technique-sensitivity. Nevertheless, some concern remains regarding the bonding effectiveness of self-etch adhesives to enamel, in particular when so-called 'mild' self-etch adhesives are employed. This study compared the microtensile bond strengths to ground enamel of the two-step self-etch adhesive Clearfil SE Bond (Kuraray) to the three-step etch-and- rinse adhesive Scotchbond Multi-Purpose (3M ESPE) and the one-step self-etch adhesive iBond (Heraeus Kulzer). Purpose: The purpose of this study was to determine the effect of a preceding phosphoric acid conditioning step on the bonding effectiveness of a two-step self-etch adhesive to ground enamel. Material and methods: The two-step self-etch adhesive Clearfil SE Bond non-etch group, Clearfil SE Bond etch group with prior 35% phosphoric acid etching, and the one-step self-etch adhesive iBond group were used as experimental groups. The three-step etch-and-rinse adhesive Scotchbond Multi-Purpose was used as a control group. The facial surfaces of bovine incisors were divided in four equal parts cruciformly, and randomly distributed into each group. The facial surface of each incisor was ground with 800-grit silicon carbide paper. Each adhesive group was applied according to the manufacturer's instructions to ground enamel, after which the surface was built up using Light-Core (Bisco). After storage in distilled water at $37^{\circ}C$ for 1 week, the restored teeth were sectioned into enamel beams approximately 0.8*0.8mm in cross section using a low speed precision diamond saw (TOPMET Metsaw-LS). After storage in distilled water at $37^{\circ}C$ for 1 month, 3 months, microtensile bond strength evaluations were performed using microspecimens. The microtensile bond strength (MPa) was derived by dividing the imposed force (N) at time of fracture by the bond area ($mm^2$). The mode of failure at the interface was determined with a microscope (Microscope-B nocular, Nikon). The data of microtensile bond strength were statistically analyzed using a one-way ANOVA, followed by Least Significant Difference Post Hoc Test at a significance level of 5%. Results: The mean microtensile bond strength after 1 month of storage showed no statistically significant difference between all adhesive groups (P>0.05). After 3 months of storage, adhesion to ground enamel of iBond was not significantly different from Clearfil SE Bond etch (P>>0.05), while Clearfil SE Bond non-etch and Scotchbond Multi-Purpose demonstrated significantly lower bond strengths (P<0.05), with no significant differences between the two adhesives. Conclusion: In this study the microtensile bond strength to ground enamel of two-step self-etch adhesive Clearfil SE Bond was not significantly different from three-step etch-and-rinse adhesive Scotchbond Multi-Purpose, and prior etching with 35% phosphoric acid significantly increased the bonding effectiveness of Clearfil SE Bond to enamel at 3 months.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.23 no.9
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• pp.696-700
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• 2010

We fabricated red and blue organic light emitting display (OLEDs) which had the two kinds of multi-structure of ITO/HIL/HTL/EML/ETL/LiF/Al and ITO/HIL/HTL/EML/ETL/LiF/Al/LiF. In the case of red OLED that had LiF/Al/LiF structure compared to LiF/Al structure, the current density increased from 4.3 mA/$cm^2$ to 7.3 mA/$cm^2$, and the brightness increased from 488 cd/$m^2$ to 1,023 cd/$m^2$ at 7.0 V, and as a result the current efficiency was improved from 11.28 cd/A to 13.95 cd/A. Also in the case of blue OLED that had LiF on Al cathode layer, the current density increased from 1.2 mA/$cm^2$ to 1.8 mA/$cm^2$, and the brightness increased from 45 cd/$m^2$ to 85 cd/$m^2$ at 7.0 V, and as a result the current efficiency was improved from 3.69 cd/A to 4.82 cd/A. Through these experimental results it could be suggested that the LiF layer formed on Al prevents the oxidation of Al surface, and the electrode resistance become low with increase of supplied electrons, therefore the brightness and the efficiency are improved from the influence to the well-balanced bonding of electron and hole at emitting layer.

• Design & Manufacturing
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• v.14 no.4
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• pp.65-70
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• 2020

Partial reinforcement of sheet metal parts with CFRP patch is a technology that can realize ultra-lightweight body parts while overcoming the high material cost of carbon fiber. Performing these patchworks with highly productive press equipment solves another issue of CFRP: high process costs. The A-pillar is the main body part and has an undercut shape for fastening with other parts such as roof panels and doors. Therefore, it is difficult to bond CFRP patches to the A-pillar with a general press forming tool. In this paper, a flexible system that applies uniform pressure to complex shapes using ceramic particles and silicone rubber is proposed. By benchmarking various A-pillars, a reference model with an undercut shape was designed, and the system was configured to realize a uniform pressure distribution in the model. The ceramic spherical particles failed to realize the uniform distribution of high pressure due to their high hardness and point contact characteristics, which caused damage to the CFRP patch. Compression equipment made of silicone rubber was able to achieve the required pressure level for curing the epoxy. Non-adhesion defects between the metal and the CFRP patch were confirmed in the area where the bending deformation occurred. This defect could be eliminated by optimizing the process conditions suitable for the newly developed flexible system.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.2
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• pp.73-79
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• 2022

In this study, a reaction study between Ga, which has recently been spotlighted as a low-temperature bonding material, and Cu, a representative electrode material, was conducted to investigate information necessary for low-temperature soldering applications. Interfacial reaction and intermetallic compound (IMC) growth were observed and analyzed by reacting Ga and Cu/Au substrates in the temperature range of 80-200℃. The main IMC growing at the reaction interface was CuGa₂ phase, and AuGa₂ IMC with small particle sizes was formed on the upper part and Cu₉Ga₄ IMC with a thin band shape on the lower part of the CuGa₂ layer. CuGa₂ particles showed a scallop shape, and the particle size increased without significant shape change as the reaction time increased, similar to the case of Cu₆Sn₅ growth. As a result of analyzing the CuGa₂ growth mechanism, the time exponent was calculated to be ~3.0 in the temperature range of 120-200℃, and the activation energy was measured to be 17.7 kJ/mol.