• 대한금속재료학회지
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• 제47권5호
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• pp.311-315
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• 2009

2-dimensional (2D) dopant profiling in semiconductor device was carried out by electron holography and scanning capacitance microscopy methods with the same multi-layered p-n junction sample. The dopant profiles obtained from two methods are in good agreement with each other. It demonstrates that reliability of dopant profile measurement can be increased through precise comparison of 2D profiles obtained from various techniques.

• 한국재료학회지
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• 제17권2호
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• pp.61-67
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• 2007

The magnetron reactive sputtering was adopted to deposit CuO buffer layers on the polyimide surfaces for increasing the adhesion strength between Cu thin films and polyimide, varying $O_2$ gas flow rate from 1 to 5 sccm. The CuO oxide was formed through all the $O_2$ gas flow rates of 1 to 5 sccm, showing the highest value at the 3 sccm $O_2$ gas flow rate. The XPS analysis revealed that the $Cu_2O$ oxide was also formed with a significant ratio during the reactive sputtering. The adhesion strength is mainly dependent on the amount of CuO in the buffer layers, which can react with C-O-C or C-N bonds on the polyimide surfaces. The adhesion strength of the multi-layered Cu/buffer layer/polyimide specimen decreased linearly as the heating temperature increased to $300^{\circ}C$, even though there showd no significant change in the chemical state at the polyimide interface. This result is attributed to the decrease in surface roughness of deposited copper oxide on the polyimide, when it is heated.

• 한국표면공학회지
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• 제51권6호
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• pp.387-392
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• 2018

Nanopatterning is one of the essential nanotechnologies to fabricate electronic and energy nanodevices. Therefore, many research group members made a lot of efforts to develop simple and useful nanopatterning methods to obtain highly ordered nanostructures with functionality. In this study, in order to achieve pattern formation of three-dimensional (3D) hierarchical nanostructures, we introduce a simple and useful patterning method (nano-transfer printing (n-TP) process) consisting of various linewidths for diverse materials. Pt and $WO_3$ hybrid line structures were successfully stacked on a flexible polyimide substrate as a multi-layered hybrid 3D pattern of Pt/WO3/Pt with line-widths of $1{\mu}m$, $1{\mu}m$ and 250 nm, respectively. This simple approach suggests how to fabricate multiscale hybrid nanostructures composed of multiple materials. In addition, functional hybrid nanostructures can be expected to be applicable to various next-generation electronic devices, such as nonvolatile memories and energy harvesters.

• Composites Research
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• 제15권2호
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• pp.18-23
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• 2002

군사적 목적뿐만 아니라 상업적 목적에서도 레이더나 기타 전자파를 방출하는 기기들로부터 생성되는 전자파의 흡수 또는 차폐는 매우 중요한 일이다. 본 연구에서는 다른 유전적 성질을 가지는 복합재층을 배열하여 전자기파의 반사를 최소화하는 연구를 수행하였다. Glass fabric/epoxy에 전도성을 가지는 카본블랙 분체를 혼합한 복합재와 Carbon fabric/epoxy 복합재 대만 유전성질을 측정하였고, 이를 이용하여 X-band(8.2 GHz-l2.4GHz)에 대한 전자기파 반사의 최소화 구조를 구성하였다. 두께2.6mm의 다층 구조로 최대 30dB 이상의 반사 손실과 최대 흡수 주파수로부터 2GHz 주파수 대역에 걸쳐 10dB이상의 반사손실을 일으킬 수 있었다.

• 한국분말재료학회지
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• 제28권6호
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• pp.455-461
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• 2021

In this study, multilayered SnO nanoparticles are prepared using oleylamine as a surfactant at 165℃. The physical and chemical properties of the multilayered SnO nanoparticles are determined by transmission electron microscopy (TEM), scanning electron microscopy (SEM), energy-dispersive spectroscopy (EDS), X-ray diffraction (XRD), and X-ray photoelectron spectroscopy (XPS). Interestingly, when the multilayered SnO nanoparticles are heated at 400℃ under argon for 2 h, they become more efficient anode materials, maintaining their morphology. Heat treatment of the multilayered SnO nanoparticles results in enhanced discharge capacities of up to 584 mAh/g in 70 cycles and cycle stability. These materials exhibit better coulombic efficiencies. Therefore, we believe that the heat treatment of multilayered SnO nanoparticles is a suitable approach to enable their application as anode materials for lithium-ion batteries.

• 한국복합재료학회:학술대회논문집
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• 한국복합재료학회 2002년도 춘계학술발표대회 논문집
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• pp.181-183
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• 2002

The accurate permeability for preform is critical to model and design the impregnation of fluid resin in the composite manufacturing process. In this study, the in-plane and transverse permeability for a woven fabric are predicted numerically through the coupled flow model which combines microscopic with macroscopic flow. The microscopic and macroscopic flow which are flows within the micro-unit and macro-unit cell, respectively, are calculated by using 3-D CVFEM(control volume finite element method). To avoid checker-board pressure field and improve the efficiency on numerical computation, A new interpolation function for velocity is proposed on the basis of analytic solutions. The permeability of plain woven fabric is measured through unidirectional flow experiment and compared with the permeability calculated numerically. Based on the good agreement of the results, the relationships between the permeability and the structures of preform such as the fiber volume fraction and stacking effect can be understood. The reverse and the simple stacking are taken in account. Unlike past literatures, this study is based on more realistic unit cell and the improved prediction of permeability can be achieved. It is observed that in-plane flow is more dominant than transverse flow in the real flow through preform and the stacking effect of multi-layered preform is negligible. Consequently, the proposed coupled flow model can be applied to modeling of real composite materials processing.

• 한국음향학회지
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• 제39권4호
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• pp.270-278
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• 2020

본 논문은 원통형 임피던스 튜브내에 설치된 다중 미세천공판(Micro-Perforated Plate, MPP)의 음향투과를 해석적으로 구하는 방법을 다루었다. 판의 진동을 무한 급수의 합으로 전개하였는데 반경방향으로는 Bessel 함수를 포함한다. 평면파 가정하에서 저주파수 대역의 근사식을 유도하였으며 전달함수법을 이용하여 다중 MPP에 대한 음향투과율 공식을 제시하였다. 단일과 이중 MPP의 음향투과손실(Sound Transmission Loss, STL)을 본 논문에서 제안한 공식을 이용하여 계산하였으며 유한요소법(Finite Element Method, FEM)을 사용한 결과와 잘 일치 하였다. 천공율이 증가할수록 STL은 감소하는데 이는 판의 진동보다는 천공율이 더 큰 영향을 주기 때문이다. STL은 판의 공진주파수에서 골(dip)을 보이며 이중 MPP의 STL은 질량-스프링-질량 진동에 해당하는 공진주파수에서 골을 보인다. 본 연구에서 제안한 STL 예측 모델은 임의의 개수의 다중 MPP에 적용이 가능하며 각각의 판은 미세천공을 포함하거나 포함하지 않는 두 가지 경우가 모두 가능하다.

• 한국초전도ㆍ저온공학회논문지
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• 제19권2호
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• pp.25-28
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• 2017

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses that could affect its electromechanical transport property. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with the delamination problem of multi-layered REBCO CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal and mechanical cycling. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in the multi-layered REBCO CC tapes becomes a critical issue. Various trials to increase the delamination strength by improving interface characteristics at interlayers have been performed. In this study, in order to investigate the influences of laser cleaning and Ag annealing treated at the substrate side surface, transverse tensile tests were conducted under different sample configurations using $4.5mm{\times}8mm$ upper anvil. The mechanical delamination strength of differently processed CC samples was examined at room temperature (RT). As a result, the Sample 1 with the additional laser cleaning and Ag annealing processes and the Sample 2 with additional Ag annealing process only showed higher mechanical delamination strength as compared to the Sample 3 without such additional treatments. Sample 3 showed quite different behavior when the loading direction is to the substrate side where the delamination strength much lower as compared to other cases.

• 한국전기전자재료학회논문지
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• 제26권2호
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• pp.98-103
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• 2013

The alumina substrates that Ni electrode was printed on and the multi-layered PTCR thermistors of which composition is $(Ba_{0.998}Ce_{0.002})TiO_3+0.001MnCO_3+0.05BN$ were fabricated by a thick film process, and the effect of re-oxidation temperature on their resistivities and resistance jumps were investigated, respectively. Ni electroded alumina substrate and the multi-layered PTC thermistor were sintered at $1150^{\circ}C$ for 2 h under $PO_2=10^{-6}$ Pa and then re-oxidized at $600{\sim}850^{\circ}C$ for 20 min. With increasing the re-oxidation temperature, the room temperature resistivity increased and the resistance jump ($LogR_{290}/R_{25}$) decreased, which seems to be related to the oxidation of Ni electrode. The small sized chip PTC thermistor such as 2012 and 3216 exhibits a nonlinear and rectifying behavior in I-V curve but the large sized chip PTC thermistor such as 4532 and 6532 shows a linear and ohmic behavior. Also, the small sized chip PTC thermistor such as 2012 and 3216 is more dependent on the re-oxidation temperature and easy to be oxidized in comparison with the large sized chip PTC thermistor such as 4532 and 6532. So, the re-oxidation conditions of chip PTC thermistor may be determined by considering the chip size.

• 비파괴검사학회지
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• 제32권4호
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• pp.401-409
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• 2012

초음파 시험은 접착계면에서 발생하는 미접착 결함을 검출할 수 있는 다른 비파괴 시험보다 미접착 검출 능력이 월등히 뛰어나다. 하지만, 스틸 연소관, 내열 고무, 라이너 및 추진제로 구성된 고체 추진기관은 각 재질의 음향 임피던스의 큰 차이와 반사파의 중첩 때문에 초음파 신호를 분석하기에는 많은 어려움 있다. 그러므로 고체 추진기관의 미접착 결함을 검출하기 위한 초음파 시험은 자동화된 C-Scan 시스템을 이용하여 스틸 연소관과 내열 고무 계면의 극히 제한된 영역에서 적용되어 왔다. 기존의 초음파 시험은 대부분의 초음파가 음향 임피던스가 낮은 고무 재질에서 흡수되므로 고체 추진기관의 라이너와 추진제 사이의 미접착 결함을 검출할 수 없었고, 이런 문제점을 해결하기 위하여 초음파 공진법을 사용하여 주파수 스펙트럼으로부터 공진 주파수를 분석하였다. 본 논문은 초음파 공진 특성을 이용하여 라이너와 추진제 사이의 미접착 결함을 검출할 수 있는 기법에 대해 자세히 기술하였다.