• 한국초전도학회:학술대회논문집
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• 2007.07a
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• pp.91-91
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• 2007

• Korean Journal of Materials Research
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• v.22 no.7
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• pp.335-341
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• 2012

Recently, the demand for the miniaturization of printed circuit boards has been increasing, as electronic devices have been sharply downsized. Conventional multi-layered PCBs are limited in terms their use with higher packaging densities. Therefore, a build-up process has been adopted as a new multi-layered PCB manufacturing process. In this process, via-holes are used to connect each conductive layer. After the connection of the interlayers created by electro copper plating, the via-holes are filled with a conductive paste. In this study, a desmear treatment, electroless plating and electroplating were carried out to investigate the optimum processing conditions for Cu via filling on a PCB. The desmear treatment involved swelling, etching, reduction, and an acid dip. A seed layer was formed on the via surface by electroless Cu plating. For Cu via filling, the electroplating of Cu from an acid sulfate bath containing typical additives such as PEG(polyethylene glycol), chloride ions, bis-(3-sodiumsulfopropyl disulfide) (SPS), and Janus Green B(JGB) was carried out. The desmear treatment clearly removes laser drilling residue and improves the surface roughness, which is necessary to ensure good adhesion of the Cu. A homogeneous and thick Cu seed layer was deposited on the samples after the desmear treatment. The 2,2'-Dipyridyl additive significantly improves the seed layer quality. SPS, PEG, and JGB additives are necessary to ensure defect-free bottom-up super filling.

• Proceedings of the Materials Research Society of Korea Conference
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• 1995.11a
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• pp.49-51
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• 1995

• Proceedings of the Materials Research Society of Korea Conference
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• 2001.11a
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• pp.76-76
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• 2001

• Proceedings of the Materials Research Society of Korea Conference
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• 1998.11a
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• pp.76-76
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• 1998

• Bulletin of the Korean Chemical Society
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• v.24 no.2
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• pp.183-188
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• 2003

The micro-patterning of multi-layered thin films containing CdS and $Ta_2O_5$ layers on ITO substrate with various structures was successfully obtained by combining three different techniques: chemical solution depositions, sol-gel, and microcontact printing (μCP) methods using octadecyltrichlorosilane (OTS) as the organic thin layer template. $Ta_2O_5$ layer was prepared by sol-gel casting and CdS one obtained by chemical solution deposition, respectively. Parallel and cross patterns of multi-layers with $Ta_2O_5$ and CdS films were fabricated additively by successive removal of OTS layer pre-formed. This study presents the designed architectures consisting of the two types of feature having horizontal dimensions of 170 ㎛ and 340 ㎛ with constant thickness ca. 150 nm of each deposited materials. The thin film lay-out of the cross-patterning is composed of four regions with chemically different layer compositions, which are confirmed by Auger electron microanalysis.

• Journal of the Korean Institute of Telematics and Electronics A
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• v.29A no.9
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• pp.46-55
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• 1992

This paper propose how to calculate the capacitance for VLSI interconnection lines in multi-dielectric layer. The proposed method is a expansive form of 3-dimensional direct intergral method developed in single-dielectric layer. We took into consideration the effect of multi-dielectric layer by using additional boundary condition instead of modified Green's function. It is used the potential equations in line surface and the electric field equations in dielectric interface as the boundary condition. RC delay time for interconnection line of multi-dielectric layer is obtained from the calculated capacitance value. At this time, we are used Al and WSiS12T as interconnection materials.

• Korean Journal of Materials Research
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• v.15 no.8
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• pp.543-547
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• 2005

Organic electroluminescence devices were made from 1,4-bis-(9-anthrylvinyl)benzene (AVB) and 1,4-bis-(9-aminoanthryl)benzene (AAB) anthracene derivatives. Device structure was ITO/AVB/PANI(EB)/Al (multi-layer device) and ITO/AAB:DCM/Al(single-layer device). In these devices, AVB, polyaniline(emeraldine base) (PANI(EB)) and AAB were used as the emitting material. 4-(dicyanomethylene)-2-methyl-6-p-(dimethylamino)styryl-4H -pyran(DCM) was used as red fluorescent dopant. We studied change of fluorescence wavelength with concentration of DCM doped in AAB. The ionization potential (IP) and optical band gap (Eg) were measured by cyclic voltammetry and UV-visible spectrum. We compared with difference of emitting wavelength between photoluminescence and electroluminescence spectrum. In case of the multi-layer device, PANI and AVB EL spectra have similar wave pattern to each PL spectrum and when PAM and AVB were used at the same time, and multi-layer device showed that a balanced recombination and radiation kom PANI and AVB. In case of the single-layer device, with the increase of DCM concentration, the blue emission decreases and red emission increases. This indicates that DCM was excited by the energy transfer from AAB to DCM or the direct recombination at the dopant sites due to carrier trapping, or both. The device with $1.0wt\%$ DCM concentration gave white light.

• Journal of the Korean Society of Safety
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• v.13 no.2
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• pp.88-95
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• 1998

Five parts of the automotive interior materials were sampled to determine their combustion characteristics. Oxygen Indexer, Smoke chamber, Differential Scanning Calorimeter(DSC) were used as the analysis apparatus. All LOI values of samples appear less than 21. The combustion phenomena of the interior materials primarily depends on properties of each layer material. The amount of generated smoke are reached the maximum value within 30 - 90sec after ignition. The experimental results of combustion characteristics and DSC of H/Line also indicated that the layer of foam was melt first and it caused the propagation of flame through the sample. The combustion characteristics of multi-layer materials primarily depends on thermal characteristics of single layer material.

• Journal of the Korean Home Economics Association
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• v.37 no.11
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• pp.157-165
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• 1999

This study was carried out to examine the effect of clothing materials and multi-layered textiles on thermal resistance value. Cotton, polyester, wool, silk, rayon and acetate were selected for the specimens. Thermal resistance value was tested with 2 kinds of methods(thermo labo II and BK type tester). The results were as follows; 1. The effects of clothing materials for thermal resistance value were decreased by adding layers. 2. When the fabrics are measured with multiple layers, the fabric of the lowest thermal resistance value at single layer was showed the highest increasing tendency for all test methods.