• Title/Summary/Keyword: Multi-layer materials

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Interaction analysis of Continuous Slab Track (CST) on long-span continuous high-speed rail bridges

  • Dai, Gonglian;Ge, Hao;Liu, Wenshuo;Chen, Y. Frank
    • Structural Engineering and Mechanics
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    • v.63 no.6
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    • pp.713-723
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    • 2017
  • As a new type of ballastless track, longitudinal continuous slab track (CST) has been widely used in China. It can partly isolate the interaction between the ballastless track and the bridge and thus the rail expansion device would be unnecessary. Compared with the traditional track, CST is composed of multi layers of continuous structures and various connecting components. In order to investigate the performance of CST on a long-span bridge, the spatial finite element model considering each layer of the CST structure, connecting components, bridge, and subgrade is established and verified according to the theory of beam-rail interaction. The nonlinear resistance of materials between multilayer track structures is measured by experiments, while the temperature gradients of the bridge and CST are based on the long-term measured data. This study compares the force distribution rules of ballasted track and CST as respectively applied to a long span bridge. The effects of different damage conditions on CST structures are also discussed. The results show that the additional rail stress is small and the CST structure has a high safety factor under the measured temperature load. The rail expansion device can be cancelled when CST is adopted on the long span bridge. Beam end rotation caused by temperature gradient and vertical load will have a significant effect on the rail stress of CST. The additional flexure stress should be considered with the additional expansion stress simultaneously when the rail stress of CST requires to be checked. Both the maximum sliding friction coefficient of sliding layer and cracking condition of concrete plate should be considered to decide the arrangement of connecting components and the ultimate expansion span of the bridge when adopting CST.

Effects of Rubber Loading on the Ultrasonic Backward Radiation Profile of Leaky Lamb Wave (고무 접합이 후방복사된 리키 램파 프로파일에 미치는 영향)

  • Song, Sung-Jin;Kwon, Sung-Duk;Jung, Min-Ho;Kim, Young-H.
    • Journal of the Korean Society for Nondestructive Testing
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    • v.22 no.5
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    • pp.508-515
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    • 2002
  • The characterization of adhesive property in multi-layer materials has been hot issue for a long time. In order to evaluate adhesive properties, we constructed fully automated system for the backward radiation of leaky Lamb wave. The backward radiation profiles were obtained for the bare steel plate and plates with rubber-loading. The rf waveforms and frequency spectra of backward radiation show the characteristics of involved leaky Lamb wave modes. As the thickness of rubber-loading increased, the amplitude of profile at the incident angle of $13.4^{\circ}$ exponentially decreased. Scanning the incident position over the partially rubber-loaded specimen shows good agreement with the actual rubber-loading. The backward radiation of leaky Lamb wave has great potential to evaluate the adhesive condition as well as material properties of plates.

Numerical Study on Package Warpage as Structure Modeling Method of Materials for a PCB of Semiconductor Package (반도체 패키지용 PCB의 구조 모델링 방법에 따른 패키지의 warpage 수치적 연구)

  • Cho, Seunghyun;Ceon, Hyunchan
    • Journal of the Microelectronics and Packaging Society
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    • v.25 no.4
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    • pp.59-66
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    • 2018
  • In this paper, we analyzed the usefulness of single-structured printed circuit board (PCB) modeling by using numerical analysis to model the PCB structure applied to a package for semiconductor purposes and applying modeling assuming a single structure. PCBs with circuit layer of 3rd and 4th were used for analysis. In addition, measurements were made on actual products to obtain material characteristics of a single structure PCB. The analysis results showed that if the PCB was modeled in a single structure compared to a multi-layered structure, the warpage analysis results resulting from modeling the PCB structure would increase and there would be a significant difference. In addition, as the circuit layer of the PCB increased, the mechanical properties of the PCB, the elastic coefficient and inertia moment of the PCB increased, decreasing the package's warpage.

Multi-layer Structure Based QCA Half Adder Design Using XOR Gate (XOR 게이트를 이용한 다층구조의 QCA 반가산기 설계)

  • Nam, Ji-hyun;Jeon, Jun-Cheol
    • Asia-pacific Journal of Multimedia Services Convergent with Art, Humanities, and Sociology
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    • v.7 no.3
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    • pp.291-300
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    • 2017
  • Quantum-dot cellular automata(QCA) is a computing model designed to be similar to cellular automata, and an alternative technology for next generation using high performance and low power consumption. QCA is undergoing various studies with recent experimental results, and it is one of the paradigms of transistors that can solve device density and interconnection problems as nano-unit materials. An XOR gate is a gate that operates so that the result is true when either one of the logic is true. The proposed XOR gate consists of five layers. The first layer consists of OR gates, the third and fifth layers consist of AND gates, and the second and fourth layers are designed as passages in the middle. The half adder consists of an XOR gate and an AND gate. The proposed half adder is designed by adding two cells to the proposed XOR gate. The proposed half adder consists of fewer cells, total area, and clock than the conventional half adder.

Enhancement of delamination strength in Cu-stabilized coated conductor tapes through additional treatments under transverse tension at room temperature

  • Shin, Hyung-Seop;Bautista, Zhierwinjay;Moon, Seung-Hyun;Lee, Jae-Hun;Mean, Byoung-Jean
    • Progress in Superconductivity and Cryogenics
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    • v.19 no.2
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    • pp.25-28
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    • 2017
  • In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses that could affect its electromechanical transport property. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with the delamination problem of multi-layered REBCO CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal and mechanical cycling. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in the multi-layered REBCO CC tapes becomes a critical issue. Various trials to increase the delamination strength by improving interface characteristics at interlayers have been performed. In this study, in order to investigate the influences of laser cleaning and Ag annealing treated at the substrate side surface, transverse tensile tests were conducted under different sample configurations using $4.5mm{\times}8mm$ upper anvil. The mechanical delamination strength of differently processed CC samples was examined at room temperature (RT). As a result, the Sample 1 with the additional laser cleaning and Ag annealing processes and the Sample 2 with additional Ag annealing process only showed higher mechanical delamination strength as compared to the Sample 3 without such additional treatments. Sample 3 showed quite different behavior when the loading direction is to the substrate side where the delamination strength much lower as compared to other cases.

Transparent and Flexible All-Organic Multi-Functional Sensing Devices Based on Field-effect Transistor Structure

  • Trung, Tran Quang;Tien, Nguyen Thanh;Seol, Young-Gug;Lee, Nae-Eung
    • Proceedings of the Korean Vacuum Society Conference
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    • 2011.02a
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    • pp.491-491
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    • 2011
  • Transparent and flexible electronic devices that are light-weight, unbreakable, low power consumption, optically transparent, and mechanical flexible possibly have great potential in new applications of digital gadgets. Potential applications include transparent displays, heads-up display, sensor, and artificial skin. Recent reports on transparent and flexible field-effect transistors (tf-FETs) have focused on improving mechanical properties, optical transmittance, and performances. Most of tf-FET devices were fabricated with transparent oxide semiconductors which mechanical flexibility is limited. And, there have been no reports of transparent and flexible all-organic tf-FETs fabricated with organic semiconductor channel, gate dielectric, gate electrode, source/drain electrode, and encapsulation for sensor applications. We present the first demonstration of transparent, flexible all-organic sensor based on multifunctional organic FETs with organic semiconductor channel, gate dielectric, and electrodes having a capability of sensing infrared (IR) radiation and mechanical strain. The key component of our device design is to integrate the poly(vinylidene fluoride-triflouroethylene) (P(VDF-TrFE) co-polymer directly into transparent and flexible OFETs as a multi-functional dielectric layer, which has both piezoelectric and pyroelectric properties. The P(VDF-TrFE) co-polumer gate dielectric has a high sensitivity to the wavelength regime over 800 nm. In particular, wavelength variations of P(VDF-TrFE) molecules coincide with wavelength range of IR radiation from human body (7000 nm ~14000 nm) so that the devices are highly sensitive with IR radiation of human body. Devices were examined by measuring IR light response at different powers. After that, we continued to measure IR response under various bending radius. AC (alternating current) gate biasing method was used to separate the response of direct pyroelectric gate dielectric and other electrical parameters such as mobility, capacitance, and contact resistance. Experiment results demonstrate that the tf-OTFT with high sensitivity to IR radiation can be applied for IR sensors.

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Facile Low-temperature Chemical Synthesis and Characterization of a Manganese Oxide/multi-walled Carbon Nanotube Composite for Supercapacitor Applications

  • Jang, Kihun;Lee, Sung-Won;Yu, Seongil;Salunkhe, Rahul R.;Chung, Ildoo;Choi, Sungmin;Ahn, Heejoon
    • Bulletin of the Korean Chemical Society
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    • v.35 no.10
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    • pp.2974-2978
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    • 2014
  • $Mn_3O_4$/multi-walled carbon nanotube (MWCNT) composites are prepared by chemically synthesizing $Mn_3O_4$ nanoparticles on a MWCNT film at room temperature. Structural and morphological characterization has been carried out using X-ray diffraction (XRD) and scanning and transmission electron microscopies (SEM and TEM). These reveal that polycrystalline $Mn_3O_4$ nanoparticles, with sizes of about 10-20 nm, aggregate to form larger nanoparticles (50-200 nm), and the $Mn_3O_4$ nanoparticles are attached inhomogeneously on MWCNTs. The electrochemical behavior of the composites is analyzed by cyclic voltammetry experiment. The $Mn_3O_4$/MWCNT composite exhibits a specific capacitance of $257Fg^{-1}$ at a scan rate of $5mVs^{-1}$, which is about 3.5 times higher than that of the pure $Mn_3O_4$. Cycle-life tests show that the specific capacitance of the $Mn_3O_4$/MWCNT composite is stable up to 1000 cycles with about 85% capacitance retention, which is better than the pure $Mn_3O_4$ electrode. The improved supercapacitive performance of the $Mn_3O_4$/MWCNT composite electrode can be attributed to the synergistic effects of the $Mn_3O_4$ nanoparticles and the MWCNTs, which arises not only from the combination of pseudocapacitance from $Mn_3O_4$ nanoparticles and electric double layer capacitance from the MWCNTs but also from the increased surface area, pore volume and conducting property of the MWCNT network.

Development of Microfluidic Radioimmunoassay Platform for High-throughput Analysis with Reduced Radioactive Waste

  • Jin-Hee Kim;So-Young Lee;Seung-Kon Lee
    • Journal of Radiopharmaceuticals and Molecular Probes
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    • v.8 no.2
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    • pp.95-101
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    • 2022
  • Microfluidic radioimmunoassay (RIA) platform called µ-RIA spends less reagent and shorter reaction time for the analysis compared to the conventional tube-based radioimmunoassay. This study reported the design of µ-RIA chips optimized for the gamma counter which could measure the small samples of radioactive materials automatically. Compared with the previous study, the µ-RIA chips developed in this study were designed to be compatible with conventional RIA test tubes. And, the automatic gamma counter could detect radioactivity from the 125I labeled anti-PSA attached to the chips. Effects of the multi-layer microchannels and two-phase flow in the µ-RIA chips were investigated in this study. The measured radioactivity from the 125I labeled anti-PSA was linearly proportional to the number of stacked chips, representing that the radioactivity in µ-RIA platform could be amplified by designing the chips with multi-layers. In addition, we designed µ-RIA chip to generate liquid-gas plug flow inside the microfluidic channel. The plug flow can promote binding of the biomolecules onto the microfluidic channel surface with recirculation in the liquid phase. The ratio of liquid slug and air slug length was 1 : 1 when the 125I labeled anti-PSA and the air were injected at 1 and 35 µL/min, respectively, exhibiting 1.6 times higher biomolecule attachment compared to the microfluidic chip without the air injection. This experimental result indicated that the biomolecular reaction was improved by generating liquid-gas slugs inside the microfluidic channel. In this study, we presented a novel µ-RIA chips that is compatible with the conventional gamma counter with automated sampler. Therefore, high-throughput radioimmunoassay can be carried out by the automatic measurement of radioactivity with reduced radiowaste generation. We expect the µ-RIA platform can successfully replace conventional tube-based radioimmunoassay in the future.

The effect of powder characteristics on the behavior of Co-firing of ferrite and varistor (Ferrite/varistor의 동시소성 거동에 대한 분체특성의 영향)

  • Han, Ik-Hyun;Lee, Yong-Hyun;Myoung, Seong-Jae;Chun, Myoung-Pyo;Cho, Jeong-Ho;Kim, Byung-Ik;Choi, Duck-Kyun
    • Journal of the Korean Crystal Growth and Crystal Technology
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    • v.17 no.2
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    • pp.63-68
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    • 2007
  • A number of process problems should be solved in the multi-layered ceramic devices such as EMI filter. In particular, it is essential to control the sintering shrinkage in co-firing of different materials for obtaining defect-free samples such as crack, camber, and delamination which usually occur near the surface and interface. We studied the effect of the powder properties of ferrite on the co-firing behavior of green ceramic layers composed of ferrite and varistor. Three kind of ferrite powder samples as a function of milling time (24, 48, and 72 hr) were prepared. Varistor and ferrite ceramic green sheet were made by means of doctor blade process using slurry (ceramic powder and binder solution). Here, slurry was prepared by mixing 55 wt% powder with 45wt% binder solution. Varistor and ferrite green sheets were laminated at $80 kg/cm^2$, and co-fired at $900^{\circ}C$ and $1000^{\circ}C$ for 3 hr. We obtained the camber-free and co-fired ferrite/varistor layer structure by controlling the milling time and sintering temperature.

Microstructural Characterization of Clad Interface in Welds of Ni-Cr-Mo High Strength Low Alloy Steel (Ni-Cr-Mo계 고강도 저합금강 용접클래드 계면의 미세조직 특성 평가)

  • Kim, Hong-Eun;Lee, Ki-Hyoung;Kim, Min-Chul;Lee, Ho-Jin;Kim, Keong-Ho;Lee, Chang-Hee
    • Korean Journal of Metals and Materials
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    • v.49 no.8
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    • pp.628-634
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    • 2011
  • SA508 Gr.4N Ni-Cr-Mo low alloy steel, in which Ni and Cr contents are higher than in commercial SA508 Gr.3 Mn-Mo-Ni low alloy steels, may be a candidate reactor pressure vessel (RPV) material with higher strength and toughness from its tempered martensitic microstructure. The inner surface of the RPV is weld-cladded with stainless steels to prevent corrosion. The goal of this study is to evaluate the microstructural properties of the clad interface between Ni-Cr-Mo low alloy steel and stainless weldment, and the effects of post weld heat treatment (PWHT) on the properties. The properties of the clad interface were compared with those of commercial Mn-Mo-Ni low alloy steel. Multi-layer welding of model alloys with ER308L and ER309L stainless steel by the SAW method was performed, and then PWHT was conducted at $610^{\circ}C$ for 30 h. The microstructural changes of the clad interface were analyzed using OM, SEM and TEM, and micro-Vickers hardness tests were performed. Before PWHT, the heat affected zone (HAZ) showed higher hardness than base and weld metals due to formation of martensite after welding in both steels. In addition, the hardness of the HAZ in Ni-Cr-Mo low alloy steel was higher than that in Mn-Mo-Ni low alloy steel due to a comparatively high martensite fraction. The hardness of the HAZ decreased after PWHT in both steels, but the dark region was formed near the fusion line in which the hardness was locally high. In the case of Mn-Mo-Ni low alloy steel, formation of fine Cr-carbides in the weld region near the fusion line by diffusion of C from the base metal resulted in locally high hardness in the dark region. However, the precipitates of the region in the Ni-Cr-Mo low alloy steel were similar to that in the base metal, and the hardness in the region was not greatly different from that in the base metal.