• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.218-221
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• 2007

The surface mounting technology of 0402 electric chip part is necessary to fabricate a high density and multi-functional module, but there is a limitation of the technology, like as a bridge and self-alignement. This work estimated SMT processing factors of 0402 chip. To obtain optimum SMT process, we evaluated effects of stencil thickness, shape of hole on printability and mountability. Printability shows best results under the thickness of $80{mu}m$ with circle hole shape and 90% square hole shape. In case of chip mounting process, chip mis-alignment and bridge was occurred rarely in same conditions. In more thin stencil thickness, $50{mu}m$, strength of 1005 chip parts was poor, because of amount of printed solder was insufficient.

• 전기학회논문지
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• 제58권1호
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• pp.107-112
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• 2009

This paper describes design and fabrication issues of the SiP(System in Package) one-chip for a portable digital broadcasting receiver. It includes RF tuner chip, demodulator chip and passive components for the receiver system. When we apply the SiP one-chip technology to the broadcasting receiver, the system board size can be reduced from $776mm^2$ to $144mm^2$. SiP one-chip has an advantage that the area reduces more 81% than separated chips. Also the sensitivity performance advances -1dBm about 36 channels in the RF weak electric field, the power consumption reduces about 2mW and the C/N keeps on the same level.

• 한국전자파학회논문지
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• 제25권5호
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• pp.504-514
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• 2014

본 논문에서는 X-대역 능동 위상 배열 레이더 시스템에 사용되는 MMIC 다기능 칩을 0.5 ${\mu}m$ p-HEMT 상용 공정을 이용하여 저전력 특성을 가지도록 개발하였다. 다기능 칩은 6-비트 디지털 위상 천이 기능, 6-비트 디지털 감쇠 기능, 송/수신 모드 선택 기능, 신호 증폭 기능 등의 다양한 기능을 제공한다. $16mm^2(4mm{\times}4mm)$ 칩 크기의 소형으로 제작된 MMIC 다기능 칩은 7~11 GHz에서 10 dB의 송/수신 이득 특성과 14 dBm의 P1dB 특성을 가지며, DC 소모 전력이 0.6 W로 매우 낮은 저전력 특성을 보였다. 그리고 6-비트, 64 상태에 대해 위상 천이 특성과 감쇠 특성의 측정 결과, 동작 주파수에서 $3^{\circ}$의 RMS(Root Mean Square) 위상 오차와 0.6 dB의 RMS 감쇠 오차를 보였다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2002년도 추계기술심포지움논문집
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• pp.67-67
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• 2002

패키지 기술의 개발은 저비용, 고성능, 높은 패키징 효율의 추세로 가고 있다. 이러한 추세에 따라 기판재료의 개발 및 구조의 변형이 요구된다. 패키지의 한 형태인 MCM(Multi-Chip Module)에 연성기판을 사용할 경우 fine pattern이 가능하고 부피가 작기 때문에 패키지의 효율이 좋고 또한 reel to reel process에 적용이 가능하기 때문에 대량생산의 이점을 가지고 있다. 연성기판은 좋은 전기적 특성을 가진 polyimide와 구리 층으로 구성된다. 그러나 polyimide와 구리 계층 사이에 약한 접착력과 구리로의 polyamic acid의 diffusion, 다층 기판의 제조의 어려움 등의 문제점을 남겨두고 있다. 본 연구는 일반적인 polyimide/copper가 구조가 가지고 있는 문제점을 해결하고 구리 패턴을 제작하기 위해 에칭을 쓰는 것을 배제함으로 fine pattern을 이루어 내었으며 전기도금으로 완전하게 채워진 pluged via을 사용함으로 각층간의 연결에 신뢰성을 부여하였다. 또한, 연성기판의 구조적인 문제점인 해결하여 다층 연성기판을 제조하려고 한다.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제49권8호
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• pp.433-437
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• 2000

We fabricated switch module of ATM(Asynchronous Transfer Mode) exchange system with MCM-C(MultiChip Module Co-fired) technology and measured its electrical characteristics. Green tape was used as substrate and Au/Ag paste was used to form the interconnect layers. The via holes were made by drill and filled with metal paste usign screen method. After manufacturing the substrate, chips and passive components were assembled on the substrate. In electrical test, the module showed the output signal of 46.9MHz synchronized with input signal. In the view of substrate size reduction, the area of MCM switch module was 35% of conventional hybrid switch module.

• Progress in Superconductivity
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• 제3권1호
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• pp.17-22
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• 2001

Practical implementation of the SFQ technology in most application requires more than single-chip-level circuit complexity. Multiple chips have to be integrated with a technology that is reliable at cryogenic temperatures and supports an inter-chip data transmission speed of tens of GHz. In this work, we have studied two basic issues in building large RSFQ circuits. The first is the reliable inter-chip SFQ pulse transfer technique using Multi-Chip-Module (MCM) technology. By noting that the energy contained in an SFQ pulse is less than an attojoule, it is not very surprising that the direct transmission of a single SFQ pulse through MCM solder bump connectors can be difficult and an innovative technique is needed. The second is the recycling of the bias currents. Since RSFQ circuits are dc current biased the large RSFQ circuits need serial biasing to reduce the total amount of current input to the circuit.

• ETRI Journal
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• 제20권3호
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• pp.284-300
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• 1998

A new thermosyphon cooling module (TSCM) has designed, fabricated and tested to cool the multi-chip module consists of a cold plate and an integrated condenser. With an allowable temperature rise of $56^{\circ}C$ on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 $W/cm^2$ using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance.

• 대한전자공학회논문지
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• 제27권6호
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• pp.963-971
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• 1990

This paper proposes a memory intensive VLSI architecture for the realization of real-time 3x3 neighborhood processor based on the distributed arithmetic. The proposed architecture is characterized by a bit serial and multi-kernel parallel processing which exploits the pixel kernel parallelism and concurrency. The chip implements 8 neighborhood processing elements in parallel with efficirnt input and output modules which operate concurrently. Besides the a4chitectural design of a neighborhood processor, the design methodology using module generator concept has been considered and MOGOT(MOdule Generator Oriented VLSI design Tool) has been constructed based on the workstation. Based on these design environments MOGOT, it has been shown that the main part of the suggested architecture can be designed efficiently using 2\ulcorner double metal CMOS technology. It includes design of input delay and data conversion module, look-up table for inner product operation, carry save accumulator, output data converter and delay module, and control module.

• 한국전자파학회지:전자파기술
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• 제12권3호
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• pp.49-59
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• 2001

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for lowcost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology so far, much of them have been developed in ETRI, and from them forecasts technology trends in the near future.

• 전자공학회지
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• 제29권9호
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• pp.1020-1020
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• 2002

Wireless communication systems will be one of the biggest drivers of semiconductor products over the next decade. Global Positioning System (GPS) and Blue-tooth, HomeRF, and Wireless-LNA system are just a few of RF-module candidate awaiting integration into next generation mobile phone. Motivated by the growing needs for low-cost and multi-band/multi-function single chip wireless transceivers, CMOS technology has been recognized as a most promising candidate for the implementation of the future wireless communication systems. This paper presents recent developments in RF CMOS technology, which is classified into device technology and circuit technology and from them forecasts technology trends in the near future.