참고문헌
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- Analysis of the Heat Transfer Performance of Offset Strip Fin Geometries in a Cold Plate Operating in a Two-Phase Thermosyphon, Cooling Technology for Electronic Equipment Carcy, V.P.;Mandrusiak, G.D.;Roddy, T.
- Proceedings of 10th International Heat Pipe Conference Small Scale Two-Phase Loop Thermosyphons for Cooling Telecommunication Pioro, I.
- Proceeding of 10th International Heat Pipe Conference Thermal Control of Electronic Components by Heat Pipes and Thermosyphons Polasek, F.;Zelko, M.
- 40th ECTC Multichip 1.8 Gb/s High Speed Space-Division Switching Module Using Copper Polymide Multilayer Substrate Yamanaka, N.;Kituchi, S.;Kon, T.;Ohsaki, T.
- Proceeding of Second KSME-JSME Fluids Engineering Conference v.2 An Experiment on Thermosyphon Boiling in Uniformly Heated Vertical Tube and Channel Na, J.;Jeon, J.;Kwak, H.
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- Fundamentals of Heat and Mass Transfer Incropera, F.P.;Dewitt, D.P.
- Proceedings of the KSME 1997 Fall Annual Meeting. B Cold Plate Design in Thermosyphon Device for MCM Cooling Kwon, Y.;Na, M.;Nam, S.;Kwak, H.
- Int. J. Heat & Fluid Flow v.4 Analysis of Forced-Convection Boiling Flow Instabilities in a Single-Channel Upflow System Dogau, T.;Kakac, S.;Veziroglu, T.N.