• 한국전기전자재료학회논문지
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• 제25권1호
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• pp.44-47
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• 2012

The $TiO_2/Si_3N_4/Ag/Si_3N_4/TiO_2$ multi layered structure was designed for the possible application of transparent electrodes in PDP (Plasma Display Panel). Multi layered film was deposited on a glass substrate at room temperature by DC/RF magnetron sputtering system and EMP (Essential Macleod Program) was adopted to optimize the optical characteristics of film. During the deposition process, the Ag layer in $TiO_2/Ag/TiO_2$ became heavily oxidized and the filter characteristic was degraded easily. In thus study, Si3N4 layer was used as a diffusion buffer layer between $TiO_2$ and Ag. in order to prevent the oxidation of Ag layer in $TiO_2/Si_3N_4/Ag/Si_3N_4/TiO_2$ structure. It was confirmed that $Si_3N_4$ layer is one of candidate materials acting as diffusin barrier between $TiO_2/Ag/TiO_2$.

• JSTS:Journal of Semiconductor Technology and Science
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• 제11권3호
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• pp.169-181
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• 2011

In this present paper, a comprehensive drain current model incorporating the effects of channel length modulation has been presented for multi-layered gate material engineered trapezoidal recessed channel (MLGME-TRC) MOSFET and the expression for linearity performance metrics, i.e. higher order transconductance coefficients: $g_{m1}$, $g_{m2}$, $g_{m3}$, and figure-of-merit (FOM) metrics; $V_{IP2}$, $V_{IP3}$, IIP3 and 1-dB compression point, has been obtained. It is shown that, the incorporation of multi-layered architecture on gate material engineered trapezoidal recessed channel (GME-TRC) MOSFET leads to improved linearity performance in comparison to its conventional counterparts trapezoidal recessed channel (TRC) and rectangular recessed channel (RRC) MOSFETs, proving its efficiency for low-noise applications and future ULSI production. The impact of various structural parameters such as variation of work function, substrate doping and source/drain junction depth ($X_j$) or negative junction depth (NJD) have been examined for GME-TRC MOSFET and compared its effectiveness with MLGME-TRC MOSFET. The results obtained from proposed model are verified with simulated and experimental results. A good agreement between the results is obtained, thus validating the model.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2006년도 추계학술대회 논문집 Vol.19
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• pp.180-181
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• 2006

As a rule, high temperature superconducting coated conductors have multi-layered buffers consisting of seed, diffusion barrier and cap layers. Multi-buffer layer deposition requires longer fabrication time. This is one of main reasons which increases fabrication cost Thus, single buffer layer deposition seems to be important for practical coated conductor process. In this study, a single layered buffer deposition of $CeO_2$ for low cost coated conductors has been tried using thermal evaporation technique 100nm-thick $CeO_2$ layers deposited by thermal evaporation were found to act as a diffusion layer. $0.4{\mu}m$-thick SmBCO superconducting layers were deposited by thermal co-evaporation on the $CeO_2$ buffered Ni-W substrate. Critical current of 118A/$cm^2$ was obtained for the SmBCO coated conductors.

• 한국재료학회지
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• 제29권12호
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• pp.804-811
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• 2019

As the importance of three-dimensiona (3D) nano patterns and structures has recently emerged, interest in the study of 3D structures of block copolymers has increased. However, most existing studies on block copolymer 3D patterns on substrates are limited to simple 3D structures such as a multi-layered forms. In this study, we propose an experimental method for realizing free-standing 3D block copolymer patterns on substrates using an e-beam lithographic template and film transfer method. The block copolymer 3D structure formed in wide hole templates are similar to simple multi-layered structures; however, as the width of the hole template become narrower, more complex block copolymer 3D structures are formed in which the upper and lower layer structures are interconnected. Furthermore, we introduce a method to fabricate novel block copolymer structures in which the 2D planar structures are connected to 3D complex structures. Proposed 3D block copolymer fabrication method provides a framework for generation of unconventional 3D structures of block copolymer, which can be useful for next generation 3D devices.

• 한국전기전자재료학회논문지
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• 제19권8호
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• pp.764-768
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• 2006

For the possible application of pearl pigment, multi-layered $TiO_2/Al,\;Cr/TiO_2$ thin film were deposited on $SiO_2$ substrate by using sputtering method, $TiO_2$ and Al or Cr was selected as a possible high and low refraction material at the film interface respectively. Optical properties including color effect were systematically studied in terms of different film thickness and film layers by using spectrometer. In order to expect the experimental results, the simulation program, the Essential Macleod Program(EMP) was adopted and compared with the experimental data. The film consisting of $TiO_2/Al,\;Cr/TiO_2$ layers shows a wavelength range of $430{\sim}760nm$, typically color ranges between bluish purple and red. It was confirmed that this experimental result was quite well consistent with the experimental one.

• 한국전기전자재료학회논문지
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• 제20권6호
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• pp.546-549
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• 2007

As a rule, high temperature superconducting coated conductors have multi-layered buffers consisting of seed, diffusion barrier and cap layers. Multi-buffer layer deposition requires longer fabrication time. This is one of main reasons which increases fabrication cost. Thus, single buffer layer deposition seems to be important for practical coated conductor process. In this study, a single layered buffer deposition of $CeO_2$ for low cost coated conductors has been tried using thermal evaporation technique. 100 nm-thick $CeO_2$ layers deposited by thermal evaporation were found to act as a diffusion layer. $1\;{\mu}m-thick$ SmBCO superconducting layers were deposited by thermal co-evaporation on the $CeO_2$ buffered Ni-5%W substrate. Critical current of 90 A/cm was obtained for the SmBCO coated conductors.

• 한국초전도ㆍ저온공학회논문지
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• 제19권2호
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• pp.25-28
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• 2017

In superconducting coil applications particularly in wet wound coils, coated conductor (CC) tapes are subjected to different type of stresses that could affect its electromechanical transport property. These include hoop stress acting along the length of the CC tape and the Lorentz force acting perpendicular to the CC tape's surface. Since the latter is commonly associated with the delamination problem of multi-layered REBCO CC tapes, more understanding and attention on the delamination phenomena induced in the case of coil applications are needed. Difference on the coefficient of thermal expansion (CTE) of each constituent layer of the CC tape, the bobbin, and the impregnating materials is the main causes of delamination in CC tapes when subjected to thermal and mechanical cycling. In the design of degradation-free superconducting coils, therefore, characterization of the delamination behaviors including mechanism and strength in the multi-layered REBCO CC tapes becomes a critical issue. Various trials to increase the delamination strength by improving interface characteristics at interlayers have been performed. In this study, in order to investigate the influences of laser cleaning and Ag annealing treated at the substrate side surface, transverse tensile tests were conducted under different sample configurations using $4.5mm{\times}8mm$ upper anvil. The mechanical delamination strength of differently processed CC samples was examined at room temperature (RT). As a result, the Sample 1 with the additional laser cleaning and Ag annealing processes and the Sample 2 with additional Ag annealing process only showed higher mechanical delamination strength as compared to the Sample 3 without such additional treatments. Sample 3 showed quite different behavior when the loading direction is to the substrate side where the delamination strength much lower as compared to other cases.

• 한국전자파학회논문지
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• 제12권6호
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• pp.1002-1008
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• 2001

본 논문은 전파흡수기능을 갖는 경량, 고강도 고분자 복합재료의 재료 설계 및 전각흡수특성에 관한 연구이다. 전송선로 이론을 도입하여 다층구조 전파흡수체의 반사감쇠량 계산에 필요한 이론식을 제시하고, 각 층의 재료정수 및 두께의 함수로 계산한 전파흡수능 결과에 근거하여 각 층의 재질에 적합한 복합재료를 제시하였다. 본 연구에서 가장 중요한 결과는 페라이트 충진재를 사용하지 않은 3층 구조 (표면층/중간층/배면층)의 전파흡수구조재를 설계하였다는 점이다. 표면층 재료로는 저유전율 특성의 유리섬유 복합재료를 사용하고, 중간층 및 배면층에는 유전상수 및 도전손실이 큰 탄소섬유 복합재료를 사용하여 4~12 GHz 주파수 범위에서 10 dB 이상의 전파흡수특성을 얻을 수 있었다. 이에 반하여 흡수층/반사층으로 구성되는 2층 구조의 전파흡수구조재에서는 흡수층에 페라이트 충진재의 사용이 필수적이었다. 반사층 재질로 탄소섬유 복합재료를 사용하고, 횹수층 유리섬유 복합재료에 페라이트 충진재를 약 40 wt% 첨가함으로써 4~12 GHz 주파수 범위에서 10 dB 이상의 전파흡수특성을 얻을 수 있었다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 2007년도 제38회 하계학술대회
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• Journal of the Optical Society of Korea
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• 제18권2호
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• pp.174-179
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• 2014

Since in vitro neural recording and imaging applications based on a surface plasmon resonance (SPR) technique have expanded dramatically in recent years, cytotoxicity assessment to ensure the biosafety and biocompatibility for those applications is crucial. Here, we report the cytotoxicity of the SPR substrate incorporating a flint glass whose refractive index is larger than that of a conventional crown glass. A high refractive index glass substrate is essential in neural signal detection due to the advantages such as high sensitivity and wide dynamic range. From experimental data using primary hippocampal neurons, it is found that a lead-based flint glass is not appropriate as a neural recording template although the neuron cells are not directly attached to the toxic glass. We also demonstrate that the adhesion layer between the glass substrate and the gold film plays an important role in achieving the substrate stability and the cell viability.