• Transactions of the Korean Society of Automotive Engineers
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• v.15 no.3
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• pp.41-46
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• 2007

Lightweight multi-layered boards with high stiffness for the automotive interior trims were developed, which were composed of a single material. The boards were constructed in the form of substrate/core/substrate with newly developed materials. The materials which have high tensile strength and elongation were selected for the substrate materials, and those which have high compressive strength and low density were selected for the core materials. 25 types of multi-layered boards were fabricated using the selected substrate and core materials. The compatibility with the skin materials, the formability and the tensile strength and flexural strength of the specimens were evaluated. The results show that three types of multi-layered boards(Kenboard/EPP foam/Kenboard, Twintex/PP honeycomb/Twintex, Curv sheet/EPP foam/Curv sheet) are appropriate for the automotive interior trims. Considering the ease of materials supply and the economical aspect, Kenboard/EPP foam/Kenboard is thought to be the most realistic alternative.

• Journal of information and communication convergence engineering
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• v.4 no.2
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• pp.88-91
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• 2006

In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the S11-parameter of the inductor.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2006.05a
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• pp.255-258
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• 2006

In this paper, a novel physical structure for planar spiral inductors is proposed. The spiral inductors were designed and fabricated on multi-layered substrate Bragg-reflector/silicon (BR/Si) wafer. The impacts of multi-layered structure substrate and pattern on characteristics of inductor were studied. Experimental results show that the inductor embedded on Bragg reflector/silicon substrate can achieve the best improvement. At 0.4-1.6 GHz, the Bragg reflector seems to significantly increase the $S_{11}-parameter$ of the inductor.

• Journal of electromagnetic engineering and science
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• v.11 no.3
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• pp.201-206
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• 2011

This paper presents a miniaturized epsilon negative (ENG) zeroth-order resonance (ZOR) patch antenna with an improved bandwidth. The miniaturization and the broad bandwidth of the ENG ZOR patch antenna are achieved by using a meandered via and a high permeability substrate instead of a straight via and a dielectric substrate. The use of a meandered via allows miniaturization of the ENG ZOR patch antenna without narrowing the bandwidth. The use of a high permeability substrate allows further miniaturization of the ENG ZOR patch antenna and improvement of the bandwidth. A high permeability substrate consisting of a multi-layered substrate is designed to have a small material loss. The antenna (kr=0.32) has a 10 dB fractional bandwidth of ~1 %, which is 1.74 times as broad as that of an antenna with a dielectric substrate.

• Journal of the Korean Ceramic Society
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• v.31 no.10
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• pp.1115-1122
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• 1994

ZT/PZT/ZT multi-layered thin films were deposited on silicon substrate by co-sputtering method for FEMFET device application. Effects of Pb/(Zr+Ti) ratio, films thickness, annealing conditions and substrate temperature on the ferroelectric behavior of the multi-layered films were studied. The best memory device characteristics with leakage current of 2$\times$10-8 A/$\textrm{cm}^2$ and breakdown field of about 1 MV/cm could be obtained with ZT(250 $\AA$) / PZT(1000 $\AA$)/ZT(750 $\AA$) multi-layered thin film deposited at 35$0^{\circ}C$ and post-annealed at $700^{\circ}C$ for 120 sec by RTA(Rapid Thermal Annealing).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.13 no.5
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• pp.426-430
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• 2000

We have studied the field emission characteristics of multi-layered diamond-like-carbon (DLC) films deposited by vertical electrodes type plasma enhanced chemical vapor deposition with CH$_4$ and H$_2$ mixture. We deposited a thin layer of DLC on the p$^{+}$-Si substrate and then turned off plasma before another deposition of a new DLC layer. The thickness and the number of DLC layers are varied. The emission characteristics of multi-layered DLC films were compared with conventional one. The multi-layered DLC film shows higher emission current than conventional one.e.

• Proceedings of the KIEE Conference
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• 1998.07e
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• pp.1821-1823
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• 1998

In this paper, arbitrarily-shaped microstrip patch antenna in multi-layered is analyzed using spatial domain MoM. The triangular patch function is adopted here as the expansion function for planar arbitrarily-shaped microstrip. For example, an edge-fed rectangular patch antenna on a single-layered substrate is analyzed. The results show the agreement between the calculation and measurement.

• Proceedings of the KIPE Conference
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• 2008.06a
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• pp.643-645
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• 2008

Stainless steel 304 and 316 plates were deposited with the multi-layered coatings of titanium film (0.1um) and gold film (1-2um) by an electron beam evaporation method. The XRD patterns of the stainless steel plates modified with the multi-layered coatings showed the crystalline phases of the external gold film and the stainless steel substrate. Surface microstructural morphologies of the stainless steel bipolar plates modified with multi-layered coatings were observed by AFM and FE-SEM images. The external gold films formed on the stainless steel plates showed microstructure of grains of about 100nm diameter. The grain size of the external surface of the stainless steel plates increased with the gold film thickness. The electrical resistance and water contact angle of the stainless steel bipolar plates covered with multi-layered coatings were examined with the thickness of the external gold film.

• Journal of the Institute of Electronics and Information Engineers
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• v.50 no.3
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• pp.16-22
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• 2013

A general characterization procedure based on the extraction of a 2n-port admittance matrix corresponding to n uniform coupled lines on the multi-layered substrate using the Finite-Difference Time-Domain (FDTD) technique is presented. In this paper, the frequency-dependent normal mode parameters are obtained from the 2n-port admittance matrix to analyze multi-layered asymmetric coupled line structure, which in turn provides the frequency-dependent propagation constant, effective dielectric constant, and line-mode characteristic impedances. To illustrate the technique, several practical coupled line structures on multi-layered substrate have been simulated. Especially, embedded conductor structures have been simulated. Comparisons with Spectral Domain Method are given, and their results agree well. It is shown that the FDTD based time domain characterization procedure is an excellent broadband simulation tool for the design of multiconductor coupled lines on multilayered PCBs as well as thick or thin hybrid structures.

• Journal of the Korea Institute of Military Science and Technology
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• v.3 no.1
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• pp.155-163
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• 2000

A general characterization procedure based on the extraction of a 2n-port admittance matrix corresponding to n uniform coupled lines on the multi-layered substrate using the Finite-Difference Time-Domain (FDTD) technique is presented. The frequency-dependent normal mode parameters are obtained from the 2n-port admittance matrix, which in turn provides the frequency-dependent distributed inductance and capacitance matrices. To illustrate the technique, several practical coupled line structures on multi-layered substrate, including a three-line structure, have been simulated. It is shown that the FDTD based time domain characterization procedure is an excellent broadband simulation tool for the design of multiconductor coupled lines on multilayered PCBs as well as thick or thin hybrid structures.