• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
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• pp.322-323
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• 2008

Multi layered thin films with ZnS/$Na_3AlF_6$/ZnS were deposited on glass substrate by thermal evaporator precess and simulated by using EMP(Essential Macleod Program). EMP is a comprehensive software package to design and analyse the optical characteristics of multi-layered thin film. ZnS and $Na_3AlF_6$ were selected as a high refractive index and low refractive index material respectively. Additionally Cu was chosen as mid reflective material. Optical properties including color effect were systematically studied. in terms of different optical thickness of low refractive index material. The optical thickness of $Na_3AlF_6$ was changed as 0.25, 0.5, 0.75 and $1.0\lambda$. The film with 0.25, 0.5, 0.75 and $1.0\lambda$. of optical thickness showed mixed color range between bluish green and red purple, yellowish green and bluish green, purple and mixed color range of green and purple respectively.

• 마이크로전자및패키징학회지
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• 제24권4호
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• pp.39-46
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• 2017

본 연구는 평판형 히터용 금속방열판상의 세라믹 절연층 제조, 즉 절연성 금속기판에 관한 것이다. 반도체나 디스플레이의 열처리 공정 등에 사용되는 평판형 히터를 제조함에 있어서, 온도 균일도를 높이기 위해 금속 방열판으로서 열전도율이 높고, 비교적 가벼우며, 가공성 좋은 알루미늄 합금 기판이 선호된다. 이 알루미늄 기판에 발열 회로 패턴을 형성하기 위해서는 금속 기판에 절연층으로서 고온 안정성이 우수한 세라믹 유전체막을 코팅하여야 한다. 금속 기판상에 세라믹 절연층을 형성함에 있어서 가장 빈번히 발생하는 첫 번째 문제는 금속과 세라믹의 이종재료 간의 큰 열팽창계수 차이와 약한 결합력에 의한 층간박리 및 균열발생이다. 두 번째 문제는 절연층의 소재 및 구조적 결함에 따른 절연파괴이다. 본 연구에서는 이러한 문제점 해소를 위해 금속소재 기판과 세라믹 절연층 사이에 완충층을 도입하여 이들 간의 기계적 매칭과 접합력 개선을 도모하였고, 다중코팅 방법을 적용하여 절연막의 품질과 내전압 특성을 개선하고자 하였다.

• 대한전기학회:학술대회논문집
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• 대한전기학회 1999년도 추계학술대회 논문집 학회본부 C
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• pp.873-875
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• 1999

We have fabricated good quality superconducting $YBa_{2}Cu_{3}O_{7-\delta}$ thin films on Hastelloy(Ni-Cr-Mo alloys) metallic substrate with $CeO_2$ and $BaTiO_3$ buffer layers in-situ by pulsed laser deposition in a multi-target processing chamber. We have chosen $CeO_2$ as a buffer layer which has cubic structure of $5.41{\AA}$ lattice parameter and only 0.2% of lattice mismatch with YBCO. $CeO_2$ layer may be helpful for power transmission due to its conducting property. In order to enhance the crystallization of YBCO films on metallic substrates. we deposited $CeO_2$ and $BaTiO_3$ buffer layers at various temperatures. The YBCO superconducting tape fabricated with $BaTiO_3$ and $CeO_2$ buffer layers shows 85K of transition temperature and about $8.4{\times}10^4A/cm^2$ of critical current density at 77K.

• 한국초전도ㆍ저온공학회논문지
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• 제23권4호
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• pp.10-13
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• 2021

Recently, cable conductors composed of numerous coated conductors have been developed to transport huge current for large-scale applications, for example accelerators and fusion reactors. Various cable conductors such as CORC (Conductor on round core), Roebel Cable, and TSTC (Twisted stacked tape cable) have been designed and tested to apply for large-scale applications. But, these cable conductors cannot improve the engineering critical current density (J_e) because they are made by simple stacking of coated conductors. In this study, multi-HTS (High temperature superconductor) layers on one substrate (MHOS) wire was fabricated to increase the engineering critical current density by using the exfoliation of superconducting layer from substrate and silver diffusion bonding method. By the repetition of these processes, the 10 m long 6-layer MHOS conductor was successfully fabricated without any intermediate layers like buffer or solder. 6-layer MHOS conductor exhibited a high critical current of 2,460A/12mm-w. and high engineering critical current density of 1,367A/mm² at liquid nitrogen temperature.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2004년도 Asia Display / IMID 04
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• pp.91-94
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• 2004

We report on the opto-electronic properties of red, green, and blue poly (fluorene) co-polymer light-emitting devices (PLEDs) fabricated on a flexible plastic substrate. The plastic substrate used has a multi-layer structure with water vapor and oxygen transmission rates of less than $10^{-5}$ g/$cm^2$-day-atm and $10^{-7}$ cc/$cm^2$-day-atm, respectively. We obtained a wide range of color gamut and a maximum emission efficiency of 0.7, 10, and 1.7 cd/A for red, green, and blue PLEDs, respectively. Finally, a simple equivalent circuit model is proposed to simulate PLED current density-voltage characteristics.

• 한국정보디스플레이학회:학술대회논문집
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• 한국정보디스플레이학회 2003년도 International Meeting on Information Display
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• pp.988-990
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• 2003

A plastic substrate for flexible display is developed. The developed PES film has good resistance to heat, low intrinsic birefringence, and mechanical stability. The gas barrier property in the substrate is improved through depositing organic and inorganic multi layer on plastic film by PVD and CVD process.

• Journal of Ceramic Processing Research
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• 제19권6호
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• pp.525-529
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• 2018

The antireflective (AR) coated poly methyl methacrylate (PMMA) substrate was deposited by atomic layer deposition (ALD) on a self-assembled monolayer (SAM) to improve hydrophobicity and mechano-chemical properties of organic thin films. The water contact angles (WCA) were tested to characterize the surface wettability of SAM octadecyltrichlorosilane (OTS) films. Results showed that a contact angle of $105.9^{\circ}$ was obtained for the SAM films with an annealing process, and the highest WCA of $120^{\circ}$ was achieved for the films prepared by the SAM and ALD multi-process. The surface morphology of the SAM films with different assembly times and varying number of ALD cycles was obtained by atomic force microscopy (AFM). The maximum light transmittance for the SAM films on the PMMA substrate reached 99.9% at a wavelength of 450 nm. It was found that the SAM surfaces were not affected at all by the ALD process.

• 한국신재생에너지학회:학술대회논문집
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• 한국신재생에너지학회 2010년도 춘계학술대회 초록집
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• pp.93.2-93.2
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• 2010

Recently, printing and coating technologies application fields have been expanded to the energy field such as solar cell. One of the main reasons, why many researchers have been interested in printing technology as a manufacturing method, is the reduction of manufacturing cost. In this paper, We fabricated CIGS solar cell thin film layer by doctor blade methods using synthesis of CIS precursor nanoparticles ink on molybdenum (Mo) coated soda-lime glass substrate. Synthesis CIS precursor nanoparticles ink fabrication was mixed Cu, In, Se powder and Ethylenediamine, using microwave and centrifuging. Using multi coating process as we could easily fabrication a fine flatness CIS thin-film layer ($0.7{\sim}1.35{\mu}m$), and reduce a manufacture cost and process steps. Also if we use printing and coating method and solution process in each layer of CIGS solar cell (electrode, buffer), it is possible to fabricate all printed thin-film solar cell.

• 정보저장시스템학회논문집
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• 제1권2호
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• pp.127-131
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• 2005

We report a nanometer scale mark formation using a $PtO_x$ thin film or a TbFeCo rare-earth transition metal film and the mechanism. The multi-layer samples($ZnS-SiO_2/PtOx/ZNS-SiO_2,\;ZnS-SiO_2/TbFeCo/ZnS-SiO_2$) were prepared with a magnetron sputtering method on a polycarbonate or a glass substrate. By laser irradiation of approximately a few nanoseconds, nanometer scale marks were fabricated. During the fabrication process, the thin films were thermally reacted or inter-diffused during the laser irradiation. 75 nm bubble marks in the PtOx multi-layer sample by an approximately 4-ns laser irradiation. Inside the bubble mark, Pt particles with a few nanometer sizes are distributed. The $50{\sim}100$ nm bubble marks in the TbFeCo multi-layer sample by a few nanosecond laser irradiations. We will report the detail structure of the samples, the bubble mark formation process and the mechanism.

• 전자공학회논문지
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• 제50권3호
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• pp.16-22
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• 2013

n 개의 균일한 결합선로를 해석하기 위하여 2n-port 어드미턴스 매트릭스의 추출에 기초한 일반적인 특성화 절차가 제시된다. 본 논문에서는 비대칭 다중 결합선로를 해석하기 위하여 시간영역의 유한차분법을 사용하여 정규화 모드 파라미터 접근법의 적용을 제안한다. 주파수 의존적인 정규화 모드 파라미터는 2n-port 어드미턴스 매트릭스로부터 얻어지고, 이로부터 주파수 의존적인 전파상수와 유효 유전율 및 결합선로의 특성임피던스를 계산할 수 있다. 이 기법을 설명하기 위해 몇몇의 실질적인 다중 유전체상의 결합선로 구조들이 모의 실험되었으며, 특히 전도체가 유전체 사이에 내재된 형태의 선로가 해석되었다. 시간영역 유한 차분법을 활용한 결과는 Spectral Domain Method의 모의실험 결과와 비교하였고, 잘 일치함을 보였다. 시간영역의 특성화 절차에 기인한 유한차분법은 얇거나 두꺼운 혼성 구조 뿐 아니라 다층 PCB상의 다중의 전도체 결합 선로 설계를 위한 훌륭한 광대역 모의실험 도구가 됨을 볼 수 있다.