• 제어로봇시스템학회:학술대회논문집
• /
• 2003.10a
• /
• pp.921-926
• /
• 2003

This paper describes a new type of the spatial filter detector (SFD) with variable and multi-valued weighting function. This SFD called variable spatial filter detector with multi-valued weighting function (VSFDwMWF) uses current-mode circuits for noise resistance and high-resolution weighting values. Total weighting values consist of 7bit, 6-signal bit and 1-sign bit. We fabricate VSFDwMWF chip using Rohm 0.35${\mu}$m CMOS process. VSFDwMWF chip includes two-dimensional 10${\times}$13 photodiode array and current-mode weighting control circuit. Simulation shows the weighting values are varied and multi-valued by external switching operation. The layout of VSFDwMWF chip is shown.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.25 no.5
• /
• pp.504-514
• /
• 2014

An MMIC multi-function chip with a low DC power consumption for an X-band active phased array radar system has been designed and fabricated using a 0.5 ${\mu}m$ GaAs p-HEMT commercial process. The multi-function chip provides several functions: 6-bit phase shifting, 6-bit attenuation, transmit/receive switching, and signal amplification. The fabricated multi-function chip with a compact size of $16mm^2(4mm{\times}4mm)$ exhibits a gain of 10 dB and a P1dB of 14 dBm from 7 GHz to 11 GHz with a DC low power consumption of only 0.6 W. The RMS(Root Mean Square) errors for the 64 states of the 6-bit phase shift and attenuation were measured to $3^{\circ}$ and 0.6 dB, respectively over the frequency.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
• /
• v.22 no.6
• /
• pp.613-624
• /
• 2011

An MMIC multi-function chip for an X-band active phased array radar system has been designed and fabricated using a 0.5 ${\mu}m$ GaAs p-HEMT commercial process. A digital serial-to-parallel converter is included in this chip in order to reduce the number of the control interface. The multi-function chip provides several functions: 6-bit phase shifting, 6-bit attenuation, transmit/receive switching, and signal amplification. The fabricated multi-function chip with a relative compact size of 24 $mm^2$(6 mm${\times}$4 mm) exhibits a transmit/receive gain of 24/15 dB and a P1dB of 21 dBm from 8.5 GHz to 10.5 GHz. The RMS errors for the 64 states of the 6-bit phase shift and attenuation were measured to $7^{\circ}$ and 0.3 dB, respectively over the frequency.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
• /
• v.25 no.12
• /
• pp.34-41
• /
• 2011

In order to understand the thermal performance of each LED chips in multi-chip LED package, a quantitative parametric analysis of the temperature evolution was investigated by thermal transient analysis. TSP (Temperature Sensitive Parameter) value was measured and the junction temperature was predicted. Thermal resistance between the p-n junction and the ambient was obtained from the structure function with the junction temperature evolution during the cooling period of LED. The results showed that, the thermal resistance of the each LED chips in 4 chip-LED package was higher than that of single chip- LED package.

• The Transactions of the Korean Institute of Electrical Engineers P
• /
• v.58 no.2
• /
• pp.142-147
• /
• 2009

Conventional HP(high pressure) sodium or Metal-halide lamps have a life span of around one year requiring at least annual replacement and maintenance. High Power LED lights require no regular maintenance further increasing savings on replacement bulbs, access equipment and labour costs. New installations benefit from a substantial reduction in the cost of expensive heavy duty cable required for sodium lighting. Especially, LED light can achieve variable color temperature, high functional performance in the field of street light. There are two main method to achieve variable color temperature function of the street light. one method is using RGB multi-chip LED, the other is using Orange-White LED method. In this paper, it was compare RGB Multi-chip LED with white-orange LED for there characteristics performance.

• Journal of information and communication convergence engineering
• /
• v.17 no.4
• /
• pp.279-284
• /
• 2019

This paper presents processing-node status-based message scattering and gathering algorithms for multi-processor systems on chip to reduce the communication time between processors. In the message-scattering part of the message-passing interface (MPI) scatter function, data transmissions are ordered according to the proposed linear algorithm, based on the processor status. The MPI hardware unit in the root processing node checks whether each processing node's status is 'free' or 'busy' when an MPI scatter message is received. Then, it first transfers the data to a 'free' processing node, thereby reducing the scattering completion time. In the message-gathering part of the MPI gather function, the data transmissions are ordered according to the proposed linear algorithm, and the gathering is performed. The root node receives data from the processing node that wants to transfer first, and reduces the completion time during the gathering. The experimental results show that the performance of the proposed algorithm increases at a greater rate as the number of processing nodes increases.

• Journal of Korea Multimedia Society
• /
• v.19 no.2
• /
• pp.352-359
• /
• 2016

This paper presents high efficiency 5A synchronous DC-DC buck converter. The proposed DC-DC buck converter works from 4.5V to 18V input voltage range, and provides up to 5A of continuous output current and output voltage adjustable down to 0.8V. This chip is packaged MCP(multi-chip package) with control chip, top side P-CH switch, and bottom side N-CH switch. This chip is designed in a 25V high voltage CMOS 0.35um technology. It has a maximum power efficiency of up to 94% and internal 3msec soft start and fixed 500KHz PWM(Pulse Width Modulation) operations. It also includes cycle by cycle current limit function, short and thermal shutdown protection circuit at 150℃. This chip size is 2190um*1130um includes scribe lane 10um.

• The Journal of Korean Institute of Communications and Information Sciences
• /
• v.22 no.7
• /
• pp.1590-1598
• /
• 1997

The paper first introduces the new concept of potential diversity and signal decomposability, which establish a foundaton to generalize the existing concepts of path and frequency diversities. Then it presents a new DS/CDMA system called chip-spreading OCDM system, which is an embodiment of the petential diversity concept that combines the path diversity of the DS/CDMA system and the frequency diversity of the OFDM/CDMA system. In the chip-spreading OCDM system the chip sequences in each symbol interval are first converted into aralled streams, which then simultaneously modulate different orthogonal Walsh basis functions. In the receiver, the received signal is matched to each extended basis-function which is the union of the transmitter basis-functions and their delayed replicas, and the matched-filtered chip samples are combined together after individual channel compensation. The conventional DS/CDMA system using the maximal ratio combining. In addition, it effectively resolves the high PAR and high sensitivity to frequency offset problems which are critical in multi-carrier systems.

• Journal of the Korean Institute of Telematics and Electronics B
• /
• v.31B no.10
• /
• pp.21-31
• /
• 1994

This paper describes the multichannel combined R2MFC/DTMF/CCT reciver which provides a signaling service functions for call processing control in digital switching system. Using the TMS320C25 DSP chip, we have implemented multi-function receriver shich processes 8 channels of R2MFC, DTMF, and CCT signals simultaneously. In order to increase the channel multiplicity of the combined receiver. R2MFC and CCT receiver were employed by discrete Fourier transform(DFT) method using Goertzel algorithm, and DTMFreceiver was employ by infinite impulse reponse(IIR) filtering method using 4KHz subsampling technique. The combined receiver has 4 function modes for each channel such as R2MFC, DTMF, CCT, and Idle modes. The function mode of each channel may be selected at any time by single-chip micro-controller(.mu.C). Hence, the number of channels assigned for each function mode can be adjusted dynamically according to the signaling traffic variations. From the experimental test results using the test-bed, it has been proved that the combined receiver statisfies all receiver satisfies all receiver specifications, and provides good channel multiplicity and performance, Therefore, it may give a great improvement than existing receiver in cost, reliability, availability, and serviceability.

• Proceedings of the IEEK Conference
• /
• 2004.06b
• /
• pp.399-402
• /
• 2004

This paper presents a system-on-chip prototype implementing a full integration for a portable digital audio system. The chip is composed of a audio processor block to implements audio decoding and voice compression or decompression software, a system control block including 8-bit MCU core and Memory Management Unit (MMU) a low power 16-bit ${\Sigma}{\Delta}$ CODEC, two DC-to-BC converter, and a flash memory controller. In order to support other audio algorithms except Mask ROM type's fixed codes, a novel 16-bit fixed-point DSP core with the program-download architecture is proposed. Funker, an efficient power management technique such as task-based clock management is implemented to reduce power consumption for portable application. The proposed chip has been fabricated with a 4 metal 0.25um CMOS technology and the chip area is about 7.1 mm ${\times}$ 7.1mm with 100mW power dissipation at 2.5V power supply.