• 제목/요약/키워드: Multi process

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유한요소법에 의한 Bi2223 고온 초전도 선재의 다심 인발에 대한 연구 (Study for multi-filament drawing of Bi2223 high-temperature superconductivity wire by FE method)

  • 박동인;김병민;오상수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 추계학술대회논문집
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    • pp.273-276
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    • 2003
  • High-temperature superconduction materials(Bi2223) possess electrical/electronic and magnetic properties. Because high-temperature superconduction materials is a ceramic powder, that can not be produced singlehandedly. So Ag sheathed Bi-2223 wire was produced by drawing process using powder-in-tube(PIT) method. This superconductor has many difficulties to produce. The main difficulty is that the mechanical properties of the ceramic powder are very different from those of the Ag sheath. Bi2223 high-temperature superconductivity have a single filament drawing process, and multi-filament drawing process. This study analysed multi-filament drawing process by FEM, a defects during multi-filament drawing was studied by FEM.

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세장비가 큰 다단계 초정밀 사각형 디프드로잉을 위한 블랭크 설계 (Blank Design in Multi-Stage Rectangular Deep Drawing of Extreme Aspect Ratio)

  • 박철성;구태완;강범수
    • 한국소성가공학회:학술대회논문집
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    • 한국소성가공학회 2003년도 춘계학술대회논문집
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    • pp.258-261
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    • 2003
  • In this study, finite element analysis for multi-stage deep drawing process of rectangular configuration with extreme aspect ratio is carried out especially for the blank design. The analysis of rectangular deep drawing process with extreme aspect ratio is likewise very difficult with respect to the design process parameters including the intermediate die profile. In order to solve the difficulties, numerical approach using finite element method is performed in the present analysis and design. A series of experiments for multi-stage rectangular deep drawing process are conducted and the deformed configuration is investigated by comparing with the results of the finite element analysis. Additionally, to minimize amount of removal material after trimming process, finite element simulation is applied for the blank modification. The analysis incorporates brick elements for a rigid-plastic finite element method with an explicit time integration scheme using LS-DYNA3D.

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다품종 소량생산 공정을 위한 규칙기반 공정관리 시스템 (Rule-based Process Control System for multi-product, small-sized production)

  • 임광혁
    • 한국산업정보학회논문지
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    • 제15권1호
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    • pp.47-57
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    • 2010
  • 다품종 소량생산 공정에서는 동일 특성을 가지는 제품의 제작 개수가 절대적으로 적기 때문에 전통적인 공정제어 기법인 통계적 공정관리(Statistical Process Control)를 적용하기에는 어려움이 많이 존재한다. 그러므로 통계적인 접근법과 아울러 다양한 제품 특성을 규정짓기 위한 다양한 조건의 조합으로 이루어지는 SPEC규칙, 그리고 엔지니어의 경험에 기반한 노하우가 응집되어 있는 KNOWHOW규칙을 유연하게 설정하여 공정을 제어할 수 있는 규칙기반 공정관리 기술의 접목이 필요하다. 본 연구는 다품종 소량생산 공정에 적용 가능한 규칙기반 공정관리(Rule-based Process Control) 시스템을 제안하고, 이 시스템을 실제 반도체 생산 공정에 적용하여 그 성과를 검증하였다.

Design of improved Mulit-FNN for Nonlinear Process modeling

  • Park, Hosung;Sungkwun Oh
    • 제어로봇시스템학회:학술대회논문집
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    • 제어로봇시스템학회 2002년도 ICCAS
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    • pp.102.2-102
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    • 2002
  • In this paper, the improved Multi-FNN (Fuzzy-Neural Networks) model is identified and optimized using HCM (Hard C-Means) clustering method and optimization algorithms. The proposed Multi-FNN is based on FNN and use simplified and linear inference as fuzzy inference method and error back propagation algorithm as learning rules. We use a HCM clustering and genetic algorithms (GAs) to identify both the structure and the parameters of a Multi-FNN model. Here, HCM clustering method, which is carried out for the process data preprocessing of system modeling, is utilized to determine the structure of Multi-FNN according to the divisions of input-output space using I/O process data. Also, the parame...

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다단계 반도체 제조공정에서 함수적 입력 데이터를 위한 모니터링 시스템 (A Monitoring System for Functional Input Data in Multi-phase Semiconductor Manufacturing Process)

  • 장동윤;배석주
    • 대한산업공학회지
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    • 제36권3호
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    • pp.154-163
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    • 2010
  • Process monitoring of output variables affecting final performance have been mainly executed in semiconductor manufacturing process. However, even earlier detection of causes of output variation cannot completely prevent yield loss because a number of wafers after detecting them must be re-processed or cast away. Semiconductor manufacturers have put more attention toward monitoring process inputs to prevent yield loss by early detecting change-point of the process. In the paper, we propose the method to efficiently monitor functional input variables in multi-phase semiconductor manufacturing process. Measured input variables in the multi-phase process tend to be of functional structured form. After data pre-processing for these functional input data, change-point analysis is practiced to the pre-processed data set. If process variation occurs, key variables affecting process variation are selected using contribution plot for monitoring efficiency. To evaluate the propriety of proposed monitoring method, we used real data set in semiconductor manufacturing process. The experiment shows that the proposed method has better performance than previous output monitoring method in terms of fault detection and process monitoring.

Generalized equivalent spectrum technique

  • Piccardo, G.;Solari, G.
    • Wind and Structures
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    • 제1권2호
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    • pp.161-174
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    • 1998
  • Wind forces on structures are usually schematized by the sum of their mean static part and a nil mean fluctuation generally treated as a stationary process randomly varying in space and time. The multi-variate and multi-dimensional nature of such a process requires a considerable quantity of numerical procedures to carry out the dynamic analysis of the structural response. With the aim of drastically reducing the above computational burden, this paper introduces a method by means of which the external fluctuating wind forces on slender structures and structural elements are schematized by an equivalent process identically coherent in space. This process is identified by a power spectral density function, called the Generalized Equivalent Spectrum, whose expression is given in closed form.

다단 신선공정을 이용한 초극세 로듐 와이어 제조 (Fabrication of Ultra-fine Rhodium Wire Using Multi-pass Wire Drawing Process)

  • 이상곤;이성윤;이인규;황선광
    • 소성∙가공
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    • 제28권5호
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    • pp.275-280
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    • 2019
  • The aim of this study is to fabricate an ultra-fine pure rhodium wire using multi-pass wire drawing process. To manufacture $30{\mu}m$ ultra-fine rhodium wire from the initial $50{\mu}m$ wire, a multi-pass wire drawing process was designed based on the uniform reduction ratio theory. The elastic-plastic finite element analysis was then conducted to validate the efficacy of the designed process. The drawing load, drawing stress, and the distribution of the effective strain were evaluated using the finite element analysis. Finally, the wire drawing experiment was performed to validate the designed wire drawing process. From the results of the experiment, the diameter of the final drawn wire was found to be $29.85{\mu}m$.

Redundant Multi-Valued Logic을 이용한 고속 및 저전력 CMOS Demultiplexer 설계 (Design of a High Speed and Low Power CMOS Demultiplexer Using Redundant Multi-Valued Logic)

  • 김태상;김정범
    • 대한전기학회:학술대회논문집
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    • 대한전기학회 2005년도 심포지엄 논문집 정보 및 제어부문
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    • pp.148-151
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    • 2005
  • This paper proposes a high speed interface using redundant multi-valued logic for high speed communication ICs. This circuit is composed of encoding circuit that serial binary data are received and converted into parallel redundant multi-valued data, and decoding circuit that convert redundant multi-valued data to parallel binary data. Because of the multi-valued data conversion, this circuit makes it possible to achieve higher operating speeds than that of a conventional binary logic. Using this logic, a 1:4 demultiplexer (DEMUX, serial-parallel converter) IC was designed using a 0.35${\mu}m$ standard CMOS Process. Proposed demultiplexer is achieved an operating speed of 3Gb/s with a supply voltage of 3.3V and with power consumption of 48mW. Designed circuit is limited by maximum operating frequency of process. Therefore, this circuit is to achieve CMOS communication ICs with an operating speed greater than 3Gb/s in submicron process of high of operating frequency.

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다층 박막 스퍼터링 장비의 제어시스템에 관한 연구 (A Study on Control System of Multi Layer Sputtering Equipment)

  • 이선종;유흥렬;손영득
    • 전기전자학회논문지
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    • 제22권2호
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    • pp.302-308
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    • 2018
  • 다층 박막 스퍼터링(Multi-Layer Sputtering)은 상이한 물질을 원하는 두께의 박막을 다층(Multi-Layer) 으로 형성함을 목적으로 한다. 다층 박막 증착 공정은 공정 시간이 비교적 많은 비중을 차지하는데, 그 주요 원인은 공정 시간에 비해 증착하고자하는 기판의 이동 시간과 챔버를 고진공 상태로 만드는 시간이 많이 소요되기 때문이다. 반도체나 디스플레이 산업은 하나의 챔버에서 단일 물질을 스퍼터링하고 기판이 다관절 로봇을 통해 다른 챔버로 이동하여 다른 물질을 스퍼터링하는 공정이 대부분인데, 이는 필연적으로 공정 설비 내에 여러 개의 챔버와 진공펌프, 다관절 로봇이 필요하다. 이러한 문제점을 해결하기 위해 본 논문에서는 단일 진공 챔버 내에서 서로 상이한 물질을 증착하는 다층박막 스퍼터링 장치에 대한 제어시스템을 제안하고 TFT 공정에서 적용한다. 제어시스템의 제작과 실험을 통해 유효성을 입증한다.

크로스 롤러 가이드 다단 형상인발 공정설계에 관한 연구 (Process Design of Multi-Stage Shape Drawing Process for Cross Roller Guide)

  • 이상곤;이재은;이태규;이선봉;김병민
    • 한국정밀공학회지
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    • 제26권11호
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    • pp.124-130
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    • 2009
  • In the multi-stage shape drawing process, the most important aspect for the economy is the correct design of the various drawing stage. For most of the products commonly available round or square materials can be used as initial material. However, special products should be pre-rolled. This study proposes a process design method of multi-stage shape drawing process for producing cross roller guide. Firstly, a standard classification of shape drawing process is suggested based on the requirement of pre-rolling process. And a design method is proposed to design the intermediate die shape. The process design method is applied to design the multi-stage shape drawing process for producing cross roller guide. Finally, the effectiveness of the proposed design method is verified by FE-analysis and shape drawing experiment.