• Title/Summary/Keyword: Multi plasma

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Study on SiN and SiCN film production using PE-ALD process with high-density multi-ICP source at low temperature

  • Song, Hohyun;Seo, Sanghun;Chang, Hongyoung
    • Current Applied Physics
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    • v.18 no.11
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    • pp.1436-1440
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    • 2018
  • SiN and SiCN film production using plasma-enhanced atomic layer deposition (PE-ALD) is investigated in this study. A developed high-power and high-density multiple inductively coupled plasma (multi-ICP) source is used for a low temperature PE-ALD process. High plasma density and good uniformity are obtained by high power $N_2$ plasma discharge. Silicon nitride films are deposited on a 300-mm wafer using the PE-ALD method at low temperature. To analyze the quality of the SiN and SiCN films, the wet etch rate, refractive index, and growth rate of the thin films are measured. Experiments are performed by changing the applied power and the process temperature ($300-500^{\circ}C$).

A Large Area Plasma Source Using Multi-cathode Electron Beam (다중 음극 전자빔을 이용한 대면적 플라즈마 소스)

  • Gang, Yang-Beom;Jeon, Hyeong-Tak;Kim, Tae-Yeong;Jeong, Gi-Hyeong;Go, Dong-Gyun;Jeong, Jae-Guk;No, Seung-Jeong
    • Korean Journal of Materials Research
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    • v.9 no.9
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    • pp.861-864
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    • 1999
  • A new plasma source using the multi-cathode electron beam has been designed and manufactured. A multi-cathode was adopted to produce bulk plasmas in a large volume. Multi-cathode electron beam plasma source(MCEBPS) was found to generate stable plasmas over the wafer diameter of 300 mm or above. W(tungsten) filament was used as a cathode. Over a 320 mm diameter, both the plasma potential $V_p$ and floating potential $V_f$ were uniformly maintained and the difference between $V_p and V_f$ was measured to be small. The plasma density was around $10^{10} cm^{-3}$ and its variation along the radial distance was small.

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A study on the effects of variously configured magnets on the characteristics of inductively coupled plasma (자장의 배열 및 형태가 유도결합형 플라즈마에 미치는 효과에 관한 연구)

  • 황순원;이영준;유지범;이재찬;염근영
    • Journal of the Korean institute of surface engineering
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    • v.32 no.4
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    • pp.513-520
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    • 1999
  • In this study, we investigated the effects of variously configured magnets on the characteristics of the plasmas to enhance plasma uniformity and density of an inductively coupled plasma source. As the magnets, Helmholtz type axial electromagnets and various multi-dipole magnets types around the chamber wall were used. To characterize the plasma as a function of the combination of the magnets and magnetic field strengths, ion density, electron temperature, and plasma potential were measured using an electrostatic probe along the chamber diameter for Ar plasmas. The measured maximum ion densities were $8$\times$10^{ 11}$$cm^{-3}$ with 600W inductive power and at 5mTorr of operational pressure and the uniformity of ion density was less than 5.9% at 2mTorr of operational pressure. The combination of an optimized multi-dipole magnet type and an axial electromagnet showed the lowest electron temperature (3eV) and plasma potential ($34V{p}$ )

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Development of Plasma Confinement by Applying Multi-Polar Magnetic Fields in an Internal Inductively Coupled Plasma System (선형 유도결합 플라즈마 시스템에서 자장에 의한 플라즈마의 Confinement 효과에 관한 연구)

  • Lim, Jong-Hyeuk;Kim, Kyong-Nam;Yeom, Geun-Young
    • Journal of the Korean institute of surface engineering
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    • v.39 no.3
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    • pp.142-146
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    • 2006
  • A novel internal-type linear inductive antenna, which we refer to as a double comb-type antenna, was developed for a large-area plasma source with substrate size of $880\;mm{\times}660\;mm$ ($4^{th}$ generation glass size). In this study, effect of plasma confinement by applying multi-polar magnetic field was investigated. High density plasmas of the order of $3.18{\times}10^{11}\;cm^{-3}$ could be obtained with a pressure of 15 mTorr Ar at an inductive power of 5000 W with good plasma stability. This plasma density is higher than that obtained for the conventional double comb-type antenna, possibly due to the plasma confinement, low rf voltage, resulting in high power transfer efficiency. Also, due to the remarkable reduction in the antenna rf voltage and length, a plasma uniformity of less than 3% could be obtained within a substrate area of $880\;mm{\times}660\;mm$ as rf power increased.

Inactivation of Microorganisms in Sewage Using a Pilot Plasma Reactor (Pilot 플라즈마 반응기를 이용한 하수 중 미생물의 불활성화)

  • Kim, Dong-Seog;Park, Young-Seek
    • Journal of Environmental Health Sciences
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    • v.39 no.3
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    • pp.289-299
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    • 2013
  • Objectives: For the field application of the dielectric barrier discharge plasma reactor, scale-up of the plasma reactor is needed. This study investigated the possibility of inactivation of microorganisms in sewage using pilot multi-plasma reactor. We also considered the possibility of degradation of total organic carbon (TOC) and nonbiodegradable matter ($UV_{254}$) in sewage. Methods: The pilot plasma reactor consists of plasma reactor with three plasma modules (discharge electrode and quartz dielectric tube), liquid-gas mixer, high voltage transformers, gas supply equipment and a liquid circulation system. In order to determine the operating conditions of the pilot plasma reactor, we performed experiments on the operation parameters such as gas and liquid flow rate and electric discharge voltage. Results: The experimental results showed that optimum operation conditions for the pilot plasma reactor in batch experiments were 1 L/min air flow rate), 4 L/min liquid circulation rate, and 13 kV electric discharge voltage, respectively. The main operation factor of the pilot plasma process was the high voltage. In continuous operation of the air plasma process, residual microorganisms, $UV_{254}$ absorbance and TOC removal rate at optimal condition of 13 kV were $10^{2.24}$ CFU/mL, 56.5% and 8.6%, respectively, while in oxygen plasma process at 10 kV, residual microorganisms, $UV_{254}$ absorbance and TOC removal rate at optimal conditions were $10^{1.0}$ CFU/mL, 73.3% and 24.4%, respectively. Electric power was increased exponentially with the increase in high voltage ($R^2$ = 0.9964). Electric power = $0.0492{\times}\exp^{(0.6027{\times}lectric\;discharge\;voltage)}$ Conclusions: Inactivation of microorganisms in sewage effluent using the pilot plasma process was done. The performance of oxygen plasma process was superior to air plasma process. The power consumption of oxygen plasma process was less than that of air plasma process. However, it was considered that the final evaluation of air and oxygen plasma must be evaluated by considering low power consumption, high process performance, operating costs and facility expenses of an oxygen generator.

A Study on the Preheating Effect of Multi-Heat Sources using Laser Plasma in the Thermally Assisted Machining of a High-Melting-Point Material (고융점 소재의 열 보조 가공에서 레이저 -플라즈마 다중열원의 예열 효과에 대한 연구)

  • Lee, Choon-Man;Kim, Seong-Gyu
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.18 no.10
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    • pp.93-98
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    • 2019
  • Recently, with the development of the aerospace and automotive industries, the demand for high-melting-point materials has increased. However, high-melting-point materials are difficult to cut through conventional machining methods. Thermally assisted machining (TAM) is a method for improving the machinability by preheating the materials. A laser, the most commonly used device for TAM, has high efficiency through local preheating but is not sufficient for maintaining a high preheating temperature due to rapid cooling. However, the use of multi-heat sources can supplement the disadvantage of a single heat source. The high preheating temperature can be maintained with a wide and deep heat-affected zone (HAZ) by multi-heat sources. The purpose of this study is to analyze the preheating effects of multi-heat sources using laser plasma. Thermal analysis and preheating experiments were carried out. As a result, the high preheating effect of multi-heat sources compared with a single heat source was verified.

Enhanced Anti-reflective Effect of SiNx/SiOx/InSnO Multi-layers using Plasma Enhanced Chemical Vapor Deposition System with Hybrid Plasma Source

  • Choi, Min-Jun;Kwon, O Dae;Choi, Sang Dae;Baek, Ju-Yeoul;An, Kyoung-Joon;Chung, Kwun-Bum
    • Applied Science and Convergence Technology
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    • v.25 no.4
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    • pp.73-76
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    • 2016
  • Multi-layer films of $SiN_x/SiO_x$/InSnO with anti-reflective effect were grown by new-concept plasma enhanced chemical vapor deposition system (PECVD) with hybrid plasma source (HPS). Anti-reflective effect of $SiN_x/SiO_x$/InSnO was investigated as a function of ratio of $SiN_x$ and $SiO_x$ thickness. Multi-layers deposited by PECVD with HPS represents the enhancement of anti-reflective effect with high transmittance, comparing to the layers by conventional radio frequency (RF) sputtering system. This change is strongly related to the optical and physical properties of each layer, such as refractive index, composition, film density, and surface roughness depending on the deposition system.

Position error compensation of the multi-purpose overload robot in nuclear power plants

  • Qin, Guodong;Ji, Aihong;Cheng, Yong;Zhao, Wenlong;Pan, Hongtao;Shi, Shanshuang;Song, Yuntao
    • Nuclear Engineering and Technology
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    • v.53 no.8
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    • pp.2708-2715
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    • 2021
  • The Multi-Purpose Overload Robot (CMOR) is a key subsystem of China Fusion Engineering Test Reactor (CFETR) remote handling system. Due to the long cantilever and large loads of the CMOR, it has a large rigid-flexible coupling deformation that results in a poor position accuracy of the end-effector. In this study, based on the Levenberg-Marquardt algorithm, the spatial grid, and the linearized variable load principle, a variable parameter compensation model was designed to identify the parameters of the CMOR's kinematics models under different loads and at different poses so as to improve the trajectory tracking accuracy. Finally, through Adams-MATLAB/Simulink, the trajectory tracking accuracy of the CMOR's rigid-flexible coupling model was analyzed, and the end position error exceeded 0.1 m. After the variable parameter compensation model, the average position error of the end-effector became less than 0.02 m, which provides a reference for CMOR error compensation.