• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.431-432
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• 2012

In the era of 20 nm scaled semiconductor volume manufacturing, Microelectronics Manufacturing Engineering Education is presented in this paper. The purpose of microelectronic engineering education is to educate engineers to work in the semiconductor industry; it is therefore should be considered even before than technology development. Three Microelectronics Manufacturing Engineering related courses are introduced, and how undergraduate students acquired hands-on experience on Microelectronics fabrication and manufacturing. Conventionally employed wire bonding was recognized as not only an additional parasitic source in high-frequency mobile applications due to the increased inductance caused from the wiring loop, but also a huddle for minimizing IC packaging footprint. To alleviate the concerns, chip bumping technologies such as flip chip bumping and pillar bumping have been suggested as promising chip assembly methods to provide high-density interconnects and lower signal propagation delay [1,2]. Aluminum as metal interconnecting material over the decades in integrated circuits (ICs) manufacturing has been rapidly replaced with copper in majority IC products. A single copper metal layer with various test patterns of lines and vias and $400{\mu}m$ by $400{\mu}m$ interconnected pads are formed. Mask M1 allows metal interconnection patterns on 4" wafers with AZ1512 positive tone photoresist, and Cu/TiN/Ti layers are wet etched in two steps. We employed WPR, a thick patternable negative photoresist, manufactured by JSR Corp., which is specifically developed as dielectric material for multi- chip packaging (MCP) and package-on-package (PoP). Spin-coating at 1,000 rpm, i-line UV exposure, and 1 hour curing at $110^{\circ}C$ allows about $25{\mu}m$ thick passivation layer before performing wafer level soldering. Conventional Si3N4 passivation between Cu and WPR layer using plasma CVD can be an optional. To practice the board level flip chip assembly, individual students draw their own fan-outs of 40 rectangle pads using Eagle CAD, a free PCB artwork EDA. Individuals then transfer the test circuitry on a blank CCFL board followed by Cu etching and solder mask processes. Negative dry film resist (DFR), Accimage$^{(R)}$, manufactured by Kolon Industries, Inc., was used for solder resist for ball grid array (BGA). We demonstrated how Microelectronics Manufacturing Engineering education has been performed by presenting brief intermediate by-product from undergraduate and graduate students. Microelectronics Manufacturing Engineering, once again, is to educating engineers to actively work in the area of semiconductor manufacturing. Through one semester senior level hands-on laboratory course, participating students will have clearer understanding on microelectronics manufacturing and realized the importance of manufacturing yield in practice.

• Transactions of the Korean hydrogen and new energy society
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• v.9 no.4
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• pp.169-176
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• 1998

An experimental study on effect of vapor-cooled heat stations in a 5.5 liter cryogenic vessel has been performed. The cryogenic vessel is made of stainless steel of thickness of 1mm and insulated by the combined insulation of vacuum, MLI(multi-layer insulation) and vapor-cooled radiation shield. Vapor-cooled heat stations are also constructed based on the 1-dimensional thermal analysis to reduce the heat inleak through a filling tube. Thermal analysis indicates that the vapor-cooled heat stations can substantially enhance the performance of vessel for cryogenic fluids with high $C_p/h_{fg}$ where $C_p$ the specific heat and $h_{fg}$ the heat of vaporization, such as $LH_2$ and LHe. The experimental results for $LN_2$ shows that the total heat inleak into inner vessel consists of 14% radiation and 86% conduction through the filling tube. Therefore, it is expected that the conduction heat in leak of the vessel for high $C_p/h_{fg}$ cryogenic fluids can be significantly reduced. powders. The amount of copper coating was 20wt%. In order to examine corrosion behavior of the electrodes, the corrosion current and the current density, in 6M KOH aqueous solution after removal of oxygen in the solution, were measured by potentiodynamic and cyclic voltamo methods. The results showed that Co in the alloy increased corrosion resistance of the electrode whereas Ni decreased the stability of the electrode during the charge-discharge cycles. The electrode used Si sealant as a binder showed a lower corrosion current density than the electrode used PTFE and the electrode used Cu-coated alloy powders showed the best corrosion resistance.

• Journal of the Society of Cosmetic Scientists of Korea
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• v.30 no.3 s.47
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• pp.369-375
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• 2004

In this study, liquid crystalline (LC) is formed using Gemini surfactant (GS) type and moisturizing effect in vivo is measured. $3.0\;wt\%$ of sodium dicocoyl ethylene diamine (PEG)-15 sulfate (SCD-PEG-15S) is used as GS and $4.0\;wt\%$ of hydrogenated dimer acid esters (HDAE) as booster. For stabilizers, $2.0\;wt\%$ of behenyl alcohol (BA) and $1.0\;wt\%$ of Iyso-lecithin (LyL) are utilized. It is stabilized in pH from 4.0 to 10.5 and the best condition is in pH 6.5. The value of viscosity is $8,000\pm500$ cP. The most excellent particles are formed within the range of 4.0 to 15.5 um. Formed LC is observed around LC particles using polarization microscope. It is also observed that lamellar gel network structure is formed around LC particles. Moisturizing effect is improved by $13.6\%$ (P<0.05) compared to control when measured 30 min later after coating samples. After 1 h, moisturizing effect is improved by 1$12.6\%$ (P<0.05) than control while showing $28.3\%$ (P<0.05) of improvement after 4 h. These results may be caused from that manufactured LC forms lamellar structure so that it has better water-holding ability and absorbance of oil increases. This formula could be utilized by delivery system (DS) on skin so that this technology can be applied for manufactuing pharmaceuticals and cosmetics.

• Journal of the East Asian Society of Dietary Life
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• v.20 no.5
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• pp.735-742
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• 2010

Biogenic amines are synthesized by microbial decarboxylation for the putrefaction or fermentation of foods containing protein. Although biogenic amines such as histamine, tyramine, and putrescine are required for many physiological functions in humans and animals, consumption of high amounts of biogenic amines can cause toxicological effects, including serious gastrointestinal, cutaneous, hemodynamic, and neurological symptoms. In this study, a novel amperometric biosensor wasdeveloped to detect biogenic amines. The biosensor consisted of a working electrode, a reference electrode, a counter electrode, an enzyme reactor with immobilized diamine oxidase, an injector, a peristaltic pump and a potentiostat. A working electrode was fabricated with a glassy carbon electrode (GCE) by coating functionalized multi-walled carbon nanotubes (MWCNT-$NH_2$) and by electrodepositing Prussian blue (PB) to enhance electrical conductivity. A sensor system with PB/MWCNT-$NH_2$/GCE showed linearity in the range of $0.5 {\mu}M{\sim}100 {\mu}M$ hydrogen peroxide with a detection limit of $0.5 {\mu}M$. The responses for tyramine, 2-phenylethylamine, and tryptamine were 95%, 75%, and 70% compared to that of histamine, respectively. These results imply that the biosensor system can be applied to the quantitative measurement of biogenic amines.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.4
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• pp.53-58
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• 2018

Since the scaling-down of IC devices has been reached to their physical limitations, several innovative packaging technologies such as 3D packaging, embedded packaging, and fan-out wafer level packaging (FOWLP) are actively studied. In this study the fabrication of organic-inorganic dielectric material was evaluated for the use of multi-structured redistribution layers (RDL) in FOWLP. Compared to current organic dielectrics such as PI or PBO an organic-inorganic hybrid dielectric called polysilsesquioxane (PSSQ) can improve mechanical, thermal, and electrical stabilities. polysilsesquioxane has also an excellent advantage of simultaneous curing and patterning through UV exposure. The polysilsesquioxane samples were fabricated by spin-coating on 6-inch Si wafer followed by pre-baking and UV exposure. With the 10 minutes of UV exposure polysilsesquioxane was fully cured and showed $2{\mu}m$ line-pattern formation. And the dielectric constant of cured polysilsesquioxane dielectrics was ranged from 2.0 to 2.4. It has been demonstrated that polysilsesquioxane dielectric can be patterned and cured by UV exposure alone without a high temperature curing process.

• Applied Chemistry for Engineering
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• v.33 no.1
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• pp.50-57
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• 2022

Ti-In-Zn-O (TIZO)/Ag/TIZO multilayer transparent electrodes were prepared on glass substrates at room temperature using RF/DC magnetron sputtering. Obtained multilayer structure comprising TIZO/Ag/TIZO (10 nm/10 nm/40 nm) with the total thickness of 60 nm showed a transmittance of 86.5% at 650 nm and a sheet resistance of 8.1 Ω/□. The multilayer films were expected to be applicable for use in energy-saving smart window based on polymer-dispersed liquid crystal (PDLC) because of their transmittance properties to effectively block infrared rays (heat rays). We investigated the effects of the content ratio of prepolymer, the thickness of the PDLC coating layer, and the ultraviolet (UV) light intensity on electro-optical properties, and the surface morphology of polyester acrylate-based PDLC systems using new TIZO/Ag/TIZO transparent conducting electrodes. A PDLC cell with a thickness of 15 ㎛ PDLC layer photocured at an UV intensity of 1.5 mW/cm² exhibited good driving voltage, favorable on-state transmittance, and excellent off-haze. The LC droplets formed on the surface of the polymer matrix of the PDLC composite had a size range of 1 to 3 ㎛ capable of efficiently scattering incident light. Also, the PDLC-based smart window manufactured using TIZO/Ag/TIZO multi-layered transparent electrodes in this study exhibited a light brown, which will have an advantage in terms of aesthetics.

• Clean Technology
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• v.29 no.4
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• pp.237-243
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• 2023

Aerogel is the most excellent insulation material known to date, but it is inflexible and has very low strength. A blanket containing aerogel in a nonwoven fabric or fiber is currently the most practical form. However, aerogel blankets are not yet widely used because they cannot avoid dust generation when handled, lack flexibility, and can possibly deform. In this study, vacuum treatment, surface treatment, and composite materialization technology were applied to solve this problem, and some prototypes were also made. If an aerogel blanket is wrapped in an aluminum sheet, sealed at the four ends, and vacuumed, it can become a material with better insulation than the blanket itself. An aerogel molded body can be made by coating the aerogel blanket with resin and treating the surface. If the aerogel blanket is multi-packed and laminated with resin or fiber in multiple layers to make it a composite material, it can be used as a flexible insulation material. In particular, this composite material, which utilizes a Teflon membrane with controlled pores, is breathable and waterproof, so it can be used for clothing. Prototypes of insoles for winter boots and outdoor roll mats were also produced using aerogel blanket resin and fiber composites. These prototypes showed low thermal conductivity of less than 20 mW m^-1K^-1, with good flexibility and durability.